Oracle SPARC T7 a M7 servery

Copyright © 2015, Oracle and/or its affiliates. All rights reserved. |
Oracle’s SPARC T7 and M7
Servers
New Platform for Secure Computing
Petr Slačík
Oracle Systems Sales Consulting
petr.slacik@oracle.com

Safe Harbor Statement
The following is intended to outline our general product direction. It is intended for
information purposes only, and may not be incorporated into any contract. It is not a
commitment to deliver any material, code, or functionality, and should not be relied upon
in making purchasing decisions. The development, release, and timing of any features or
functionality described for Oracle’s products remains at the sole discretion of Oracle.
3

Today2000s1990s
Realize the full potential of new hardware technology today
Breakthrough Hardware and Software Delivered Together
Software Functions on Chip
Oracle’s Software
in Silicon
64-bit Computing Multicore,
Multithread
HW SWHW SW
Hardware and Software
Available Together
Open Systems Virtualization
and Cloud
4

6 Processors in 5 Years
Oracle’s Microprocessors
201320112010 2013 2013 2015
16 x 2nd Gen cores
4 MB L3 Cache
1.65 GHz
8 x 3rd Gen Cores
4 MB L3 Cache
3.0 GHz
16 x 3rd Gen Cores
8 MB L3 Cache
3.6 GHz
12 x 3rd Gen Cores
48 MB L3 Cache
3.6 GHz
6 x 3rd Gen Cores
48 MB L3 Cache
3.6 GHz
32 x 4th Gen Cores
64 MB L3 Cache
4.13 GHz
SPARC T3 SPARC T4 SPARC T5 SPARC M5 SPARC M6 SPARC M7
Including
Software in Silicon
• Silicon Secured Memory
• Encryption Acceleration
• Query Acceleration
• More…
}
Today
5

Copyright © 2015, Oracle and/or its affiliates. All rights reserved. | 6
Oracle SPARC Processor Roadmap

SPARC M7 Processor Overview
• Software in Silicon Acceleration
– Silicon Secured Memory
– Encryption
– In-Memory Query Acceleration
– Inline Data Decompression
• 32 Cores @ 4.133 GHz
• 256 HW Threads per Processor
• Dynamic Threading supporting Critical Threads
• Up to 16 of DDR4 Memory DIMMs per Processor
• Up to 8-way Fully Connected Glueless SMP
• Up to 16-way SMP with Switch ASICs
• Technology: TSMC 20nm, 13ML
• Oracle Core SW core factor 0.5
7

Key improvements in microprocessor capability
Pressing the State of the Art
SPARC T5 SPARC M7 Improvement
More Cores 16 32 2X
More Threads 128 256 2X
Larger Cache per Core 0.5 MB 2 MB 4X
More Memory Bandwidth 79 GB/s 160 GB/s 2X
Faster Memory Access 163 ns 131 ns +20%
More I/O Bandwidth 32 GB/s 145 GB/s 4X
Faster Processor Frequency 3.60 GHz 4.13 GHz +15%
8

SPARC M7 Processor-Based Servers
• SPARC M7 Processor: Software in Silicon, New Core
• DDR4-2133 Memory: Faster and lower power consumption
• DIMM Sparing: Standard feature for higher availability
• NVMe Flash Drives for high performance
• x16 capable PCIe 3.0 slots: More I/O Throughput
• 2x more PCIe buses per processor for higher availability
• On-board SAS3 with 2x throughput (for T7-1,-2,-4)
• Solaris 11.3 or later required
– Solaris 10 9/10 and later in Guest Domains
Common Characteristics
9

• Up to 8 processors directly connected
(glueless)
• Scaling beyond 8 sockets with the
directory/switch ASIC (glued)
• Dynamic congestion avoidance for
data
• Coherence and Scalability Links
• Link Level RAS in hardware
– CRC check and automatic message retry
– Automatic lane retire (per direction)
– Automatic link retrain and reinitialization
– Built in PRBS testing during link training
SPARC M7 SMP Scalability
10

