1. Snapdragon platforms overview
feat. MSM7x30 chipset
Maxim Birger
October 2010

2. Agenda
2
 Terminology
 Snapdragon family roadmap
 MSM7230 chipset features and structure
 MSM7230 Modem + PoP Memory
 QTR8200 Transceiver
 PM8058 PMIC
 WCN1312 WLAN module
 Design with MSM platform
 Summary

3. Terminology
3
 SnapdragonTM
 Scorpion
 Adreno™
- Family of mobile processors by Qualcomm
- Snapdragon Application processor core
- Designed by Qualcomm
- Licensed ARM core architecture
- Utilize ARMv7 instruction set
- 2D/3D Qualcomm’s Graphics technology

4. Snapdragon family roadmap
4

5. Snapdragon OS
5

6. 1st Generation
6
Model Max CLK
Frequency
Process Availability
(ES)
Market
QSD8x50 1GHz 65nm Q4 2008 Nexus One
HTC Desire
HTC HD2
LG…
Dell…
Toshiba…
Others
 X=2 – GSM/GPRS/EDGE; UMTS/HSPA
 X=6 – GSM/GPRS/EDGE; UMTS/HSPA; CDMA2000 1xEV-DO
 Adreno 200 GPU

7. 2nd Generation
7
Model Max CLK
Frequency
Process Availability
(ES)
Market
MSM7x30 800MHz 45nm Q4 2009 HTC Desire
MSM8255 1GHz 45nm Q4 2009 HTC Desire
HD
 X=2 – GSM/GPRS/EDGE; UMTS/HSPA/HSPA+
 X=6 – GSM/GPRS/EDGE; UMTS/HSPA/HSPA+; CDMA2000 1xEV-DO
 Adreno 205 GPU

8. 3rd Generation
8
Model Max CLK
Frequency
Process Availability
(ES)
Market
MSM8x60 Dual
1.2GHz
45nm Q2 2010
MSM8x70 Dual
1.5GHz
28nm Q2 2011
QSD8672* Dual
1.5GHz
45nm Q4 2010
 X=2 – GSM/GPRS/EDGE; UMTS/HSPA/HSPA+
 X=6 – GSM/GPRS/EDGE; UMTS/HSPA/HSPA+; CDMA2000 1xEV-DO
 Adreno 220 GPU
 * Smartbooks/tablets oriented

9. MSM Roadmap
9

10. Chipset configurations
10
MODEM MSM7230 MSM8255 MSM8260 MSM8270 QSD8672
PMIC PM8058 PM8058 PM8058 +
PM8901
PM8921 PM8058 +
PM8901
RF QTR8200/
QTR8600/
QTR8601/
QTR8615/
QTR9215
QTR8200/
QTR8600/
QTR8601/
QTR8615/
QTR9215
QTR8615/
QTR9215
RTR8600/
RTR8600L
QTR8615
WLAN WCN1312/
WCN1314
WCN1312/
WCN1314
WCN1314 WCN3660 WCN1314
Other WCD9310
Package 904 NSP PoP,
14x14mm
904 NSP PoP,
14x14mm
976 NSP,
14x14mm
904 NSP PoP,
14x14mm
1249 NSP,
15x15mm
 QTR8200 – GSM/UMTS operating bands;
 QTR8600 – GSM/UMTS/CDMA2000 operating bands;
 QTR8615 – Rx Diversity;
 QTR9215 – No Rx Diversity;

11. Market Milestones
11
Model Release OS Chipset Max CLK Flash RAM Screen Battery
HTC
diamond
May 2008 WM6.1 MSM7201A 528MHz 256MB 192MB 2.8’’
640x480
900mAH
Samsung
Omnia
July 2008 WM6.1 Marvell
PXA312
624MHz 256MB 128MB 3.2’’
400x240
1440mAH
HTC
Diamond2
Apr 2009 WM6.1 MSM7200A 528MHz 512MB 288MB 3.2’’
800x480
1100mAH
iPhone
3GS
June 2009 Apple OS Samsung
ARM Cortex A8
600MHz 16GB 256MB 3.5’’
480x320
1220mAH
HTC HD2 Nov 2009 WM6.5 QSD8250 1GHz 512MB 448MB 4.3’’
800x480
1230mAH
Nexus One Jan 2010 Android QSD8250 1GHz 512MB 512MB 3.7’’
800x480
1400mAH
HTC Desire Apr 2010 Android QSD8250 1GHz 512MB 576MB 3.7’’
800x480
1400mAH
iPhone 4 June 2010 Apple OS Samsung
ARM Cortex A8
1GHz 16/32GB 512MB 3.5’’
960x640
1420mAH
Samsung
Galaxy
June 2010 Android Samsung
ARM Cortex A8
1GHz 2GB 512MB 4’’
800x480
1500mAH
HTC Desire
HD
Oct 2010 Android MSM8255 1GHz 1.5GB 768MB 4.3’’
800x480
1230mAH
HTC HD7 Oct 2010 WP7 QSD8250 1GHz 512MB 576MB 4.3’’
800x480
1230mAH
Modu T Nov 2010 Brew QSC6270 230MHz 256MB 128MB 2.2’’
320x240
500mAH

