Semi-conductors Players in Normandy

1. Invest in Normandy
www.normandydev.com
Semiconductors:
R&D, Industry leaders

2. CONTENTS
1 Major players in Microelectronics
2 NXP Semiconductors
4 IDPiA
5 PRESTO Engineering
6 public research Laboratories
6 LaMIPS: Semiconductor Physics and Micro-Electronics Laboratory
7 CRISMAT: Laboratory of Cristallography and Materials Science
8 IRSEEM: Research Institute for Embedded Electronic Systems
9 Existing test Equipment facilities for the semiconductor
industry in Caen
10 Some of the Semiconductor projects developed within
the e-secure Transactions Cluster
11 academic support
11 ENSICAEN Engineering School
12 ESIGELEC Engineering School

3. 1
August 2010
Major players in Microelectronics
ALTIS/Corbeil
Philips-Freescale
ST/Crolles
Freescale
Toulouse
ST
Tours
Automotive
electronics
Power
electronics
Magnetic
technologies
CMOS
technologies
300
200
150
125
Communicating
devices
Regional programs for microelectronics
and major wafer labs in France
Philips
Caen
ATMEL
ST/Rousset
NXP
IDPiA
PRESTO Engineering
NXP
In NormandyIn France

4. 2
August 2010
NXP’ teams at the Caen-based R&D center, comprising 900 engi-
neers and researchers, are developing ground-breaking technologies in
four of NXP’s key fields of activity:
• Mobile & Personal (nomad devices)
• Home (household electronics)
• ID (identification)
• MMS (multimarket semiconductors)
R&D teams work in a number of fields including: RF technologies, si-
licon tuners, System-in-Package, together with other innovative solu-
tions such as Near Field Communication (NFC) technology.
Two joint R&D intitutes: LaMIPS & ISyTest
NXP R&D Center also hosts common research institutes:
• ISyTest (Institute for System Testing) in partnership with the CNRS (National Centre for Scientific Research). Specialized in advanced semiconduc-
tors test strategies and tools, it is developing innovative test methods and techniques allowing NXP to improve the quality of its increasingly com-
plex system solutions.
• LaMIPS, a joint institute with CRISMAT lab in Caen, is specialized in failure analysis, reliability and characterization of semiconductors (SiP & SoC)
and Materials.
During the company’s 50 year presence in the town of Caen, NXP has continued its committed involvement in the local ecosystem. Now located within the new
Effiscience Science Park, the company’s R&D Center federates the key ingredients capable of attracting high-tech partners and activities to the science park.
NXP Semiconductors, French R&D Headquarters - Caen
• 1,150 Employees
• Home, Mobile & Personal,
Identification, Multimarket
Semiconductors (MMS)
• Innovation & Technology
• IC Manufacturing Operations
• Support Functions
Caen has always been the ideal location for
our R&D activities: it boasts a strong entrepre-
neurial culture and commitment from public
authorities, as well as a solid ecosystem formed by
research laboratories, regional competitiveness clus-
ters, engineering schools and technical expertise.
Henri-Alain Rault, former President of NXP France
”
“

5. 3
August 2010
R&D products
• Integrated circuit design in the fields of cellular and cordlessw
telephony, secure electronic transactions and consumer electronics
• Image and video processing for mobile & personal solutions
• International Innovation Centers in RF technologies and video
compression techniques
R&D processes and pilot lines
• International Competence Center for Advanced Technologies in
heterogeneous integration (System-in-Package)
• Test, assembly and packaging technologies
Caen Campus
• Inauguration Q3 2007
• 800 engineers and support functions (Headquarters)
• Showroom with NXP Caen applications and technologies:
TV-on-PC, TV-on-Mobile, Set-Top-Box, NFC, RF Cellular, SiP/PICS
technologies, Solid-State Lighting
NXP’s competencies
SECTORS CRAFTS
Production (Operations) Production, Maintenance
Test Test Development / Support, Test
Manufacturing
Hardware Development Analog Designer, Mixed Designer
Digital back-end, Digital front-end
Software Software Designer
Architecture HW Architect, SW Architect
System Architect, IC Architect
Innovation Proc., Innovation Dev.
TPE Test Engineer, Product Engineer
Support BL Quality / Logistic, Industrialization/
SCM Assistant
Project Management Project management
Marketing &
Sales
IPM/Tactical, Business Development
Account Manager
Support Site HR, Communication
F&A, Legal & Fiscal
Purchasing, IT, Logistic

