Power Module Packaging 2018: Material Market and Technology Trends report by Yole Développement

Power module
packaging:
material market
and technology
trends
Report
From Technologies to Market

2
Biographies & contacts
Alejandra Fuentes Suarez is a Technology & Market Analyst, Power Electronics, within the Power and Wireless Team at Yole Développement (Yole). She is
involved in the development of custom studies and reports covering the power electronics industry: Alejandra daily researches the latest developments in power
converter topologies, passive components, power modules packaging and EV/HEV. Previously Alejandra acquired extensive expertise in the design of power
converters for solar, wind, hydro and motor drive applications at Semikron (France). Alejandra graduated from UJF (Grenoble, FR) and INP (Grenoble, FR) as an
electrical engineer, specializing in design of power electronics system. She also holds an advanced master’s in the field of Marketing and Management of Energy from
the Grenoble Business School (Grenoble, FR).
E-mail: fuentes@yole.fr
ABOUT THE AUTHORS
Dr. Milan Rosina
Dr. Milan Rosina is Senior Analyst, Power Electronics & Batteries, at Yole Développement (Yole), within the Power & Wireless division. Milan has 20 years of
scientific, industrial and managerial experience in equipment and process development. He has experience in due diligence, technology, and market surveys in the
fields of renewable energies, EV/HEV, energy storage, batteries, power electronics, thermal management, and innovative materials and devices. Dr Rosina received
his Ph.D. degree from National Polytechnical Institute (Grenoble, France). He previously worked for the Institute of Electrical Engineering in Slovakia, Centrotherm
in Germany, Fraunhofer IWS in Germany, CEA LETI in France, and utility company ENGIE in France.
E-mail: rosina@yole.fr
Mattin GraoTxapartegi
Mattin Grao Txapartegi is a Power Electronics Analyst at Yole Développement. He is engaged in many custom studies and reports on the development of inverter
architecture and passive components, and recently he has been in charge of power packaging topics. Mattin drives technology and market scouting, roadmap
definition, identification of disruptive technologies and market opportunities, and competitive landscape analysis. He acquired comprehensive expertise in the design
of power converters for electric vehicles at the car manufacturer Renault. He graduated from Grenoble INP with an engineering degree in electrical systems. He
then earned an advanced master’s degree in aeronautic engineering from Arts et Métiers ParisTech. During this time, he oversaw managerial, financial and
marketing fields within the aeronautics industry.
Email: grao@yole.fr
Alejandra Fuentes
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018

3
TABLE OF CONTENTS
• Objectives of the report 4
• What is in this report? 5
• Companies cited in the report 6
• List of abbreviations 7
• Executive summary 8
• Overall power electronics market 37
• Power module market 42
• Global trends for power module packaging 48
• Thermomechanical issues in power modules 63
• Power module packaging 71
• Composition of a conventional power module 73
• Power module materials and process choice 77
• Interconnections 82
• Die and substrate attach 97
• Encapsulation 121
• Substrates 139
• Baseplates 156
• Thermal Interface Materials (TIMs) 172
• Power modules - Case studies 193
• Raw materials market for power packaging 208
• Yole’s methodology for market metrics 209
• Specific market analysis of each part of the module:
• Interconnections in power modules 211
• Die attach for power modules 215
• Substrate attach for power modules 220
• Encapsulation for power modules 225
• Substrates for power modules 230
• Baseplates for power modules 235
• TIM for power modules 240
• Business model and supply chain analysis 245
• Wide-band gap packaging 286
• General conclusions 305
• Yole Développement presentation 310

4
OBJECTIVES OF THE REPORT
 To provide market analysis and forecasts for power module packaging.
 To provide a deep insight into state-of-the-art package designs and materials.
 To identify the key technology trends that will shape the power packaging market in the future.
 To understand the main challenges and proposed innovations for power packaging.
 To provide analysis and trends for the power packaging supply chain.

5
WHAT IS IN THIS REPORT?
• The main challenge for the power electronics industry is to reduce energy consumption in order to meet targets for reducing CO2
emissions.
• To meet this objective conversion efficiency must be increased:
• Technology breakthroughs such as wide band gap (WBG) semiconductors are needed.
• The whole power electronics device must be optimized, including the packaging.
• Improved thermal management helps to reduce the cooling needs and related energy consumption.
• To preserve device characteristics, package developments are imperative:
• WBG semiconductor progress requires dedicated developments.
• Design-to-cost solutions are required to drive down costs.
• Volume constraints and related high-power density challenges require development of new solutions.
• In this report we provide an insight into the packaging market for power electronics:
• The standard module is described, with detailed analysis of each part of the package and the associated markets.
• Case studies are developed to illustrate different technologies.
• Technology trends
• A description of the power packaging landscape is also provided, along with main development trends.

