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PHOTOLITHOGRAPHY
CONTENTS
 INTRODUCTION
 DEFINITION
 STEPS INCLUDED
 EXPLAINING THE PROCESS
 APPLICATIONS
INTRODUCTION
 Photolithography, also termed optical lithography
or UV lithography, is a process used in micro
fabrication
 It uses light to transfer a geometric pattern.
DEFINITION
 Photolithography is the process of transferring
the geometrical patterns from a mask to the
semiconductor material (silicon wafer) using the
UV Radiation.
STEPS INCLUDED...
 Spin coating with Photoresist.
 Exposure to the Radiation.
 Developing
 Etching
 Stripping
STEPS
PHOTORESIST
 Photoresist is an organic polymer which
changes its chemical structure when
exposed to the sensitive radiation.
 Example: Poly(methyl glutarimide)
(PMGI)
SPIN COATING
 The Si wafer is placed on the rotating
platform or chuck and held via vacuum
suction
 Resist is poured onto the wafer, the wafer
spins at a high speed (more than thousand
rpm’s)
 The speed determines the thickness of the
coated resist
SPINNING
EXPOSURE TO THE
RADIATION
 Exposure to the UV Radiation through a
mask, changes the property of the
photoresist. i.e., exposed region of resist
get softened or hardened, depending on
the type of the resist.
EXPOSURE ARRANGEMENT
DEVELOPING
 After exposure, the wafer or the substrate is
soaked in a developer solution
 This helps in removal of the softened regions
of the photoresist
 After developing we are left with the
photoresist of the same pattern as its on the
mask
AFTER DEVELOPING
ETCHING
 After developing, the wafer or the substrate
is soaked in a chemical bath or etchant
 This removes the oxide parts of the
substrate, from where the Photoresist was
removed previously
 Now we are left with the needed pattern,
etched on the substrate
AFTER ETCHING
STRIPPING
 Now, remove all the photoresist by
soaking the etched Si wafer in a
photoresist removal solution.
AFTER STRIPPING
APPLICATIONS
 IC patterning process
For transistors
For Op-Amps
For Logic Gates
 Patterning Printed electronic boards
REFERENCES
 Lecture - 23 Lithography - I - YouTube [Online] // Dr. Nandita
Dasgupta , Department of Electrical Engineering, IIT Madras. -
https://www.youtube.com/watch?v=v9eGO5OjC8A.
 Linear Integrated Circuits [Book] / auth. D. Roy Chaudhury and
Shail B. Jain : New Age International (P) Limited, 2003.
 Physics of Semiconductor Devices [Book] / auth. Colinge J-P &
Colinge C A. - London : KLUWER ACADEMIC PUBLISHERS.

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Photolithography1

  • 2. CONTENTS  INTRODUCTION  DEFINITION  STEPS INCLUDED  EXPLAINING THE PROCESS  APPLICATIONS
  • 3. INTRODUCTION  Photolithography, also termed optical lithography or UV lithography, is a process used in micro fabrication  It uses light to transfer a geometric pattern.
  • 4. DEFINITION  Photolithography is the process of transferring the geometrical patterns from a mask to the semiconductor material (silicon wafer) using the UV Radiation.
  • 5. STEPS INCLUDED...  Spin coating with Photoresist.  Exposure to the Radiation.  Developing  Etching  Stripping
  • 7. PHOTORESIST  Photoresist is an organic polymer which changes its chemical structure when exposed to the sensitive radiation.  Example: Poly(methyl glutarimide) (PMGI)
  • 8. SPIN COATING  The Si wafer is placed on the rotating platform or chuck and held via vacuum suction  Resist is poured onto the wafer, the wafer spins at a high speed (more than thousand rpm’s)  The speed determines the thickness of the coated resist
  • 10. EXPOSURE TO THE RADIATION  Exposure to the UV Radiation through a mask, changes the property of the photoresist. i.e., exposed region of resist get softened or hardened, depending on the type of the resist.
  • 12. DEVELOPING  After exposure, the wafer or the substrate is soaked in a developer solution  This helps in removal of the softened regions of the photoresist  After developing we are left with the photoresist of the same pattern as its on the mask
  • 14. ETCHING  After developing, the wafer or the substrate is soaked in a chemical bath or etchant  This removes the oxide parts of the substrate, from where the Photoresist was removed previously  Now we are left with the needed pattern, etched on the substrate
  • 16. STRIPPING  Now, remove all the photoresist by soaking the etched Si wafer in a photoresist removal solution.
  • 18. APPLICATIONS  IC patterning process For transistors For Op-Amps For Logic Gates  Patterning Printed electronic boards
  • 19. REFERENCES  Lecture - 23 Lithography - I - YouTube [Online] // Dr. Nandita Dasgupta , Department of Electrical Engineering, IIT Madras. - https://www.youtube.com/watch?v=v9eGO5OjC8A.  Linear Integrated Circuits [Book] / auth. D. Roy Chaudhury and Shail B. Jain : New Age International (P) Limited, 2003.  Physics of Semiconductor Devices [Book] / auth. Colinge J-P & Colinge C A. - London : KLUWER ACADEMIC PUBLISHERS.