More Memory Bandwidth
SPARC M7 vs. IBM Power8 SPARC M7 vs. x86 E5 v3
Local Memory SPARC M7 is 2x faster SPARC M7 is 3x faster
Remote Memory SPARC M7 is 4x faster SPARC M7 is 4x faster
Oracle
M7
Local
Memory
168 GB/s
M7
Remote
Memory
111 GB/s
IBM
Power8
Local
Memory
73 GB/s
Power8
Remote
Memory
30 GB/s
X86
E5 v3
Local
Memory
57 GB/s
E5 v3
Remote
Memory
27 GB/s
• Modern computers connect memory directly to each processor
• When architecture is unbalanced, access to remote memory is much slower than local
11

DIMM Sparing
• Automatic retirement of a memory DIMM that is potentially failing
• Used in presence of correctible errors, protects the system against potential future hard failures
• Retirement is done dynamically while the system is running
• Memory capacity remains unchanged and error protection intact
• In a fully populated memory configuration, 1/16 of each memory DIMM is reserved to be used for
isolating one entire DIMM from the configuration
• One of the 16 DIMMs can be remapped into each of the other 15 DIMMs
Increased Availability and Reliability
12

Copyright © 2015, Oracle and/or its affiliates. All rights reserved. |Copyright © 2015, Oracle and/or its affiliates. All rights reserved. |
New Platform for Secure Computing
With Oracle’s Software in Silicon architecture
Security in Silicon
Wide key encryption and Silicon
Secured Memory
Breakthrough hardware SQL
acceleration and decompression for
Oracle Database In-Memory
SQL in Silicon
More cores, more threads, more bandwidth, lower latency –
Extreme performance for apps and cloud
World’s Fastest
Microprocessor
13

Hardware Accelerated Cryptography
32 Crypto Accelerators with the broadest set of ciphers
Clear Data In
Encrypted Data Out
14

SPARC’s Long-Term Investment in Security
2005 2007 2010 2011
SPARC T1
SPARC T2
SPARC T3
SPARC T4, T5,
M5, M6
RSA
DSA
AES
DES 3DES
DSA
ECC
MD5
RC4
RSA SHA-1
SHA-256
AES
CRC32c DES
3DES
DH
DSA
ECC
Kasumi MD5
RSA SHA-1
SHA-256
SHA-384
SHA-512
AES Camellia
CRC32c DES
3DES
DH
DSA
ECC
Kasumi MD5
RSA SHA-1
SHA-224
SHA-256
SHA-384
SHA-512
2011-2015
Ten years of hardware accelerated encryption
15

SPARC M7 advantage increases on highest security ciphers
Much Faster End-To-End Encryption
SPARC M7
32 cores
IBM Power8
6 cores
Intel X86 E5 v3
18 cores
4x Faster vs.
X86
11x Faster vs.
IBM Power
AES 128-CBC: Popular for Cloud, DB
SPARC M7
32 cores
IBM Power8
6 cores
Intel X86 E5 v3
18 cores SHA 512-1024: Important for Banking Operations
83 GB/s
22 GB/s
8 GB/s
84 GB/s
4.7 GB/s
2.4 GB/s
18x Faster vs.
X86
35x Faster vs.
IBM Power
16

Oracle Database 12c Breakthrough: Dual Format Database
• BOTH row and column
formats for same table
• Simultaneously active and
transactionally consistent
• Analytics and reporting use
new in-memory column
format
• OLTP uses proven row format
Memory Memory
SALES SALES
Row
Format
Column
Format
SALES
17

SQL In Silicon: In-Memory Query Acceleration
SPARC M7
Cache
SQL
Accel
SQL
Accel
SQL
Accel
SQL
Accel
Core Core Core Core
• Dedicated SQL accelerators built on chip
– Independently process streams of compressed
data placed in system memory
– Like adding 32 additional specialized cores to chip
– Up to 170 Billion rows per second!
• Frees processor cores to run other
applications, such as OLTP
• Decompresses data simultaneously to
processing SQL functions
– Like adding 64 additional specialized cores
18

DAX: Data Analytics Accelerator
SPARC M7 In-Memory Database Advantages
• Industry-leading SPARC M7 memory bandwidth
• DAX decompresses data at same rate as scan-only
• DAX performs one-step scans, range scans, and assists Bloom filter joins
SQL:
select sum(lo_extendedprice*lo_discount) as revenue
from lineorder, date_dim
where lo_orderdate = d_datekey and
d_year = 2012 and
lo_quantity between 6 and 25 and lo_discount between 1 and 3
Processes:
Decode values (DAX) & Sum aggregation (cores)
Hash Joins (cores)
Bloom Filter Joins (DAX & cores)
Scans (DAX)
Range Scans (DAX)
19