6. 4
August 2010
IDPiA - Caen
IPDIA was founded in 2009 as a spin-out from NXP.
New manufacturing plant on PICS technologies and 3D Silicon Production
IPDIA is a preferred supplier of high-performance, high-stability and high-
reliability silicon passive components. IPDiA’s primary objective is to focus
on two main axes : Integrated Devices for high brightness LEDs and Integra-
ted Passive Devices for new markets such as medical, industrial, aerospace
and defense.
IPDiA’s technological lead in components for lighting, LEDs and integrated pas-
sive devices will enable companies to capitalize on this know-how acquired over
the last few years and which earned IPDiA its position as a major player on the
world market.
IPDiA produces both stand-alone IPDs as well as Systems-In-Package (SiP). The
stand-alone IPDs are used in LEDs and modem cards. In SiPs the IPD and the
chip are integrated leading to better performance, a smaller footprint (10 x smal-
ler), and a lower cost price.
The SiP technology opens up numerous commercial applications and meets the
ongoing requirements of many OEMs to keep on reducing the size of electronic
devices while improving their performance and reliability.
R&D Projects
PRIIM
IPDiAhas announced the launch of the R&D consortium PRIIM
(Platform for the Realization of Shared Industrial Innovation)
which will address application requirements for markets such
as: implantable medical devices (stimulators, defibrillators,
motion detectors), multimedia chips and embedded systems.
IPDIA Multi Wafer Interposer & IPD Program
The consortium goal is to develop high-performance silicon
passive components capable of “withstanding severe environ-
ments and assembly technologies that allow the ultraminiatu-
rization of future products”.
This 53 million euro - four year project will include the following
partners: Oseo, CEA Leti, CNRS/LAAS, CNRS /CRISMAT, 3D
PLUS, ELA Medical, Gemalto, Kalray and Movea.
IPDiA dedicated campus covers 7 ha, including:
. The IPDiA company Headquarters
. The Sales and Marketing organization
. Pilot line for SiP product development and
rapid prototyping
. 6" wafer fab with integrated passives, capacity
150k wafers per year.
• Customized Products
• 3D Silicon Capacitors
• RF Integrated Passive
Devices
• Integrated Protection
Devices
IPDiA Products

7. 5
August 2010
PRESTO Engineering - Caen
Presto Engineering Offering Semiconductor Test and Analysis Services in new
European Hub
• Test
• Reliability
• Electrical Failure Analysis
• Physical Failure Analysis
• Program Management
About Presto Engineering
Presto Engineering, an ISO 9001 company
headquartered in San Jose, California, pro-
vides comprehensive semiconductor test
and analysis solutions to IDM and Fabless
companies, helping to improve the speed
and predictability of new product releases.
Presto combines unique technical expertise,
extensive industry experience and state-of-
the-art ATE, reliability, failure analysis and
fault isolation capabilities to offer a com-
plete product engineering solution designed
to complement the internal resources of its
customers.
Presto Engineering, a pioneer
of the labless business model
for bringing semiconductor pro-
ducts into volume production,
announced in February 2010
the opening of its new services
hub in Caen.
For the first time, European chip companies have access to
a state-of-the-art lab with a staff of highly skilled engineers and
technology specialists offering advanced outsourced test and
analysis capabilities.
“
Patrick Poirier - Director of Operations
”
The new hub, which includes equipment and infrastructure acquired from NXP Semiconductors’ facility
in Caen, offers comprehensive failure analysis and reliability testing for semiconductor compa-
nies. The hub will be operated by Presto Engineering Europe.
Presto’s state-of-the-art capabilities include enhanced RF and 3D-integration expertise and ad-
vanced test, reliability, fault-isolation and failure-analysis services. By outsourcing these steps,
chip companies are able to cut costs and free resources for their core business.
Bringing an advanced chip design into silicon requires a variety of advanced test and analytical tech-
niques. Presto’s Design Success Analysis™ offering eases this process by providing first-silicon vali-
dation, as well as characterization of new processes, new designs, and process transfers. Capabilities
include comprehensive custom ATE hardware interfaces (such as load modules, probe cards, DUT cards
and thermal interfaces) and product-engineering services.
More broadly, Presto can proactively and reactively address a variety of design-to-manufacturing chal-
lenges. Presto’s product debug services include ATE-coupled in-silicon analytical capabilities, with ex-
tensive backside silicon analysis; additional release-acceleration offerings include reliability services.
The company’s hubs can also maximize the utility of expensive test chips and engineering, validating
simulation results and characterizing timing, power, leakage, and other parameters.
«This new facility is the springboard for Presto’s expansion into Europe and our introduction of the labless
model to that key market, which includes some of the world’s top fabless design houses, fab lines, and
other members of the semiconductor community,» said Michel Villemain, CEO of Presto Engineering.
(source: Press Release - February 16, 2010)

