1. Final Examination Jun 2016
Section A, Question 1-a,b & c
Layvee Robin- 07DEP14F2028
Muhd Yusri Bin Fandi-07DEP14F2029
Andy Marinus-07DEP14F2011
Arion Daniel George-07DEP14F2007
Muhd Amalul Arifin Bin Jonol -07DEP14F2038
2. State TWO(2) prediction made by Gordon E. Moore
to increase the productivity ,cheap and powerful
computing.
Answer:
The number of transistors in a dense integrated
circuit doubles approximately every two years.
The forecast to doubling every two years
3. Integrated circuit (IC) can be classified into THREE (3)
categories which are fabrication method, transistor
type and circuit function. Explain integrated circuit
(IC) based on the circuit function.
Answer:
-Digital IC
The integrated circuits that operate only at a few
defined levels instead of operating over all levels of
signal amplitude are called as Digital ICs.
These ICs using multiple number of digital logic
gates, multiplexers, flip flops and other electronic
components of circuits.
4. -Analog IC
The integrated circuits that operate over a
continuous range of signal are called as Analog ICs.
These are subdivided as linear Integrated Circuits
(Linear ICs) and Radio Frequency Integrated Circuits
(RF ICs).
5. Differentiate between the THREE(3) MEMS fabrication
process(Bulk micromachining, surface
micromachining, LIGA).
Answer:
i. Bulk micromachining
Bulk micromachining is a fabrication technique which
builds mechanical elements by starting with a silicon
wafer, and then etching away unwanted parts, and
being left with useful mechanical devices.
The small size and high reliability of micromachined
pressure sensors make them ideal for a variety of
medical applications.
6. ii. Surface macromaching
Surface Micromachining process is a repetitive
sequence of depositing thin films on a wafer,
photopatterning the films, and then etching the
patterns into the films.
Surface Micromachining requires more
fabrication steps than Bulk Micromachining, and
hence is more expensive
iii. LIGA
LIGA is a technology which creates small, but
relatively high aspect ratio devices using x-ray
lithography
relatively inexpensive fabrication technology, and
suitable for applications requiring higher aspect
ratio devices than what is achievable in Surface
Micromachining.