Decompress at memory speed >120 GB/sec
SQL In Silicon: Accelerating Oracle Database 12c
One
step 10Xfaster
Decompress
More than Doubles data size
Read
Software
scan
Read
Write
Write
Read
DAX
Write
Multiple
steps
SQL:
SELECT count(*)
…WHERE lo_orderdate = d_datekey
…AND lo_partkey = 1059538
AND d_year_monthnum BETWEEN 201311 AND 201312;
t
20

Fast analytics for real-time decision making
SQL In Silicon
SPARC T7-1 Single-Chip Server
32 Cores
363 Queries/min per Chip
5 x HP ProLiant DL380 G9
2-Chip Servers
180 Cores
33 Queries/min per Chip
1 TB Database compressed into 160 GB of memory
5x Faster
In-Memory
Query and Analytics
5x Fewer Servers
10x Fewer Chips
21

How you can use Software in Silicon with Oracle DB
• In-Memory Query Acceleration and Inline Decompression only available
with “In-Memory Option”
• Oracle DB 12.1.0.2 BP7 + Solaris 11.3 or later required
• DB 12.1.0.2 BP13 (Oct 2015) recommended
• Oracle Applications certified for DB 12c supports DAX
– Performance will be application specific
– Internal workloads have been heavily optimized with indexes over time
– More Opportunities with Customer DB
In-Memory Query Acceleration and Inline Decompression (DAX)
22

Solaris and SPARC Virtualization
No-cost Virtualization for a More Efficient Datacenter
Physical Domains (PDoms)
Oracle VM Server
for SPARC (LDoms)
M-series T-Series
Oracle Solaris
Containers/Zones
Oracle Solaris
Domain A
Web
Oracle Solaris
Domain A
Domain C
App
App
Domain B
Web
Web
Solaris8Container
DB
Solaris9Container
App
SolarisContainer
Web
SolarisContainer
Domain A
Domain B
OLTP DB
OLTP DB
DW DB
App App

SPARC T7-1, T7-2, and T7-4 Servers: Availability Features
Redundant, hot-swappable
power supplies
cooling fans
Hot-pluggable I/O
adapters (SPARC T7-4)
Hardware RAID 0, 1, 10, and
1E integrated in disk
controller
SDRAM error protection, message
retry in hardware, lane retire in
hardware, cyclic redundancy check
(CRC), and DIMM sparing
ZFS with software RAID 5,
6, and 10 for file system
resilience Multiple PCIe root complexes
for isolated I/O virtualization
Power-On Self-Test
Independent power domains
on processor modules (SPARC
T7-4)
Dual integrated SAS HBAs or
NVMe PCIe switches for drive
isolation (SPARC T7-2 and T7-4)
Hot-pluggable drives
Front and rear system
indicator LEDs
Redundant I/O controllers
with MPxIO for storage devices
and IPMP for network devices
24

SPARC M7-8 and M7-16 Servers: Availability Features
cooling fans
Hot-pluggable I/O adapters
Redundant, hot-serviceable
SPs with automatic failover
Distributed, independent
and redundant clocking
Isolated PDoms
Dedicated PCIe buses for every
slot for isolated I/O virtualization
CRC protected systems
interconnect with message retry
and lane sparing in hardware
ZFS with software RAID 5, 6, and
10 for file system resilience
Interconnect: SEC/DED
protection with inline correction Redundant, hot-swappable power
supplies, dual grid power input
Redundant I/O controllers
with MPxIO for storage devices
and IPMP for network devices
Redundant and reconfigurable
interconnect switch ASICs
Redundant DC power on CMIOU
boards, CPU module, and switch unit
25
SDRAM error protection, message
retry in hardware, lane retire in
hardware, cyclic redundancy check
(CRC), and DIMM sparing