6
COMPANIES CITED IN THE REPORT
ABB,ACC,Alpha,AM2T,Amkor,AOS,APE, aPSI3D,Avator,AT&S, BlueStar Silicones, Bosch, BYD, CeramTec, Comelec,
Continental, CPS Technologis, CRRC, Danfoss, Delphi, Denso, Dow Corning, Dowa, Dupont, Dynex, Electrolube, Fairchild, Fuji
Electric, GaN Systems, GE, General Electric, Hala, Henkel, Heraeus, Hitachi, Hitachi Chemical, Honda, Indium Corporation,
Infineon, Intel, International Rectifier, IXYS, KCC, Kisco Conformal Coating, Kyocera, LS, Macmic, Microsemi, Mitsubishi Electric,
Mitsubishi Materials, Momentive, Müller-Ahlhorn, Nusil Technology, Plansee, Powerex, Powerstax, On Semiconductor, Ravelin
Materials, RHPTechnology, RUISIL, Schneider Electric, Semikron, ShinEtsu, Specialty Coating Systems (SCS), Shanghai Hua Hong
NEC, Shin Etsu, Siemens, Starpower, STATS ChipPAC, STMicroelectronics, Tesla,Texas Instruments,Toshiba,Toyota,TSMC,
Valeo,Vincotech, Vishay,Wacker, and more.

7
POWER MODULE MARKET
Power
modules,
discretes or
embedded ?
Inverter
power
Functionality
integration
More
Less
IPM
Small device, small power.
All-in-one: IGBT, diodes, drivers
and control.
Discrete packaging
Small device, medium power.
All in one: MOSFET, IGBT, or co-pack
IGBT and diode.
6-in-1 power module
Large device, medium power.
Six IGBTs and diodes.
IGBT driver is external.
Single power
module
Large device, large power.
One IGBT and diode.
Several chips to handle the
current.
IGBT driver is external.
MW range100s kW range10s kW rangeWatt to kW range
IPM: Intelligent Power Module
Embedded Package
Small device.
Small heat dissipation
Semiconductor embedded in
PCB.
2-in-1 & 1-in-1
power modules
Medium power.
2 or 1 IGBT packaged
together with the diode.
Trend in EV/HEV
New packaging trends
Packaging type by power inverter

8
POWER MODULE MARKET
Power module market revenue, split by application
The power
module market
will experience
a CAGR2017-2023
of 7.8%.

9
GLOBAL TRENDS FOR POWER MODULE PACKAGING
Technology trends
about packaging
materials
Yole Développement’s
vision about the
coming years

10
GLOBAL TRENDS FOR POWER MODULE PACKAGING
Impact of double-sided cooling designs on choice of packaging materials
Double-side
cooling will
have a strong
impact on the
choice of
packaging
materials.
• Impact of double-sided
cooling:
• Wire bond-free
interconnections will
be significantly
reduced.
• Baseplates are no
longer used.
• Epoxy will be better
adapted for use than
silicone gel.
• New requirements
will arise such as
spacers, top-die
attach and topside
substrates.
Interconnections
Wire bonds
Wire bond-free
Encapsulation
Epoxy
Silicone gel
Substrate
Ceramics
Lead frame
Other
Baseplate
+ Top-die attach
+ Spacers
Double-side power
module cooling design
Impact of power module design on the choice of packaging materials: an example of a double-side cooling design.
Yole Développement

11
LAST TECHNOLOGY INNOVATIONS
In…
Interconnections
Die-attach
Substrate-
attach

12
DIE AND SUBSTRATE ATTACH
Yole’s vision of the soldering-to-sintering transition
The eagerness
of different
power module
manufacturers
to make the
transition to
sintering
technology
depends on
their
technology and
market
positioning.
Newcomers will
build new manufacturing
lines with a free choice
of die attach technology.
Source: Yole Développement
Still in
development

13
LAST TECHNOLOGY INNOVATIONS
In…
Encapsulation
Substrates
Baseplates
TIM

14
ADVANCED PACKAGINGTECHNOLOGIES FOR POWER
At what level does advanced packaging inspire power packaging?
In recent years,
synergies
between advance
packaging
technologies and
power packaging
have popped-up.
Microelectronics
Power Electronics
Low power
Medium power
High power
Devices
Power
Packaging
Advanced Packaging
Power Packaging
Synergies
sought
here!
Some advanced packaging solutions can be adapted for packaging of low-power
power electronic devices.
Yole Développement