8. 6
August 2010
public research Laboratories
LaMIPS’ strengths
• A huge amount of equipment at the cutting-edge of today’s tech-
nologies (AFM, TEM, SEM, FIB...)
• A workforce of 60 people including doctors, engineers and tech-
nicians, who manage twenty or so PhD students and trainees
• Strong skills in all kind of technical analysis combined with
advanced skills in the fields of electrical stresses and reliability tests
• A rich, outward-looking network with other companies
(Valeo, Magneti Marelli, ArvinMeritor, Fime, Expert’eyes...)
• Partnership with competitive clusters: MOV’EO (automotive &
transport) and TES (e-secure transactions) ; membership in Caen
“CNRT” Materials
LaMIPS is a shared facility between the CRISMAT (Laboratory of Christallo-
graphy and Materials Science) renowned worldwide in the fields of material
synthesis and characterization and NXP Semiconductors, which has de-
veloped expertise in the characterization, failure analysis and qualification of
products and processes on the Caen site.
LaMIPS is a vital partner for the development of new technologies, its
mission is to develop research activities focusing on physical and elec-
trical characterization, modelling and the reliability of complex systems.
The laboratory is also open to businesses with needs in the field of
micro-electronic system analysis and characterization. By reuniting the
expertise of all of its partner organizations, LaMIPS is emerging as a major
player for understanding the difficulties generated by new and increasingly
complex micro-electronic systems.
Partnership with NXP
NXP uses the laboratory for its specific needs.
Furthermore, the company ensures its maintenance and its ope-
rating costs. As for its research activities, NXP’s engineers and
technicians take part in research and conduct measurements
along with researchers.
“Thus, we can improve our efficiency and genuinely focus on
identifying defects” explains LaMIPS’ Director, Philippe Des-
camps. The research topics developed within the laboratory are
generally put forward by NXP.
Nevertheless, the lab can also work on its own themes according
to publication opportunities and to the specific skills of available
researchers.
Research thematics
To develop innovative
methods for characte-
rizing and analysing micro-
electronic systems
• Failure Analysis
• Material Characterization
• Reliability
• Hyperfrequency & Radio
Frequency, Electric Charac-
terization and modelling
• Supporting Process
Development
Main fields
LaMIPS: Semiconductor Physics and Micro-Electronics
Laboratory
Failure Analysis,
Reliability and Characterization of
Semiconductors and Materials