* Best 2-chip result
SPECjEnterprise * PeopleSoft HR+Payroll
SPECcpu rates 1-chip (four benchmarks) PeopleSoft HR-only
SPEComp PeopleSoft Batch-only
SPECvirt2013 * PeopleSoft FMS Batch
Java Workload FLEXCUBE UBS
SAP-SD Oracle Communications ASAP Telco
E-Business Online
E-Business Order-to-Cash Batch In Memory Aggregation
E-Business Payroll Batch NoSQL YCSB
Oracle Internet Directory Graph
Oracle Stream Explorer R statistics
SPARC M7: Setting 20 World Records in Performance
26

1.9x
1.9x
2.0x
1.9x
2.1x
2.1x
2.6x
2.5x
2.7x
4.0x
3.1x
2.4x
4.0x
General App+DB
Secure Cloud App+DB
Big Data / Mining
In Memory DB
10.8x
8.3x
Hadoop
Graph
NoSQL
R Statistics
In Memory Queries
Real Time Enterpise
In Memory Aggregation
Business Intelligence
Security
Virtualization 4-chip
Virtualization 2-chip
Java + DB
Java
PeopleSoft
ERP
2x to 4x Faster per Chip than Leading x86 E5 v3
27

World record SPECjEnterprise result
Breakthrough Secure Computing
25,093.06
EjOPS
SECURE
22,543.34
21,504.30
2 x IBM S824
8 x Power8
6 core
2 x X86 Server
4 x E5 v3
2 x SPARC T7-1
2 x chips
EjOPS
EjOPS
Database & Network Encrypted
Unprotected Everywhere
Unprotected Everywhere
28

SPARC T7 and M7 System Beta Success
29

(1) Factory configured with one (up to 8 processors) or two (up to 4 processors each) static physical domains
(2) 1, 2, 3 or 4 reconfigurable physical domains
SPARC T7 and M7 Servers
T7-1 T7-2 T7-4 M7-8 M7-16
Processors 1 2 2 or 4 Up to 8 Up to 16
Max Cores 32 64 128 256 512
Max Threads 256 512 1,024 2,048 4,096
Max Memory .5 TB 1 TB 2 TB 4 TB 8 TB
Form Factor 2U 3U 5U Rack / 10U Rack
Domaining LDOMs LDOMs LDOMs LDOMs, PDOMs 1 LDOMs, PDOMs 2
30

SPARC T5-2 SPARC T5-4 SPARC T5-8
Processor
SPARC T5
3.6GHz
SPARC T5
3.6GHz
SPARC T5
3.6GHz
Max Processor Chips 2 4 8
Max Cores/Threads 32, 256 64, 512 128, 1024
DIMM Slots 32 64 128
Max Memory 256GB, 512GB, 1TB 1TB or 2TB 2TB or 4TB
Drive Bays 6 8 8
I/O Slots
8 LP x8 PCIe 3.0,
4 x 10GbE ports
16 LP x8 PCIe 3.0,
4 x 10GbE ports
16 LP x8 PCIe 3.0,
4 x 10GbE ports
Form Factor/RU Rack 3RU Rack 5RU Rack 8RU
Max Power Consumption 1927W 2410W 4850W
SPARC T5 Servers
Product Line Overview

WorseBetter
Near Linear Pricing
Oracle’s Superior Systems EconomicsPrice/Performance
WorseBetter
Price/Performance
32

SPARC T7-1 Server
System Details
34

SPARC T7-1 Server: Overview
• 2U chassis, fits into 900 mm deep rack
• One SPARC M7 processor (32 cores/256 threads)
• Up to 512 GB of memory
– 8 or 16 DIMMs, 16 GB or 32 GB each
• Eight 2.5” SFF disk drive bays
– Up to 8 hot-swappable SAS HDDs/SSDs
– Up to 4 hot-pluggable NVMe SSDs
– Mixing SAS and NVMe drives supported
• One onboard SAS3 HBA (hardware RAID 0/1/10/1E)
• One optional NVMe PCIe switch card (factory-installed)
• Four 10GBASE-T ports (two onboard dual-port NICs)
• 6 low-profile PCIe 3.0 x8 slots, or 2 x16 + 2 x8 slots (4 PCIe buses)
• Front-load DVD drive
• Local (front and rear USB, rear video) and remote KVMS
• Four hot-pluggable redundant fan modules (top loading)
• Two 1,000 W (output) hot-pluggable power supplies (1+1)
35

