Aerospace high-temperature structural adhesive
Epibond® 100 A/B is a
two component, extrudable, heat curing
epoxy structural adhesive.
Epibond® 100 A/B is designed for demanding
applications requiring high hot/wet Tg,
elevated temperature performance and the
retention of lap shear strength.
Epibond® 100 A/B is off white in color when mixed and
spreads easily with a spatula or trowel while spacer beads
allow bond lines characterized by high precision thickness.
Applications in aerospace
> rimary and secondary bonding of composites and dissimilar
ecommended for carbon fiber, glass reinforced composite,
PEEK and aluminum
oderate heat cure cycle: 1h at 65°C + 5h at 95°C
igh lap shear strength / retains 75% at 90°C
High Tg / retains 94% after wet ageing
Service temperatures up to 150°C
Long working time of 100-120 minutes
No SVHC as defined under REACH
2:1 mix ratio, dual barrel cartridge pack sizes