15
MARKET & FORECASTS
2017 - 2023
Forecasts for
2018-2023
Markets per
technology &
per
application in
cm2 or cm3
and in million
USD

16
CASE STUDY
ST Microelectronics’ SiC Modules in TESLA’s Model S3 2017
Tesla’s
Model S3
2017 is
equipped
with ST’ SiC
MOSFET
power
modules
Source: System Plus Consulting
Source: System Plus Consulting
Latest case studies
of innovative
module packaging
in commercial
modules

17
BUSINESS MODEL AND SUPPLY CHAIN ANALYSIS
Yole Développement
analysis on business
models and supply-chain
evolution
Power module
manufacturers
positioning
M&A

18
FOCUS ON SiC & GaN PACKAGING
Special chapter for SiC & GaN packaging challenges,
developments and solutions

19
RELATED REPORTS

2017 was an impressive year for the IGBT power
module market, as it grew 18.1% compared to
2016. And so far, the perspectives for 2018 are
even better, with over 20% growth in the first half
of the year. The main explanation of this drastic
market explosion is the boost from the electrical
and hybrid electric vehicle (EV/HEV) sector,
especially in China. It has also been an exceptional
year for industrial motor drives in Asia.
Other device modules, like those based on
MOSFETs and bipolar transistors, show a slight
decrease. Consequently the overall power module
market value ended at $3.54B, growing 11.3%
year-on-year. By 2023 the market is expected to
be over $5.5B. This promising market is beneficial
for the packaging material business that Yole
Développement (Yole) covers in this report,
“Power Module Packaging 2018”.
The power module packaging material business is
worth $1.2B, a little more than a third of the total
power module market. It is a very dynamic market,
where continuous innovations and material
enhancements and a lot of R&D investment are
needed. This power module packaging material
market’s compound annual growth rate (CAGR)
for 2017-2023 will be 8.2%, coming close to a $2B
business opportunity by 2023.
In terms of technology, the report takes a deep
look into substrates, baseplates, die-attach,
substrate-attach, encapsulation, interconnections
and thermal interface material (TIM) markets.
Almost 50% of the current $1.2B market value
is substrates and baseplates. Another 25% of
that market is exclusively from die-attach and
substrate attach materials. Major technological
choice trends in these segments can therefore
rapidly impact the power module packaging
overall market.
For instance, the penetration of silver sintering as
a die-attach technology is increasing among the
industry, and even arriving in some EV/HEV power
modules. As this technology is more expensive,
the CAGR2017-2023 for the die-attach market
is 11%, much higher than for the other market
segments.
The second highest CAGR2017-2023 is for
interconnections, at 9.5%. This is because new
interconnection technologies, like flexible
interconnection foils, are more costly compared
to more cost-effective but less reliable aluminum
wire-bonding. The other major technological
change that will impact the global market will be
an increasing use of silicon nitride (Si3N4) active
metal brazing (AMB), which will capture 37% of
the power module substrate market by 2023.
As the demand for Si3N4 increases, its high cost
is expected to decrease faster than the other
ceramic materials.
POWER MODULE PACKAGING 2018: MATERIAL MARKET
AND TECHNOLOGY TRENDS
Market & Technology report - July 2018
THE IGBT POWER MODULE MARKET GREW 18.1% IN 2017, DRIVING THE
POWER MODULE PACKAGING MATERIALS BUSINESS
Power packaging is continuously adapting to power application market trends.
KEY FEATURES
• Presentation of detailed analysis of
thermal interface materials (TIMs),
thermomechanical issues in power
modules and case studies and
technological innovations
• 2017-2023 market value for
the power electronics field and
especially for power modules
• Complete analysis of power
module packaging design
• Deep insight into each part of a
standard power module package:
substrate, baseplate, die attach,
substrate attach, encapsulation and
interconnections
• Technology trends and roadmaps
• 2017-2023 market metrics
and forecasts for each type
of packaging component
(substrate, baseplate, die attach,
substrate attach, encapsulation,
interconnections and TIMs)
• Evolution of different business
models
• Supply chain analysis and evolution
trends
• Complete presentation of Wide
Band Gap device packaging
• Packaging trends for the coming
years
WHAT’S NEW
• Focus on packaging for Wide Band
Gap devices
• Analysis of the newest power
module designs, including the Tesla
Model 3 power module, Mitsubishi
J1-series and Infineon’s HybridPack
Drive
• Insight into emerging business
models within the supply chain
• 2017-2023 market metrics and
forecasts for thermal interface
materials (TIMs)
(Yole Développement, July 2018)
Power module packaging: 2017 -2023 raw material market
size per packaging part
US$ 1.2B
US$ 1.9B
2023
2017
Substrate
Baseplate
Substrate
attach
Casing
Interconnections
Die
attach
Encapsulation
Baseplate
Substrate
attach
Casing
Interconnections
Substrate
Die
attach
Encapsulation
US$
111 M
US$
148 M
US$
201 M
US$
271 M
US$
66 M
US$
85 M US$
75 M
US$
147M US$
155 M
US$
277 M
US$
349 M
US$
390 M
US$
518 M
US$
307 M CAGR 8.2%
US$
147 M