SPARC T7-1 Versus SPARC T5-2 (1P) and SPARC T4-1
Feature SPARC T7-1 SPARC T5-2 (1P) SPARC T4-1
Form Factor 2U, 737 mm (29”) deep 3U, 732 mm (28.8”) deep 2U, 715 mm (28.1”) deep
Processor
1x 4.13 GHz SPARC M7, 32 cores,
(32 cores, 256 threads)
1x 3.6 GHz SPARC T5, 16 cores,
1x 2.85 GHz SPARC T4, 8 cores
Memory
DDR4-2133, 16x slots,
Max. 512 GB w/ 32 GB DIMMs
Integrated Network Ports 4x 10GBASE-T 4x 10GBASE-T 4x 1000BASE-T
Internal Storage
8x 2.5” hot-pluggable SFF bays
8x SAS 3.0 HDD and/or SSD, 4x NVMe SSDs
6x SAS 3.0 HDD or SSD
Removable Media DVD drive DVD drive DVD drive
Management Ports
1x Serial (RJ-45), 1x 100BASE-T,
1x VGA (HD-15)
1x VGA (HD-15)
1x VGA (HD-15)
USB Ports 2xUSB 2.0, 2x USB 3.0 2xUSB 2.0, 2x USB 3.0 4xUSB 2.0
PCI Express Slots
6x PCIe 3.0 (x8) low-profile slots,
or 4x PCIe 3.0 slots, 2 (x16) and 2 (x8)
8x PCIe 3.0 (x8) low-profile slots 6x PCIe 2.0 low-profile slots
Fans
4x redundant hot-swappable dual fan
modules
6 x redundant hot-swappable fans
6x redundant hot-swappable dual fan
modules
Power Supplies (Nominal Output) 2x 1000 watt AC, 1+1 2 x 2000 watt AC, 1+1 2 x 1200 watt AC, 1+1
36

SPARC T7-2 Server
System Details
37

• 3U chassis, fits into 900 mm deep rack
• Two SPARC M7 processors (64 cores/512 threads)
• Up to 1 TB GB of memory
• Six 2.5” SFF disk drive bays
– Up to 6 hot-swappable SAS HDDs/SSDs
– Up to 4 hot-pluggable NVMe SSDs
• Dual onboard SAS3 HBAs (HW RAID 0/1/10/1E)
• One or two optional NVMe PCIe switch cards (factory-installed)
• 8 low-profile PCIe 3.0 slots, 4 x16 + 4 x8 (8 PCIe buses)
• Front-load DVD drive
• Six hot-swappable redundant fan modules (top loading)
• Two 2,000 W (output) hot-swappable power supplies (1+1)
38

SPARC T7-2 Versus SPARC T5-2
Feature SPARC T7-2 SPARC T5-2
Form Factor 3U, 753 mm (29.6”) deep 3U, 753 mm (29.6”) deep
Processor
2x 4.13 GHz SPARC M7, 32-cores,
2x 3.6 GHz SPARC T5, 16-cores,
Memory
Max. 1TB w/ 32 GB DIMMs
Integrated Network Ports 4x 10GBASE-T 4x 10GBASE-T
Internal Storage
6x SAS 3.0 HDD or SSD, 4x NVMe SSDs
Removable Media DVD drive DVD drive
Management Ports 1x serial (RJ-45), 1x 100BASE-T, 2x VGA (HD-15) 1x serial (RJ-45), 1x 100BASE-T, 2x VGA (HD-15)
USB Ports 2xUSB 2.0, 2x USB 3.0 2xUSB 2.0, 2x USB 3.0
PCI Express Slots 8x PCIe 3.0 low-profile slots, 4 (x16) and 4 (x8) 8x PCIe 3.0 (x8) low-profile slots
Fans 6x redundant hot-swappable fans 6 x redundant hot-swappable fans
Power Supplies (Nominal output) 2x 2000 watt AC, 1+1 2 x 2000 watt AC, 1+1
39

