The growing and diversifying system requirements have continued to drive the development of a variety of new package styles and configurations:
Small-form-factor
Lightweight technology
Low-profile technology
High-pin-count technology
High-speed technology
High Reliability
Improved thermal management
Lower cost
Fan-in WLP maintains its appeal as the package that can provide 2 unmatchable advantages:
• Reduced form factor
• Low cost
Demand is reaching available capacity
Technology innovation in fan-in WLP continues:
• Die size increases
• Bump pitch reduces
Foundry involvement is no longer a dent in fan-in WLP production
Increased activity of Chinese capital on the market
New applications are emerging while other are declining
• Disruptions also expected in the MEMS and CIS domains
• Internet of Things
Mobile sector is driving fan-in WLP production and growing
IoT is on the horizon and is expected to have a significant impact on fan-in packages and the packaging industry as a whole