The new IMI Labs service bridges this gap, opening up the IMI high-throughput experimentation platform, materials expertise and analytics to the industry to accelerate and de-risk the exploration, discovery, characterization and selection of advanced materials

1. IMI Labs
Semiconductor Applications
June 20, 2016

2. Materials Are At the Core of Innovation
in the 21st Century
2
Weight
Space
Flexibility
Heat Management
Lightweight
Energy Efficient
Lightweight
Energy Efficient
Temperature
Energy Efficient
Smart Buildings
Performance
Power
Cost
Scaling

3. Risk management
of new materials
The Materials Innovation Problem
3
Many options, one
experiment at a time
Limited R&D infrastructure
for experimentation
Materials
innovation
is complex, costly
and slow
Long learning
cycle times
Empirical approach
needed
Manufacturing environment
is adverse to change

4. Trusted Partner For Materials Innovation
4
IMI
World-class
interdisciplinary team
Serving large markets
where new materials are key
Unique high-throughput
experimentation platform
Top memory semiconductor
manufacturers are customers
State-of-the art development
facility and characterization
Fast
Facts
Nasdaq:
IMI
CEO:
Bruce McWilliams
2015 Revenue:
$45.3M

5. Product Lines
IMI Discoveries
• Licensed Products
IMI Labs
• Materials Innovation as a Service
• DRAM - Non Volatile Memory - Logic
5

6. Materials Innovation As A Service
6
INVESTMENT
Government
& Universities
Private
Sector Product
Manufacturers
GAP
Reproducibility
Data quality
Experimentation
Transfer to production
Credit: Jack Hu/NIST

7. Closing The Gap in the Ecosystem
7
CUSTOMERS
Academia/Consortia
Government
Equipment and Materials
End-products

8. Growing Complexity & Cost of Semiconductor
8
Source: Intel
0
500
1,000
1,500
2,000
$Millions
0.13 90nm 65nm 45nm 32nm 22nm 14nm
Process Technology Development Costs By Node
Source: Common Platform & All Partners Analysis
• Advanced materials are key to the
Semiconductor roadmap and leadership
• Since 2000s, 50 materials, often in complex
compound or stacks were developed
• Early identification of suitable materials is a
significant advantage
“New material selection and evaluation was
one of the hardest parts of 14 nanometer logic
development.”
Dr. Sanjay Natarajan, Former Intel VP and
14nm Program Manager

9. Next Wave of Semiconductors
9
DRAM
• 1Y/1Z nm
• MIM Capacitors stack
• High-K dielectrics
• Barrier Electrodes
• 4F2 cell
Memory
NAND
• 3D
• Charge Storage layers
• Band engineered
stack
• Electrodes
New materials like Chalcogenides
Not a single materials but combined stacks
New elements interfacing with multiple layers
Multiple stringent specs to meet – Low leakage, performance, nanoscale
Modeling is limited and empirical data are required
Limited R&D infrastructure
Enormous risks in bringing new materials in expensive production Fabs
7nm and beyond
• High mobility Channel
• Embedded NV memory
• Low resistance contacts
• Beyond CMOS: Spin/
Tunnel FET
Logic
Facing Significant Materials Challenges
Storage Class Memory
• Architecture
• Selector ION/IOFF
• Phase change material
• R Memory element
• 10nm conductors
Courtesy of Dr. Scott E. Thompson

10. Semiconductor Materials Challenges
10
Example : High K Dielectric Materials Challenges
Yim et al., NPG Asia Materials (2015) 7, e190;
doi:10.1038/am.2015.57
Example: Universal Memory
L.Perniola et al., IMW2016
Source: IBM JVSTB_2014
“You are going to see an explosion of materials in memory,” said
Gregg Bartlett, senior VP and CTO of GLOBALFOUNDRIES,
SEMI SMC 2013
Source :ASM 2015, IMI
“The industry is facing major challenges ranging from architecture choices to materials selection.
The next wave of semiconductors will require inventing over 40 materials.”
Dr. Scott E. Thompson, IEEE Fellow, U. Florida
2D
Chalcogenides
STT-RAM

11. IMI LABS
IMI Labs Flexible Offering
11
SCAN SEARCH STUDY SOLVE
Standard Services Custom Services
Quick mapping of
materials composition
Rule in / rule out
Explore multiple
materials for a
given application
More complex,
more data
Customer directed
exploration of materials
IMI delivers to
customer’s
specifications
FAST TURN VALUE ADDED EXPERTISE

12. Unique Development Platform
12
High throughput experimentation accelerates and de-risks materials innovation
Materials
Expertise
Accelerated
Experimentation
Analytics
Excellence
130+ engineers
and scientists
65% advanced degrees
Application knowledge
Understanding of
integration issues

13. Benefits of High-Throughput Experimentation
13
Experiments per Wafer
Experimental Efficiency
Material & Process Options
 One
 Limited
 Few
Conventional
Optimized for Materials UnderstandingOptimized for Manufacturing
Experiments per Wafer
Experimental Efficiency
Material & Process Options
 10 to 100
 High
 Many

14. Capabilities In Place For Materials Understanding
14
FACILITY
Cleanroom
Controlled
Process
Flow
CHARACTERIZATION
Composition
Mechanical
Electrical
Optical
DEPOSITION
PVD*
ALD*
WETS
Integration
MATERIALS
Metal Oxides and Nitrides
Metal Alloys
Chalcogenides
*PVD Physical Vapor Deposition
ALD Atomic Layer Deposition

15. IMI Labs Semiconductor Uses Cases
15
Capacitor cell development and characterization
• Screen and optimize material systems for MIM
Capacitors
• PVD and ALD based evaluation of several different
dielectrics, electrodes, or interlayer materials in a
MIM capacitor film stack
• PVD co-sputtering combined on a cluster platform
with other PVD, ALD and anneal chambers
• Extensive physical and electrical characterization
• Dielectrics, electrode materials and interface layers
NVM cell and selector devices
• Screen and optimize metal-oxide, MIEC, or OTS
(phase-change) material systems for non-
volatile memory
• PVD based evaluation of multi-nary materials (> 5
elements) and metal/metal nitride electrodes.
• PVD co-sputtering with multiple, composite PVD
targets
• Extensive physical and electrical characterization
• Chalcogenide & metal-oxide switching layers and
metal/nitride electrodes
Memory Use Cases
High-Throughput Experimentation - New Materials for Devices
DRAM Non Volatile Memories

16. Expansion of Capabilities
16
Expand
-Materials-
-Process-
-Characterization-
Semiconductor
• Memories
• Logic
Optical coatings
• Displays
• Architectural
Glass
Alloys
Consumer
Industrial
Automotive
Aerospace

17. Summary
• Materials are at the core of innovation in
the 21st century
• Materials innovation is complex, costly
and slow
• There is a gap between the data
produced by academia and government,
and the need to scale new materials to
production by product companies
• Experimentation is key to materials
understanding. The entire innovation
ecosystem needs a materials innovation
platform and associated expertise to
generate reproducible, high quality data in
a flexible way
• The next wave of semiconductors rely on
new and complex materials
17
• The new IMI Labs service bridges this gap,
opening up the IMI high-throughput
experimentation platform, materials expertise
and analytics to the industry to accelerate and
de-risk the exploration, discovery,
characterization and selection of advanced
materials
• The first offering, IMI Labs - Semiconductor,
showcases use cases for DRAM and Non-
volatile Memory applications
• IMI Labs continues to expand capabilities in
other areas such as Logic, Optical Coatings,
Automotive and Aerospace
• IMI’s mission is to be the industry’s trusted
partner for advanced materials innovation