SPARC T7-4 Server
System Details
40

• 5U chassis, fits into 1,000 mm deep rack
• Two or four SPARC M7 processors (up to 128 cores/1024 threads)
• Up to 2 TB of memory
• Eight 2.5” SFF disk drive bays
– Up to 8 hot-swappable SAS HDDs/SSDs and/or
hot-pluggable NVMe SSDs
• Dual onboard SAS3 HBA (hardware RAID 0/1/10/1E)
• Two optional NVMe PCIe switch cards*
• 16 low-profile PCIe 3.0 slots, 8 x16 + 8 x8 (twelve PCIe buses)**
• Five hot-swappable redundant fan modules (rear loading)
• Four 3,000 W (output) hot-swappable power supplies (N+N )
41
* Factory-configured or field add-on
** Plus two internal slots for NVMe PCIe switch cards

SPARC T7-4 Versus SPARC T5-4
Feature SPARC T7-4 SPARC T5-4
Form Factor 5U, 31.5” deep 5U, 31.5” deep
CPU
4x SPARC M7
4.13 GHz (1,024 threads)
4x SPARC T5
3.6 GHz (512 threads)
Memory
Integrated Network Ports 4x 10GBASE-T 4x 10GBASE-T
Internal Storage
8x SAS 3.0 HDD or SSD, 8x NVMe SSDs
8 x 2.5” SAS 3.0 HDD or SSD
Removable Media via rKVMS via rKVMS
Management Ports 1x serial (RJ-45), 1x 100BASE-T, 2x VGA (HD-15) 1x serial (RJ-45), 1x 100BASE-T, 2x VGA (HD-15)
USB Ports 4x USB 3.0 4x USB 3.0
PCI Express Slots
16x PCIe 3.0 slots, 8 (x16) and 8 (x8)
Hot-pluggable low-profile slots with card carrier
16x PCIe 3.0 (x8) slots
Fans 5 x redundant hot-swappable dual fan modules 5 x redundant hot-swappable dual fan modules
Power Supplies (Nominal Output) 4 x 3000 watt AC, N+N 2 x 3000 watt AC, 1+1
42

SPARC M7-8 Server
System Details
43

SPARC M7-8 Server: Overview
• Two factory-configured options:
– One static physical domain with up to 8 processors
– Two static physical domains, each up to 4 processors
• 2 to 8 SPARC M7 processors (up to 256 cores and 2,048 threads)
– 8 or 16 DIMMs per processor (16 GB or 32 GB DIMMs)
• Up to 24 PCIe 3.0 (x16) slots
– 3 PCIe slots per processor, dedicated PCIe buses per slot
• Redundant hot-swappable SPs with automatic failover
• Redundant system clocks
• Eight hot-swappable redundant fan modules
• Six 3,000 W (output) hot-swappable power supplies (N+N)
• Power input: 3-phase PDUs, or 1-phase direct
• Factory mounted in a system rack (Oracle’s Sun Rack II 1242)
• Optional: Standalone 10U chassis (1,200 mm deep rack)
44

SPARC M7-8 Versus SPARC T5-8
Feature SPARC M7-8 SPARC T5-8
Form Factor
System rack: 600 mm wide, 1200 mm deep, 2 m (78 2/3”) high
Standalone: 10U, 813 mm (32”) deep chassis; Min. 1,200 mm deep rack
8U, 800 mm (31.5”) deep
Min. 1,000 mm deep rack
Physical Domains 1 or 2 1
Processor SPARC M7, 32 cores, 4.13 GHz SPARC T5, 16 cores, 3.6 GHz
Max. Processors/Cores/Threads 8/256/2048 8/128/1024
Memory DDR4-2133, 128x slots; Max. 4 TB w/ 32 GB DIMMs DDR3-1066, 128x slots; Max. 4 TB w/ 32 GB DIMMs
Integrated Network Ports PCIe NIC cards 4x 10GBASE-T
Internal Storage Up to 16 x Oracle Flash Accelerator F160 PCIe Card, hot-pluggable Up to 8 x 2.5” SAS 3.0 HDD or SSD, hot-pluggable
Removable Media via rKVMS via rKVMS
Management Ports Dual SPs, ports per SP: 1x serial (RJ-45), 1x 100BASE-T 1x Serial (RJ-45), 1x 100BASE-T, 2x VGA (HD-15)
USB ports - 4x USB 3.0
PCI Express Slots
Up to 24x PCIe 3.0 (x16) slots
Fans 8 x redundant hot-swappable dual fan modules 10 x redundant hot-swappable dual fan modules
Power Supplies (Nominal Output) 6 x 3000 watt AC, N+N 4 x 3000 watt AC, N+N
45