9. 7
August 2010
CRISMAT: Laboratory of Cristallography and Materials Science
Publication pending:
Mas Subramanian was welcomed to Caen last July. His time is shared between his American lab and CRISMAT, where he has started research work with a
team comprising a professor, a CNRS researcher and two PhD students. ‘We are looking to develop new oxide nanomaterials, drawing on our knowledge in
the field of solid-state chemistry.’ Subramanian coordinates his work between the United States and France.
First impressions? «From a scientific point of view, we are already preparing and submitting articles for publication. This exchange has given us a new lease
of life. Our students plan to travel to the United States this summer, and, likewise, we also plan to welcome American students to Caen. Without forgetting
scientific dissemination, since local researchers can take full advantage of the Caen-based conferences and seminars at which Subramanian has agreed to
speak».
(1) This one-year, full-time partnership stretches in fact, on a part-time basis, over a period of two years and will consequently end in July 2009.
(2) The regional scheme in support of chairs of excellence aims at encouraging the hosting of top-level foreign researchers within regional laboratories, by providing attractive
resources for them to rapidly conclude their research project
A regional scheme aimed at supporting chairs of excellence has allowed the CRISMAT to welcome one
of the world’s leading names in research into nanomaterials for a 12-month, full-time secondment. And al-
though CRISMAT is a renowned laboratory for its research on materials, a valuable outside view is sure to
accelerate its exploratory work.
Since the summer of 2007, the CRISMAT has been proud to welcome a high-flying American researcher for
a one-year (1) secondment. ‘We were looking to initiate new work on nanomaterials with support from an
established outside source. The regional scheme(2) in support of hosting renowned exterior researchers
offered the ideal opportunity.’
CRISMAT’s Director Antoine Maignon and his research team had already set their sights on Mas Subrama-
nian, a professor from Oregon State University. ‘A big name in nanomaterials, thermoelectricity in particular,
for which he is among the world’s top 5 for patent applications.’ Working with him could but enhance the
CRISMAT’s international influence in its particular field of research.
Functional & Structural Materials.
Ceramics, Alloys, Composites and
Microelectronics
The CRISMAT, affiliated
to CNRS and ENSICAEN,
is a large research
laboratory with more
than 100 people. The main
scope of activities is the
design of new oxides to
create new properties
for applications

10. 8
August 2010
IRSEEM: Research Institute for Embedded
Electronic Systems
Research fields:
• Electromagnetic compatibility
• Components EMC
• Systems EMC
• Measurement and investigation
platforms (Near field test bench, Load
Pull test bench, TEM 3D Cell, mode-
stirred reverberating chamber)
Equipment:
• Semi-anechoic chamber with rolls
bench until 18 GHz for automobile
and bulky embedded systems
• Semi-anechoic chamber until 40 GHz
• Mode-stirred reverberating chamber
• Measurement bench for EMC immunity
(200V/m) and emission (CISPR 22)
• BCI tests bench
• Vectorial analysis bench until 40 GHz
• CAD
• Electric simulations
• 2D-3D electromagnetic modelling
• DPI test bench
• Near field test benches (systems and
components)
IRSEEM Research Ins-
titute and technology
transfer center has de-
veloped a strong ex-
pertise in embedded
electronic systems with
a special emphasis on
the Automotive and Aeronautics sectors
Partners:
• Academic partners: GREAH (Le Havre University),
GPM (Rouen University), LGEP (SUPELEC) and L2S
(SUPELEC and Paris-Sud 11 University), TELICE-IEMN
(Lille University), XLIM (Limoges University), Groupe
Antennes et Micro-ondes (Kent University)
• Industrial partners: Airbus, EADS, Faurecia, FCI,
INRETS, PSA, Renault, Thales Air Defence, Valeo,
Synchronic, Pragmatech, etc.
IRSEEM was created in 2001 with the support of the ESIGELEC, the Rouen Chamber of Commerce and Industry and several industrials and public
bodies; it houses industrial research laboratories and has positioned itself on embedded electronics. The industrial research it has enabled to develop
since then has been dedicated to regional automotive, aerospace and electronics networks. IRSEEM teams have carried out major research works
while supporting various technology transfer and economic development activities.
• Innovative Solutions
• Measurements & Tests
• Technical Support
• Technology Transfer
• Technological & Normative
Watch
• Professional Training
Measurement, Simulation, Design assistance

11. 9
August 2010
Failure Analysis: Lab tools
Initial Inspection: Non Destructive Analysis
• X-rays: Pheonix Nanomex 160 : 2D & 3D
• SAM: HITACHI FS300
• TDR: Agilent 86100 + TDR + Tektronix probe
• Magnetic Current Imaging (2008)
Sample Preparation and Observation
• Observation:
. Optical Observation: Leica, Olympus
. Confocal microscope (2008)
• De-capsulation:
. Chemical de-capsulation: BGDCAP
. Milling system: Hamamatsu IC Back Side
Polishing - ASAP-1
. Laser ablation
• Repackaging:
. Wire bonding: K&S4526
• Preparation:
. Grinding and polishing system: Multiprep
. Plasma etcher (Nextral860 & 110)
. Laser cutter (Ezlase 3 wave lengths)
. FIB (FEI200)
Existing test Equipment facilities for the semi-
conductor industry in Caen
Within the Normandy region, numerous quality & analytical equipements for the semiconductor & micro-electronic industry are available for external compa-
nies. Below, some examples of the failure analysis lab tools that can be found in the different Norman facilities.
Electrical Verification
• Manual probe station PM8 + DC and RF probe
PHEMOS1000
• Photon Emission
• Thermal Laser Stimulation (IR Laser 1300nm)
(OBIRCh/TIVA), SDL
• Magnetic Current Imaging (not available project 2008)
• Measurement instruments : Scope WavePro 940
500 MHz, Semiconductor Parameter Analyser 4156C /
4155B / 4145B, LCR Meter 4284A
Physical Analysis
• Preparation, observation
. Delayering, Cross sectioning
. SEM: XL40 +EDX
• Physical Characterization
. FIB for precise cross section or TEM lamella
. TEM (available at the University)
. Atomic Force Microscopy: VeecoD3000 +
Electrical modes SCM, SSRM, EFM
. SIMS, AUGER, … (subcontracted)

