Zoran and Joo's presentation from YOW! Connected (17-18 September 2015) on How to Build Hardware Lean.

1. How to Build Hardware Lean
By Joo Aun Saw and Zoran Angelovski
YOW! Connected

2. Who we are?
Our background (combined):
§ Telecoms, Smart Energy, IoT.
§ DiUS.
§ Products.
§ Current.
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3. Our talk
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$
Starter Kits / SBC
Production
Module
Evaluation
Module
NRE
Per Unit Cost
Chip Level
1 - 3
3 - 10
10 – 500(?)
Prod

4. Building hardware
§ What you needed – yesterday.
§ How it was done – yesterday.
§ How it is done – today.
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5. What you needed - yesterday
Capabilities:
§ Specialist skills and tools.
What was ‘hardware’:
§ Discrete → some level of integration.
§ Complex PCB.
§ Equipment was expensive.
Barriers were higher but still doable.
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6. How it was done - yesterday
§ Assembling a prototype.
§ Bread board.
§ Your own PCB.
§ Buy parts.
§ Time consuming.
Barriers were higher but still doable.
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7. How it is done - today
§ SoC’s, Eval Modules, Starter Kits
(+Breakout boards) and Prod
Modules.
§ Lower Cost and availability.
§ Tools and building.
Cypress PSoC® is the world's first
programmable embedded system-on-chip
integrating configurable analog and digital
peripheral functions
Arduino Uno Starter Kit
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Breakout Board

8. From concept to proof-of-value
§ What is available today?
§ Which approach and why?
§ Exploring opportunities.
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9. What is available today?
Open source kit, SBC → Custom design:
§ Arduino, Rasp Pi with breakout boards.
§ Evaluation modules (most chip vendors).
§ Schematic and layout (Eagle, KiCAD).
§ Parts (Digi-Key, Mouser, Element14).
§ PCB (OshPark).
§ Mechanical - print your own.
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10. Leverage specialists
Engage partners directly and indirectly:
§ Industrial design.
§ RF / analogue circuit.
§ Dangerous voltages (240V).
…leverage your partners’ expertise.
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11. Which approach and why?
ESI / IoT gateway:
§ Proof-of-Value.
§ Direct to PCB.
§ Mechanical.
PowerVu:
§ Why did we choose a partner?
§ Specialist hardware, industrial design.
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12. Exploring opportunities
Project:
Multispectral Imaging for Agriculture
Status:
Proof-of-Concept
§ Minimised commitment.
§ Proof-of-Value.
§ Business case.
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13. Experimenting with hardware
Over to Joo…
§ Different levels of experimentation.
§ Before you start.
§ Case study.
§ Issues to consider.
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14. Different levels of hardware
experimentation
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15. Before you start
Consider:
§ Why, what, where?
§ How many?
§ Tools?
§ Skills?
§ Software stack and licensing?
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$
NRE
Per Unit Cost

16. Multispectral imager
Low cost high resolution multispectral imager.
Challenges:
§ First airborne device, inexperience.
§ Unproven hardware and software.
§ Size and weight constraints.
§ Difficult to test (highly dependent on weather).
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17. Multispectral imager (the lean way)
§ Defer custom PCB.
§ Don’t reinvent the wheel.
§ Iterate.
§ Test cycles.
§ UX (User Experience).
1st prototype:
3rd prototype:
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18. Issues to consider
Experimentation
Production
Work Environment – smells and fumes,
noise, common sense – 240V.
ü
ü
Certification - ZigBee, USB, Wi-Fi.
? ü
ü
Safety and Regulatory - EMC, RCM
(regulatory compliance mark), CASA
certificate.
?
ü
Parts - EoL, hard to get, changes in spec.
ü
ü
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19. Lastly…
§ Some words about manufacturing.
§ What’s the opportunity for business?
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20. Experimenting à Manufacturing
Here you have to do more that just the fun stuff…
…get the factory and partners involved early
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Process
Regulatory
approvals
Leadtimes
Procurement
Records
Revision control
Components
Changes
Alternative Parts
Warranty

21. What’s the opportunity for business?
§ Explore Opportunities.
§ Our brand.
§ Consultancy service.
§ Dedicated development team.
§ Product range.
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22. DiUS product range
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Smart Energy
ChargeIQ
Smart Energy ESI
(Software)
Sensor / IoT
Local Smoke Alert
Presentation
Cloud Based Data Service
LiveVu

23. Get in touch
e. zangelovski@dius.com.au
e. jasaw@dius.com.au
@dius_au
Linkedin.com/company/dius-computing
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