SPARC M7-16 Server
System Details
46

SPARC M7-16 Server: Overview
• Reconfigurable: 1, 2, 3, or 4 PDoms
• 4 to 16 SPARC M7 processors (up to 512 cores/4,096 threads)
– 8 or 16 DIMMs per processor (16 GB or 32 GB DIMMs)
• Up to 48 PCIe 3.0 (x16) slots
– 3 PCIe slots per processor
– One dedicated PCIe bus per slot
• Redundant hot-swappable SPs with automatic failover
• Redundant system clocks
• Redundant, hot-swappable fan modules
• Sixteen 3,000 W (output) hot-swappable power supplies (N+N)
• Power input: Dual 3-phase PDUs
• Factory-mounted in Sun Rack II 1242 system rack
47

SPARC M7-16 Versus SPARC M6-32
Feature SPARC M7-16 SPARC M6-32
Form Factor
H: 78.7” (2,000 mm), W: 23.6” (600 mm), D: 47.2” (1,200 mm),
1,670 lbs. (749 kg)
H: 78.7” (2000 mm), W: 35.6” (940 mm), D: 57.1” (1,451 mm),
3,700 lbs. (1,678 kg)
Physical Domains 1, 2, 3, or 4 1, 2, 3, or 4
Processor SPARC M7, 32 cores, 4.13 GHz SPARC M6, 12 cores, 3.6 GHz
Max. Processors/Cores/Threads 16/512/4096 32/384/3072
Memory DDR4-2133, 256x slots, Max. 8 TB w/ 32 GB DIMMs DDR3-1066, 1024x slots, Max. 32 TB w/ 32 GB DIMMs
Integrated Network Ports PCIe NIC Cards Base I/O Cards
Internal Storage Up to 32 Oracle Flash Accelerator F160 PCIe Cards, hot-pluggable Up to 32 x 2.5” SAS HDD or SSD, hot-pluggable
PCI Express Slots
Up to 48x PCIe 3.0 (x16) slots
Redundant, Hot-Swappable Fans
16 x dual fan modules in CMIOU chassis
36 x fan modules in switch chassis
10 x redundant hot-swappable dual fan modules
Power Connections 3-phase/dual grid, total of 6 inputs cables 3-phase/dual grid, total of 6 inputs cables
Power Supplies (Nominal Output) 16 x 3000 watt AC (N+N) 12 x 7100 watt AC (N+N)
48

 ZS3 Mixed-use Storage
• 160 TB (raw) storage for Virtual Machine and system data
 QDR InfiniBand Unified Ultra-fast Network
• 40GB/s QDR InfiniBand IO backplane
 M7 Servers for Databases & Applications
• 1 or 2 M7 Chassis per system (Elastic Configurations)
• 2 Physical Domains per M7 chassis, 1 - 4 processors ea.
• Up to 8TB RAM per rack
 Exadata Storage Servers for Oracle Database
 From 3 to 11 per configuration (Flex. Config.)
 High Capacity (96TB raw disk ea.)
 Extreme Flash (12.8TB raw flash ea.)
SuperCluster M7: Hardware Architecture
2/26/2016 49
SuperCluster M7
2/26/2016

Scale Further to
Multi-Rack
(3) Exadata
Storage
Servers
(1) ZS3 Storage
Appliance
(2) InfiniBand
leaf switches
(1) InfiniBand
spine switch
2/26/2016 50
Low Cost Elastic Capacity on Demand
SuperCluster M7: Elastic Configurations
M7 Chassis,
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Extreme Flash Storage
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3
1
2
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The world’s most advanced systems for
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SPARC M7 Processor–Based Systems
51