POWER MODULE PACKAGING 2018: MATERIAL MARKET AND TECHNOLOGY TRENDS
NEW CHAPTERS: A WBG PACKAGING - TESLA’S MODEL 3 POWER MODULES -
MITSUBISHI ELECTRIC’S J1 SERIES INNOVATIVE INTEGRATED SUBSTRATES
The Power Module Packaging 2018 report has several
newfeatures,includinganentirechapterwhichfocuses
on WBG module packaging challenges, innovations
and future trends. Yole has also introduced the TIM
market and its forecasts as part of the power module
packaging market, building on the 2017 report, where
just the different TIM technologies were described.
Yole’s analysts have also now analyzed the Transient
Liquid Phase Soldering (TLPS) technology as a future
alternative to die-attach.
An exciting, fresh, case study explores Tesla’s Model
3 power module, which has been manufactured by
STMicroelectonics and reverse engineered by System
Plus Consulting. Similarly, photos and an explanation
of Mitsubishi Electric’s J1-series power module, with
its very innovative integrated ceramic and baseplate
pin-fin substrate design secrets. The Power Module
Packaging 2018 report will bring you all these latest
innovations and much more.
Technical trends in power module packaging are
mainly driven by the entrance of the Wide Band
Gap (WBG) materials and the challenging system
requirements of the booming EV/HEV industry.
Indeed, the introduction of the WBG semiconductors
SiC and GaN is pushing the development of new
power packaging solutions, as these devices can work
at higher switching frequencies and higher junction
temperatures.
In order to take advantages of SiC’s properties,
reliable and robust die attach technologies that
work at 200 °C are required. Silver sintering is today
the big star for SiC power modules, due to its high
melting temperature point, exceeding 900°C. In term
of substrates, high thermal conductivity materials
will be chosen such as AlN and Si3N4, as dies need
to dissipate the losses from a smaller surface. In
addition, the interconnection technology is a key
factor for the good performance of SiC devices. Many
companies are therefore developing their own low-
stray inductance interconnections such as GE’s Power
Over Lay (POL) or Semikron’s SKiN technology.
In contrast, GaN devices are not yet packaged in
power modules, and are using advanced packaging
technologies. GaN Systems’ printed circuit board-
embedded GaN packages are the best example.
The EV/HEV industry’s demanding requirements for
high power density and mechatronics integration
are driving many of the other power packaging
innovations. Today, there are two clear trends:
over-molded double-side cooled modules for hybrid
cars and single-side cooled modules with pin-fin
baseplates for battery-only electric cars.
This report summarizes other tendencies such as
the use of organic insulator foils in insulated metal
substrates (IMS) and the “integrated substrates” that
merge a ceramic substrate and a pin-fin baseplate.
With all these new technologies, the EV/HEV power
packaging landscape is fast-evolving and dynamic. That
is why Yole follows the leading packaging material
suppliers like DOWA, Denka, Rogers and Alpha,
and the module manufacturers like Bosch, Mitsubishi
Electric and Semikron, very closely to quickly
understand their future technology innovations.
SiC module packaging: Main technologies that will need to evolve
Substrate
High thermal
conductivity ceramics
such as AlNand
Si3N4.
Encapsulation
High-temperature
epoxy or silicone gel.
Die attach
Silver sintering is
expected to become
the preferred choice.
Interconnections
Low-inductance
interconnections.
SiC chips:
High Tj and
high frequency
New designs and new materials are needed
Example of STMicroelectronics’ SiC MOSFETs modules
in Tesla’s Model 3*
Example of STMicroelectronics’ SiC MOSFETs
modules in Tesla’s Model 3
reverse engineered by System Plus Consulting
* Extracted from System Plus Consulting
report :Tesla Model 3 Inverter with SiC Power
Module from STMicroelectronics, June 2018
SILVER SINTERING, NEW SUBSTRATES AND INTERCONNECTION TECHNOLOGIES
ARE THE LATEST INNOVATIONS DRIVEN BY EV/HEV AND THE ARRIVAL OF WBG

MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
ABB, ACC, Alpha, AM2T, Amkor, AOS, APE, aPSI3D, Avator, ATS, BlueStar, Silicones Bosch, BYD,
CeramTec, Comelec, Continental, CPS Technologis, Danfoss, Delphi, Denso, Dow Corning, Dowa,
Dupont, Dynex, Electrolube, Fuji Electric, GaN Systems, GE, General Electric, Hala, Henkel, Heraeus,
Hitachi, Hitachi Chemical, Honda, Indium Corporation, Infineon, Intel, International Rectifier, KCC,
Kisco Conformal Coating, Kyocera, LS, Mersen, Mitsubishi Electric, Mitsubishi Materials, Momentive,
Müller-Ahlhorn, Nusil Technology, Plansee, Powerex, Powerstax, Ravelin Materials, RHP Technology,
RUISIL, Schneider Electric, Semikron, Shin-Etsu, Specialty Coating Systems (SCS), Shanghai Hua
Hong NEC, Shin Etsu, Siemens, Starpower, STATS ChipPAC, STMicroelectronics, Texas Instruments,
Toshiba, Toyota, TSMC, Valeo, Vincotech, Wacker, and more.

Objectives of the report 4
Executive summary 8
Overall power electronics market 37
Power module market 42
Global trends for power module
packaging 48
Thermomechanical issues in power
modules 63
Power module packaging 71
Composition of a conventional power
module 73
Power module materials and process
choice 77
Interconnections 82
Die and substrate attach 97
Encapsulation 121
Substrates 139
Baseplates 156
Thermal Interface Materials (TIMs) 172
Power modules - case studies 193
Raw materials market for power
packaging 208
Specific market analysis of each part of the
module: Interconnections in power
modules 211
Die attach for power modules 215
Substrate attach for power modules 220
Encapsulation for power modules 225
Substrates for power modules 230
Baseplates for power modules 235
TIM for power modules 240
Business model and supply chain analysis 245
Wide-band gap packaging 286
General conclusions 305
TABLE OF CONTENTS (complete content on i-Micronews.com)
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OBJECTIVES OF THE REPORT
• Highlight power module packaging
market analysis and forecasts
• Provide a deep insight into state-
of-the-art package designs and
materials
• Describe the current packaging
challenges for SiC and GaN Wide
Band Gap devices
• Identify the key technology trends
that will shape the market in the
future
• Understand the main challenges
and proposed innovations
• Deliver supply chain analysis and
trends
Mattin Grao Txapartegi
investigates power packaging
solutions to analyze the latest
technical challenges, market growth and
competitive landscape. Getting a deep
understanding of the technology evolution, the
market trends and the strategies of each player
are part of his mission at Yole. Previously he
acquired a comprehensive expertise in the
design of power converters for EV at Renault
(France). As an engineer, Mattin graduated
from Grenoble INP (FR) with specialization in
embedded systems for transportation. He has
also an advanced master in aeronautics from the
Arts Métiers ParisTech (FR).
Dr. Milan Rosina has 20
years of scientific, industrial
and managerial experience
involving equipment and process development,
due diligence, technology, and market surveys
in the fields of renewable energies, EV/HEV,
energy storage, batteries, power electronics,
thermal management, and innovative materials.
He previously worked for the Institute of Electrical
Engineering in Slovakia, Centrotherm (Germany),
Fraunhofer IWS (Germany), CEA LETI in France,
and utility company ENGIE in France.
Dr. Rosina received his Ph.D. degree from
National Polytechnical Institute (Grenoble,
France).
Alejandra Fuentes
Suarez daily researches
the latest developments in
power converter topologies, passive
components, power modules packaging
and EV/HEV. Previously Alejandra acquired
extensive expertise in the design of power
converters for solar, wind, hydro and
motor drive applications at Semikron
(France). Alejandra graduated from UJF
(Grenoble, FR) and INP (Grenoble, FR)
as an electrical engineer, specializing in
design of power electronics system. She
also holds an advanced master’s in the
field of Marketing and Management of
Energy from the Grenoble Business School
(Grenoble, FR).
As analysts within the Power Wireless division at Yole Développement (Yole) Alejandra Fuentes Suarez,
Dr. Milan Rosina and Mattin Grao Txapartegi co-authored the Power module packaging 2018: Material market
and technology trends report:
AUTHORS
ASSOCIATED REPORT
Automotive Power Module Packaging
Comparison 2018 - Structural, Process and
Cost Report by SystemPlus Consulting
A cost-oriented review of power module packaging
technologies for the automotive market.
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Yole Développement
From Technologies to Market
Source: Wikimedia Commons