12. MSM7230 chipset
12

13. MSM7230 chipset
13

14. MSM7x30 chipset key features – Air Interface
14
 Cellular radio technologies and standards
 TDMA – GSM/GPRS/EDGE
 WCDMA – UMTS/HSPA/HSPA+
 CDMA/TDMA – CDMA2000 1x + 1xEV-DO releases (MSM7630)
 WLAN 802.11 b/g/n
 GNSS radio (Global Navigation Satellites Systems)
 GPSCDMA_1575MHz (USA) and GLONASSFDMA/CDMA_1598-1610MHz (Russia)
 Assisted and standalone mode supported
 Bluetooth – compliant with BT 3.0, 2.1+EDR and earlier
 FM radio Receiver and Transmitter
FM

15. MSM7230 chipset key features – Multimedia
15
 Multimedia support
 HXGA 1024×480 display via RGB interface
 FWVGA 860×480 display via MDDI SerDes link
 WQVGA 400×240 display via slow EBI2 interface
 Analog S-Video output for driving PAL/NTSC TV standards
 HDMI 720p (1280×720) video output (requires external HDMI bridge)
 Wide variety of Audio and Video codecs
 Up to 12MP camera (2-lane CSI SerDes link or parallel CAMIF)
 Video Applications – Camcorder, Video player and Video telephony
 Digital and Analog Audio ports

16. MSM7230 chipset key features – Multimedia
16

17. MSM7230 chipset key features – Connectivity
17
 182x General Purpose I/O
 3x I2C
 4x SPI
 2x High Speed UART
 4x SDIO
 1x HS USB with integrated PHY
 1x UICC USB (Mega SIM)
 4x Stereo I2S digital audio (including M-I2S: 4 DATA, common CLK/WS)
 1x PCM digital audio
 User Programmable Logic support 16-bit truth table (via PM8058)

18. MSM7230 chipset key features – Power & UI
18
 Power features
 Battery charger
 Vibration motor driver
 Backlight and Flash drivers
 User Interface
 Up to 8x8 keypad matrix scanner
 5 function joystick
 4-wire/5-wire resistive touch panel controller
 Light pulse generator – flash/torch/UP modes for fun lights

19. MSM7230 Mobile Station Modem – Architecture
19
 Baseband processing features
 ARM1136JS™ embedded microprocessor modem (Up to 400MHz)
 Scorpion™ application processor (Up to 800 MHz)
 Modem DSP , Application DSP, Air Interface DSPs
 Memory controllers
 Single/Dual channel DDR1/2 SDRAM via EBI0/1 interfaces (192/333MHz)
 8/16-bit NAND flash via 16-bit multiplexed EBI2 (runs at 80MHz)
 High performance AHB/AXI on-chip interconnects
 Adreno™ graphics GPU, video enc./dec. and A/V codecs
 GPIOs and Peripherals

20. MSM7230 Mobile Station Modem – Architecture
20

21. PoP Mobile Memory
21

22. PoP Mobile Memory
22
MSM7x30-0 = MSM + Dual Ch. DDR2 MSM7x30-1 = MSM+DDR1+FLASH
14x14 package
904 NSP Bottom + 240 CSP Top = 1144 total pins
Dual channel DDR2 in PoP with external Flash Single channel DDR1 with Flash in PoP
Best in class multimedia+modem concurrencies Best in class PCB area – modem+AP+memory sys
Default configuration – 256MB LPDDR2 (2x128MB) Default configuration – 256MB LPDDR1 with 512MB
NAND Flash
Only external Flash supported PoP flash can be supplemented by external flash