Benchmark Disclosure Statement
• Copyright 2015, Oracle &/or its affiliates. All rights reserved. Oracle & Java are registered trademarks of Oracle &/or its affiliates. Other names may be trademarks of their
respective owners
• SPEC and the benchmark name SPECjEnterprise are registered trademarks of the Standard Performance Evaluation Corporation. Results from www.spec.org as of 10/25/2015.
SPARC T7-1, 25,818.85 SPECjEnterprise2010 EjOPS (unsecure); SPARC T7-1, 25,093.06 SPECjEnterprise2010 EjOPS (secure); Oracle Server X5-2, 21,504.30 SPECjEnterprise2010
EjOPS (unsecure); IBM Power S824, 22,543.34 SPECjEnterprise2010 EjOPS (unsecure); IBM x3650 M5, 19,282.14 SPECjEnterprise2010 EjOPS (unsecure).
• SPEC and the benchmark name SPECvirt_sc are registered trademarks of the Standard Performance Evaluation Corporation. Results from www.spec.org as of 10/25/2015. SPARC
T7-2, SPECvirt_sc2013 3026@168 VMs; HP DL580 Gen9, SPECvirt_sc2013 3020@168 VMs; Lenovo x3850 X6; SPECvirt_sc2013 2655@147 VMs; Huawei FusionServer RH2288H
V3, SPECvirt_sc2013 1616@95 VMs; HP ProLiant DL360 Gen9, SPECvirt_sc2013 1614@95 VMs; IBM Power S824, SPECvirt_sc2013 1371@79 VMs.
• SPEC and the benchmark names SPECfp and SPECint are registered trademarks of the Standard Performance Evaluation Corporation. Results as of October 25, 2015 from
www.spec.org and this report. 1 chip resultsSPARC T7-1: 1200 SPECint_rate2006, 1120 SPECint_rate_base2006, 832 SPECfp_rate2006, 801 SPECfp_rate_base2006; SPARC T5-1B:
489 SPECint_rate2006, 440 SPECint_rate_base2006, 369 SPECfp_rate2006, 350 SPECfp_rate_base2006; Fujitsu SPARC M10-4S: 546 SPECint_rate2006, 479
SPECint_rate_base2006, 462 SPECfp_rate2006, 418 SPECfp_rate_base2006. IBM Power 710 Express: 289 SPECint_rate2006, 255 SPECint_rate_base2006, 248 SPECfp_rate2006,
229 SPECfp_rate_base2006; Fujitsu CELSIUS C740: 715 SPECint_rate2006, 693 SPECint_rate_base2006; NEC Express5800/R120f-1M: 474 SPECfp_rate2006, 460
SPECfp_rate_base2006.
• SPEC and the benchmark name SPEC OMP are registered trademarks of the Standard Performance Evaluation Corporation. Results as of October 25, 2015 from www.spec.org and
this report. SPARC T7-4 (4 chips, 128 cores, 1024 threads): 27.9 SPECompG_peak2012, 26.4 SPECompG_base2012; HP ProLiant DL580 Gen9 (4 chips, 72 cores, 144 threads): 21.5
SPECompG_peak2012, 20.4 SPECompG_base2012; Cisco UCS C460 M7 (4 chips, 72 cores, 144 threads): 20.8 SPECompG_base2012.
• Two-tier SAP Sales and Distribution (SD) standard application benchmarks, SAP Enhancement Package 5 for SAP ERP 6.0 as of 10/23/15: SPARC T7-2 (2 processors, 64 cores, 512
threads) 30,800 SAP SD users, 2 x 4.13 GHz SPARC M7, 1 TB memory, Oracle Database 12c, Oracle Solaris 11, Cert# 2015050. IBM Power System S824 (4 processors, 24 cores, 192
threads) 21,212 SAP SD users, 4 x 3.52 GHz POWER8, 512 GB memory, DB2 10.5, AIX 7, Cert#201401. Dell PowerEdge R730 (2 processors, 36 cores, 72 threads) 16,500 SAP SD
users, 2 x 2.3 GHz Intel Xeon Processor E5-2699 v3 256 GB memory, SAP ASE 16, RHEL 7, Cert#2014033. HP ProLiant DL380 Gen9 (2 processors, 36 cores, 72 threads) 16,101 SAP
SD users, 2 x 2.3 GHz Intel Xeon Processor E5-2699 v3 256 GB memory, SAP ASE 16, RHEL 6.5, Cert#2014032. SAP, R/3, reg TM of SAP AG in Germany and other countries. More
info www.sap.com/benchmark
• Additional Info: http://blogs.oracle.com/bestperf
53

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