2©2018 | www.yole.fr | About Yole Développement
YOLE DEVELOPPEMENT – 4 DIVISIONS
Life Sciences
Healthcare
o Microfluidic
o BioMEMS
o Inkjet Printing
o Solid-State Medical Imaging BioPhotonics
o BioTechnologies
Power
Wireless
o RF DevicesTechnology
o Compound Semiconductors Emerging Materials
o Power Electronics
o Batteries Energy Management
Semiconductor
Software
o Package Assembly Substrates
o SemiconductorManufacturing
o Memory
o Software Computing
Photonics,
Sensing Display
o Solid-State Lighting Display
o MEMS,Sensors Actuators
o Imaging
o Photonics Optoelectronics
Semiconductor
Software
Power Wireless
Photonics,
Sensing
Display
Life
Sciences
Healthcare

3 BUSINESS MODELS
o Consulting and Analysis
• Market data research,
marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
• Design and characterization of
innovative optical systems
• Financial services (due diligence,
MA with our partner)
www.yole.fr
o Syndicated reports
• Market technology reports
• Patent investigation and patent
infringement risk analysis
• Teardowns reverse costing
analysis
• Cost simulation tool
www.i-Micronews.com/reports
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication webcast
services
• Events:TechDays,forums,…
www.i-Micronews.com

6 COMPANIES TO SERVEYOUR BUSINESS
Due diligence
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
Market,technology and strategy
consulting
www.yole.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
Yole Group of Companies

OUR GLOBAL ACTIVITY
30%of our business
40%of our business
30%of our business
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Yole Inc.
Phoenix
Yole Korea
Seoul
Palo Alto

ANALYSIS SERVICES - CONTENT COMPARISON
Technology
and Market
Report
Leadership
Meeting
QA
Service
Depth of the analysis
Breadthoftheanalysis
Meet the
Analyst
Custom
Analysis
High
High
Low

SERVINGTHE ENTIRE SUPPLY CHAIN
Our analysts
provide
market
analysis,
technology
evaluation,
and business
plans along
the entire
supply chain
Integrators,end-
users and software
developpers
Device manufacturers
Suppliers:material,equipment,
OSAT,foundries…
Financial investors,RD centers

SERVING MULTIPLE INDUSTRIAL FIELDS
We work
across
multiples
industries to
understand
the impact of
More-than-
Moore
technologies
from device
to system
FromA to Z…
Transportation
makers
Mobile phone
and
consumer
electronics
Automotive
Medical
systems
Industrial
and defense
Energy
management

o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market technology analysis, patent
investigation and patent infringement risk analysis, teardowns reverse costing analysis.They cover:
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain…
Our reports are for you!
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,
identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry
landscape.
In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of the
industry.
o In 2018, Yole Group of Companies plan to publish +150 reports.Gain full benefit from our Bundled Offer and receive at least a 36% discount.
REPORTS COLLECTION
www.i-Micronews.com
• MEMS Sensors
• RF devices technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software
• Memory

OUR 2018 REPORTS COLLECTION (1/4)
MEMS SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 – Update
− Silicon Photonics 2018 – Update
− Consumer Biometrics: Hardware Software 2018 – Update
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Acoustic MEMS and Audio Solutions 2017
− MEMS Sensors for Automotive Market Technology Trends 2017
− High End Inertial Sensors 2017
− Magnetic Sensor 2017
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT
– by System Plus Consulting
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product
Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− MEMS Pressure Sensor 2018 – Market Technology Report
− MEMS Pressure Sensor Comparison 2018 – Structure, Process Cost Report
− Gas Particles 2018 – Market Technology Report
− Gas Particles Comparison 2018 – Structure, Process Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market
Technology Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
− MEMS Packaging 2017 – Market Technology Report
− MEMS Packaging Comparison 2017 – Structure, Process Cost Report
RF DEVICES ANDTECHNOLOGIES
− Wireless technologies (Radar, V2X) for Automotive 2018
− RF Standards and Technologies for Connected Objects 2018
− RF Photonic Components Technologies for 5G Infrastructure2018
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT– by System
Plus Consulting
− Automotive Radar Comparison 2018
− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis
o LINKED REPORTS – by Yole Développement, System Plus Consulting andKnowMade
− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market
Technology Report – Update
− RF Front-End Module Comparison 2018 – Structure, Process Cost Report
− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis
− Advanced RF System-in-Package for Cellphones 2018 – Market Technology
Report – Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
Market Technology Report – Update
− RF GaN Comparison 2018* – Structure, Process Cost Report
− RF GaN 2018 – Patent Landscape Analysis
SOFTWARE
− Consumer Biometrics: Sensors Software 2018 – Update
− Processing Hardware and Software for AI 2018 - Vol. 1 2
− From Image Processing to Deep Learning, Introduction to Hardware and Software
Update : 2017 version still available / *To be confirmed