12. 10
August 2010
Some of the Semiconductor projects developed
within the e-secure Transactions Cluster
Secure Electronic Transactions are a combination of electronic, computing and data communication techniques enabling the reliable and secure exchange of
information in a wide range of application domains. Changes in usage, the «electronisation» of certain daily gestures, together with the internationalisation of
standards and legislation, are all factors bearing a strong influence on the field of Secure Electronic Transactions.
Project Name Description Project Leader Partners
New mould for the
manufacture of
contactless cards
New mould for the manufacture of contactless
cards
Seropa
MiniFab Industrialization of the manufacturing process
for small and medium series smart cards
Alios
SEMOME Magnetoelectronic structure of magneto-electric
oxydes
CRISMAT lab CRISMAT lab
FEMMES Ferro-electromagnetism for spin electronics CNRS/Thales CRISMAT lab, CEA
Millesim New analysis and test method in SIP production Pertinence Inria, CNRS, NXP
CUMIN 3D copper interconnects for silicon-based Sys-
tem-in-Package (sbSIP)
Rockwood Electronic
Materials
Alchimer, NXP, CNRS
Mediasur Active security for CD/DVDs: insertion of an
RFID tag in the optical disk and a reader in the
disk drive
Orange
(France Telecom)
Thomson, Greyc
Laboratory
Mastere M’SIP Executive Master in Microelectronics System
Design and Technology
EnsiCaen NXP, Oberthur,
Stepmind, Silicon
Laboratories,
6 engineering schools
TEMPICAP Feasibility study, evaluation and clinical valida-
tion of a prototype for measuring body tempera-
ture by ingestion of an electronic capsule
NXP Caen University,
Nantes University,
Expert Soft Technologies
Normandy Living
Lab
Creation of the Normandy Living Lab dedicated
to new uses of mobile phone
TES cluster LSN/Novalog cluster
Key Technologies
Storage of digital information
Secure Transactions
Authentication technologies
Conception tools and methods
Man Machine Interface
RFID
Key Themes
e-citizen (health, tourism,
transportation, city)
Contactless technologies
e-administration/e-government
TES Cluster

