2nd Gen. of InvenSense IMU - The Smallest 9-Axis IMU with only 9mm² footprint 40% area decrease of the gyro & magneto through key changes of the Nasiri process For its second generation of 9 DoF sensor, InvenSense manages to integrate a 6-Axis Accelerometer/Gyroscope and a 3-Axis Magnetometer in a cost effective QFN package of only 3x3mm (45% footprint reduction compared to the previous generation). This package reduction has been made possible thanks to a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefice of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction. The MPU-9250 also integrates a new 3-Axis magnetometer from AKM, the AK8963, which features almost 40% size reduction compared to previous generation and sensitivity improvement with 0.15µT/LSB. More information on that report at http://www.i-micronews.com/reports/InvenSense-MPU-9250-9-Axis-MEMS-IMU/1/426/

1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not
bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The
quoted trademarks are property of their owners.
© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr
21 rue la Nouë Bras de Fer
44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr
March 2014 – Version 1 – Written by Romain Fraux

2. InvenSense MPU-9250
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Glossary
1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. Company Profile 7
– InvenSense Profile
– MPU-9250 Specifications
3. Physical Analysis 15
– Synthesis of the Physical Analysis
– Physical Analysis Methodology
– Package
– Package View, Dimensions & Pin-out
– Package Opening
– Package Cross-Section
– MPU-6500 Die
– View, Dimensions & Marking
– MEMS Removed
– MEMS Sensing Area
– MEMS Cap
– ASIC Delayering & Process
– Die Cross-Section: ASIC
– Die Cross-Section: MEMS (Pads Opening, Sealing)
– Die Cross-Section: Sensor (Electrical Contacts, Standoffs)
– Die Cross-Section: Sensor (Al-GE Bonding)
– Die Cross-Section: Sensor (Mobile Elements)
– Die Cross-Section: Cap
– AK8963 Die
– View, Dimensions & Marking
– Hall Sensors
– Delayering & Process
– Die Cross-Section
– Magnetic Concentrator Cross-Section
4. Comparison with previous generation 92
5. Manufacturing Process Flow 95
– Global Overview
– MPU-6500 ASIC Front-End Process
– MPU-6500 MEMS Process Flow
– MPU-6500 Wafer Fabrication Unit
– AK8963 ASIC Front-End Process
– AK8963 Magnetic Concentrator Process Flow
– AK8963 Wafer Fabrication Unit
– Packaging Process Flow
– Package Assembly Unit
6. Cost Analysis 112
– Main steps of economic analysis
– Yields Hypotheses
– MPU-6500 ASIC Front-End Cost
– MPU-6500 MEMS Front-End Cost
– MPU-6500 ASIC/MEMS Assembly Cost
– MPU-6500 MEMS Front-End Cost per process steps
– MPU-6500 Total Front-end Cost
– MPU-6500 Back-End 0 : Probe Test & Dicing
– MPU-6500 Wafer & Die Cost
– AK8963 ASIC Front-End Cost
– AK8963 Magnetic Concentrator Cost
– AK8963 Total Front-end Cost
– AK8963 Back-End 0 : Probe Test & Dicing
– AK8963 Wafer & Die Cost
– Back-End : Packaging Cost
– Back-End : Packaging Cost per Process Steps
– Back-End : Final Test & Calibration Cost
– MPU-9250 Component Cost
7. Estimated Price Analysis 146
– InvenSense Financial Ratios
– MPU-9250 Estimated Price
Contact 150

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The reverse costing analysis is conducted in 3 phases:
Teardown
analysis
• Package is analyzed and measured
• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin
out, die marking
• Setup of the manufacturing process.
Costing
analysis
• Setup of the manufacturing environment
• Cost simulation of the process steps
Selling price
analysis
• Supply chain analysis
• Analysis of the selling price

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• Package: QFN 24-pin
• Dimensions: 3.0 x 3.0 x 1.0mm
• Pin Pitch: 0.4mm
• Marking:
MP92
C571D1
L1339
Package top view
Package back viewPackage Side View
Orientation of Axes for Accelerometer & Gyroscope
(from datasheet)
Orientation of Axes for Magnetometer
(from datasheet)

5. InvenSense MPU-9250
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 5
• The die marking includes:
InvenSense
2012
SCORPION-A02
ASIC Die Marking

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• The die marking includes the logo of AKM and:
6473_ _ _
2011
Magnetometer Die Marking

7. InvenSense MPU-9250
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8. InvenSense MPU-9250
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9. InvenSense MPU-9250
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 9
Packaging Cost
Calibration & Final Test Cost
MPU-6500
CMOS Front-End Cost
MEMS Front-End Cost
Probe Test Cost
Dicing Cost
• We perform the economic
analysis of the CMOS with
the IC Price+ tool.
• We perform the economic
analysis of the MEMS and
packaging with the MEMS
CoSim+ tool.
Subcontractor
Could also be

10. InvenSense MPU-9250
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11. InvenSense MPU-9250
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12. InvenSense MPU-9250
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13. InvenSense MPU-9250
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14. InvenSense MPU-9250
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© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 14
Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates
completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on
the manufacturing cost (if all parameters are cumulated)
These results are open for discussion. We can reevaluate this circuit with your information.
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