IMAGING OPTOELECTRONICS
− Status of the Compact Camera Module and Wafer Level Optics
− Industry 2018 – Update
− 3D Imaging and Sensing 2018 – Update
− Sensors for Robotic Vehicles 2018
− Machine Vision for Industry and Automation 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− Uncooled Infrared Imagers 2017
− iPhone X Dot Projector – Patent-to-Product Mapping
− Status of the CMOS Image Sensor Industry 2018 – Market Technology Report -
Update
− CMOS Image Sensor Comparison 2018 – Structure, Process Cost Report
− CMOS Image Sensors Monitor 2018* – Quaterly Update**
− Camera Module 2017 – Market Technology Report
− Compact Camera Module Comparison 2018 – Structure, Process Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market Technology
Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
ADVANCED PACKAGING
− Status of Advanced Packaging Industry 2018 – Update
− Status of Advanced Substrates 2018: Embedded Die andInterconnects,
Substrate Like PCB Trends
− 3D TSV and Monolithic Business Update 2018 – Update
− Power Modules Packaging 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Status of Panel Level Packaging 2018
− Trends in Automotive Packaging 2018
− Hardware and Software for AI 2018 - Vol. 1 2
− Integrated Passive Devices (IPD) 2018
− Thin-Film Integrated Passive Devices 2018
− Memory Packaging Market and Technology Report 2018 – Update*
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
o LINKED REPORTS– by Yole Développement and System Plus Consulting
− Advanced RF System-in-Package for Cellphones 2018 – Market Technology Report -
Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− Fan-Out Packaging 2018 – Market Technology Report – Update*
− Fan-Out Packaging Comparison 2018* – Structure, Process Cost Report
MANUFACTURING
− Wafer Starts for More Than Moore Applications 2018
− Equipment for More than Moore: Technology Market Trends
for Lithography Bonding/Debonding 2018
− Polymeric Materials for wafer-level Advanced Packaging 2018
− Laser Technologies for Semiconductor Manufacturing 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Equipment and Materials for 3D TSV Applications 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− Equipment for More than Moore: Technology Market Trends for
Lithography Bonding/Debonding 2018 – Market Technology Report
− Wafer Bonding Comparison2018 – Structure, Process Cost Report

MEMORY
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update*
o QUARTERLY UPDATE – by Yole Développement**
− Memory Market Monitor 2018 (NAND DRAM)
o MONTHLY UPDATE – by Yole Développement**
− Memory Pricing Monitor 2018 (NAND DRAM)
o REVERSE ENGINEERING COSTING REVIEW – by System Plus Consulting
− DRAM Technology Cost Review 2018
− NAND Memory Technology Cost Review 2018
− 3D Non-Volatile Memories – Patent Landscape
COMPOUND SEMICONDUCTORS
− Status of Compound Semiconductor Industry 2018*
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Bulk GaN Substrate Market 2017
− Power SiC 2018: Materials, Devices, and Applications – Market Technology
Report – Update
− SiC Transistor Comparison 2018 – Structure, Process Cost Report
− Power SiC 2018 – Patent Landscape Analysis
− Power GaN 2018: Materials, Devices, and Applications – Market Technology Report
– Update
− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process Cost Report
− Status of the GaN IP – Patent Watch 2018 Patent Activity 2017
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
– Market Technology Report – Update
− RF GaN – Patent Landscape Analysis
POWER ELECTRONICS
− Status of Power Electronics Industry 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Power Electronics for Electric Vehicles 2018 – Update
− Integrated Passive Devices (IPD) 2018
− Wireless Charging Market Expectations and Technology Trends 2018
− Thermal Management Technology and Market Perspectives in Power
− Electronics and LEDs 2017
− Gate Driver 2017
− Power MOSFET 2017
− IGBT 2017
− Market Opportunities for Thermal Management Components in
Smartphones 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting
and KnowMade
− Power Modules Packaging 2018 – Market Technology Report – Update
− Automotive Power Module Packaging Comparison2018 – Structure,
Process Cost Report
− Power ICs Market Monitor 2018 – Quaterly Update**
− Power ICs Market Comparison 2018* – Structure, Process Cost Report
BATTERY AND ENERGY MANAGEMENT
− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –
Update
− Status of the Battery Patents – Patent Watch 2018 Patent Activity 2017
o LINKED REPORTS – by Yole Développement and KnowMade
− Solid State Electrolyte Battery 2018 – Market Technology Report
− Solid-State Batteries 2018 – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer

SOLID STATE LIGHTING
− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update
− Automotive Lighting 2018: Technology, Industry and Market Trends – Update
− UV LEDs 2018: Technology, Industry and Market Trends – Update
− LiFi: Technology, Industry and Market Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− CSP LED Lighting Modules
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
− Horticultural Lighting 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− VCSELs 2018: Technology, Industry and Market Trends – Market Technology
Report
− VCSELs Comparison 2018 – Structure, Process Cost Report
DISPLAYS
− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update
− Displays and Optical Vision Systems for VR/AR/MR 2018
− MicroLED Displays 2018 – Market Technology Report – Update
− MicroLED Display – Patent Landscape Analysis
MEDTECH
− BioMEMS Non Invasive Emerging Biosensors: Microsystems for Medical
− Applications 2018 – Update
− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update
− Neurotechnologies and Brain Computer Interface 2018
− CRISPR-Cas9 Technology: From Lab to Industries 2018
− Ultrasound technologies for Medical, Industrial and Consumer 2018
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Liquid Biopsy: from Isolation to Downstream Applications 2018
− Chinese Microfluidics Industry 2018
− Scientific Cameras for the Life Sciences Analytical Instrumentation
Laboratory Markets 2018*
− Artificial Organ Technology and Market 2017
− Connected Medical Devices Market and Business Models 2017
− Status of the Microfluidics Industry 2017
− Organs-On-Chips 2017
− Solid-State Medical Imaging 2017
− Medical Robotics Market Technology Analysis 2017
− Microfluidic IC Cooling – Patent Landscape
− Circulating Tumor Cell Isolation – Patent Landscape
− OCT Medical Imaging – Patent Landscape
− Pumps for Microfluidic Devices – Patent Landscape 2017
− Microfluidic Technologies for Diagnostic Applications– Patent Landscape 2017
− FLUIDIGM – Patent Portfolio Analysis 2017
− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017
− Organs-On-Chips 2017 – Market Technology Report
− Organ-on-a-Chip– Patent Landscape Analysis

OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent LandscapeAnalysis
− RF Acoustic Wave Filters Patent LandscapeAnalysis
− NMC Lithium-Ion Batteries Patent LandscapeAnalysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N PatentWatch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− Microfluidic Technologies for Diagnostic Applications Patent Landscape
TEARDOWN REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then haveup
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).

MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ON L IN E ON SITE IN PERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility,networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly,and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person.Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience.Webcasts
create very useful,dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
Benefit from the i-Micronews.com
traffic generated by the 11,200+
monthly unique visitors, the
10,500+ weekly readers of
@Micronew se-newsletter
Several key events planned for
2018 on different topics to
attract 120 attendees on average
Gain new leads for your business
from an average of 340
registrants per webcast
Contact: Camille Veyrier (veyrier@yole.fr),Marketing Communication Project Manager

CONTACT INFORMATION
o CONSULTINGANDSPECIFICANALYSIS,REPORT
BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director for Western US
Canada
Email: laferriere@yole.fr – + 1 310 600-8267
• Troy Blanchette, Senior Sales Director for Eastern US
Canada
Email: troy.blanchette@yole.fr – +1 704 859-0453
• Japan Rest ofAsia:
• Takashi Onozawa, General Manager,Asia Business
Development (Korea, Singapore, India ROA)
Email: onozawa@yole.fr - +81 34405-9204
• Miho Othake, Account Manager (Japan)
Email: ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Japan)
Email: oshiba@yole.fr - +81-80-3577-3042
• Greater China: MavisWang, Director of Greater China Business
Development
Email: wang@yole.fr - +886 979 336 809
• Europe: Lizzie Levenez,EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• RoW: Jean-Christophe Eloy,CEO President,Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnershipwithWoodside
CapitalPartners)
• Jean-Christophe Eloy,CEO President
Email: eloy@yole.fr - +33 4 72 83 01 80
• Ivan Donaldson,VP of Financial Market Development
Email: ivan.donaldson@yole.fr - +1 208 850 3914
o GENERAL
• Public Relations: leroy@yole.fr - +33 4 72 83 01 89
• Email: info@yole.fr - +33 4 72 83 01 80
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