13. 11
August 2010
academic support
ENSICAEN Research Labs
• LAMIPS (Laboratoire de Microélectronique ENSICAEN/
NXP Semiconductors): Microelectronics Laboratory
• GREYC (Groupe de Recherche en Informatique,
Image, Automatique et Instrumentation de Caen): IT,
Imaging and Instrumentation Laboratory
• CIMAP (Centre de Recherche sur les Ions, les Maté-
riaux et la Photonique): Centre for Research on Ions,
Materials and Photonics
• CRISMAT (Laboratoire de Cristallographie et
Sciences des Matériaux): Laboratory of Christallogra-
phy and Materials Science
• LPC (Laboratoire de Physique Corpusculaire):
Laboratory of Corpuscular Physics
• LCMT (Laboratoire de Chimie Moléculaire et
Thio-organique): Laboratory of Molecular and Thio-
organics Chemistry
Engineer Diplomas
Master’s degree
• Electronics and Applied Physics
Options: Microelectronics - Telecommunications
- Automatics and industrial computing - Nuclear
engineering and instrumentation - Optics, sen-
sors instrumentation
• Computer science
Options: digital imaging and multimedia -
e-banking and computer science security -
e-banking and systems security
• Materials Science and Chemistry
Options: Materials, Organic Chemistry -
Materials for micro-electronics, micro-mechanics
Executive Masters
(considered as a 6-year
university degree)
• Microelectronics System Design &
Technology
Mixed Analog/Digital design, Analog/RF
design, High level integrated systems,
Advanced Tests Methods and Processes,
Business Management
• Electronic Payment
E-secure payments and transactions,
Authentication, E-commerce, smart cards
• Business intelligence
Master in Microelectronics System Design & Technology: a Master designed for junior
and senior electronicians
Unique in Europe, this degree is particularly orientated towards highly integrated Systems-on-Chip (SoC)
and System-in-Package (SiP) design combined to the RFC MOS technology and is designed for both
young engineers qualified in electronics/microelectronics and employees from the industry as part of their
life-long learning programmes. This course will span the overall SiP system from the technological/design
aspects to the promotion of the products.
ENSICAEN (Caen) offers three main engineering degree courses in
Computer Science, Electronics and Applied Physics, and Materials
Science and Chemistry
ENSICAEN Engineering School
• Research laboratories including a joint
laboratory with NXP
• 3 specialized executive masters
• Strong links with industry
• Partnership with TES and Move’o
Competitive Clusters
• Member of the National Centre
for Technological Research in Materials
• A Department of IndustrialCooperation
Driving and developing innovation is key in our industry. NXP Semiconductors is pionee-
ring new miniaturized concepts for a broad range of applications. This Master is then very sui-
table to understand the overall business and technical problematic when designing a complete
integrated system. It will also speed up the knowledge acquisition of the Engineers.
Dr Patrice Gamand, NXP Semiconductors - Caen, General Manager RF Innovation Center
”
“

14. 12
August 2010
ESIGELEC Engineering School
Majors
• Optical Telecommunications Engineering (ITO)
• Networks and Architecture Security (ASR) *
• Information systems engineering (GSI) *
• Business Engineer (IA)
• Industrial Automation and Robotics (ARI)
Automation and computer control, digital signal
and microcontroller processing, instrumentation
(real and the virtual), automated manufacturing
and local industrial networks, modelling and robot
control, image processing and quality control, power
electronics and electrical engineering.
• Embedded Systems Engineering (ISE) *
Real-time OS, methodology, microcontrollers,
programmable logic and VHDL, communications bus,
instrumentation, electromagnetic compatibility.
• Electronic and Telecommunications Systems
Engineering (ISET)*
Concepts specific to radio frequency sub-assemblies
for telecommunications (such as digital signal
processing) together with computer-aided design
tools and measuring equipment.
• Electrical Engineering and Transport (GET) *
Energy (transport, networks, management), rotating
machines, power electronics, order real time,
instrumentation and communication networks, EMC,
modelling.
* Bilingual English-French
Departments/Research labs
• Electronics & Telecommunications
• Computer & Communications Technology
• Electronics Laboratory
• Microwave Frequency Telecommunications
Laboratory
• Optical Telecommunications Laboratory
• Electrical Engineering & Embedded
Systems
• Industrial Automation Laboratory
• Electrical Engineering Laboratory
• Embedded Systems and Signal
• Processing Laboratory
• Humanities & Languages
7 engineering careers
• Research & Development
Design Engineer
• Project Manager Engineer
• Business Engineer
• International Engineer
• Quality-Control Engineer
• Engineer Entrepreneur
• Consulting Engineer
Esigelec (Rouen) trains engineers in the following fields: Networks, Data Processing, Information
Technology, Telecommunications, Electronics, Embedded Systems, Electrical Engineering
Transport, Automation & Industrial Robotics.
• 4 training departments
• 8 laboratories and IRSEEM Research
Institute
• 8 technological specialisations and
introduction to 7 engineering careers
• Strong cooperation with the automotive,
aeronautical, electronic and telecommu-
nications industries
• Member of the National Centre for
Technological Research in Materials
• Partnership with TES, Move’o and
Novalog Competitive Clusters

15. www.normandydev.com
Normandy
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For further information, please contact:
Sylvain DORRIERE
Project Manager
Normandie Développement
Unicentre
12 rue Alfred Kastler
14000 Caen - France
Tel. +33 (0)2 31 43 56 56
sdorriere@normandydev.com