23. PoP Mobile Memory
23
 PoP DRAM/Flash device support
 1Gb (128MB) /2Gb (256MB) x32 LPDDR1 SDRAM
 2Gb (256MB) /4Gb (512MB) /8 Gb (1GB) x32 LPDDR2 SDRAM per channel
 2Gb (256MB) /4Gb (512MB) /8 Gb (1GB) x16 discrete flash
 Prototyped by Qualcomm (Samsung)
MSM device Configuration Rank Memory specification
MSM7x30-0 Dual-channel
LPDDR2
Single 1Gb (32M×32) LPDDR2 SDRAM +
1Gb (32M×32) LPDDR2 SDRAM
MSM7x30-1 Single-channel
LPDDR1 + NAND flash
Single 2Gb (64M×32) LPDDR1 SDRAM +
4Gb (256M×16, NAND flash)

24. PoP Mobile Memory
24
 Memory Channel/Rank possible configurations

25. PoP Mobile Memory
25
 Non-reference memory parts availability (for May 2010)

26. PM8058 Power Management IC
26
 Input power management
 VBAT and VDD voltage/current regulation and protection
 Charger block
 Output power management
 5x SMPS, 26x LDOs with different ratings, 1x Negative charge pump
 House keeping functions
 System Clocks + RTC
 Analog multiplexing and scaling + ADC circuits
 UI
 LPG, Vibrator driver, Joystick + Keypad support, UPL, MIC bias
 LEDs, Backlight and Flash current drivers

27. QTR8200 Transceiver IC
27
 Multiband UMTS + quad band GSM operation
 GSM/UMTS transmitters and receivers
 UMTS bands: LB- 700/800/850/900MHz; HB- 1500/1700/1900/AWS/2100MHz
 GSM bands: LB- GSM850/900; HB- DCS1800/PCS1900
 GNSS receivers (GPS + GLONASS)
 Bluetooth radio
 Analog RF transceiver, Digital baseband modem, ARM7 core + memory
 FM radio
 Analog RF transmitter and receiver, Intel 8051 core + program/data memories
 Analog audio input/output channels
 Resistive touch panel controller

28. WCN1312 WLAN module
28
 WLAN 802.11 b/g/n
 WLAN RF transceiver
 Digital baseband modem
 Operates on PHY/MAC data packets
 ARM9 core + memories
 Used for control path processing, power save operations and housekeeping
 Clock circuits and SDIO-to-host interface
 WLAN/BT coexistence control
 Internal power management

29. Design with MSM platform
29

30. Design, Manufacturing & Test Complexity
30
 BGAs and other heavy parts must be located on one side due to
SMT process constraints
 MSM + QTR + PM + WCN + NAND flash + (modu ASIC) + SIM & SD sockets
 Complex PCB stack-up and routing
 High-Density-Interconnect internal layer routing
 Stacked/Staggered micro-vias
 Via-In-Pad for most BGA pins
 NSMD Land Patterns for best solder joints
 PoP memory SMT process and verification
 Difficult design validation
 Lack of probe accessibility
0.4mm
0.4mm
0.4mm
0.5mm min

31. Power Consumption – FFA7x30 platform
31
 Modem operation (all values in mA)
 Non-modem operation (all values in mA)
 Measured values from Sep. 2010 and subject to changes
 Consumption is highly dependent on OS version and SW optimization
 In parentheses () targeted values, after SW optimization, to Sep. 2010
Mode WCDMA CDMA TDMA
Sleep 1.19 1.18 1.19
Talk
(2G @ 0dBm; 3G @ 5dBm)
145
(125)
131
(121)
104
(66)
Standby 2.4
(1.7)
2.1
(1.5)
3.3
(1.9)
GPS VGA HD MP3 2D 3D
62
(8.2)
78
(71)
124
(106)
43
(20)
87
(67)
148
(125)

32. PCB Area Estimation (with WLAN and HDMI)
32

33. PCB Area Estimation – modu T FF
33
Device D1
[mm]
D2
[mm]
S
[mm2]
MSM7230-0 14 14 196
QTR8200 12.6 6.2 78.12
PM8058 7 7 49
WCN1312 7 7 49
NAND flash 195
MOSAIC 7 7 49
Total (major components) 616.12
Without consideration in:
 Orientation of components
 RFI/EMI shield areas occupancy
 Fine pitch BGA Fan-out

34. Summary
34

35. Summary
35
 MSM7x30 is a powerful platform today!
 In a year from now? Two years?
 ModuT or small FF can be met under some conditions
 Current 500mAH battery may be not enough
 LCD size and Battery will determine the physical dimensions
 MSM7x30-0 is more adequate choice than MSM7x30-1 when
performance come to mind
 MSM8x60 and MSM8x70 platforms will operate high-end mobiles
and QSD8672 tablets, released during 2011-2012

36. Thank you