Power SiC 2018: Materials, Devices and Applications 2018 Report by Yole Developpement

From Technologies to Market
July 2018
Power SiC 2018:
Materials, Devices
and Applications
From Technologies to Market
Sample

2
Biography and contact
ABOUTTHE AUTHORS
Dr. Hong LIN
Dr. Hong Lin has worked atYole Développement as a Technology and Market Analyst since 2013, specializing in
compound semiconductors and providing technical and economic analysis. Before joiningYole Développement,
she worked as an R&D Engineer at Newstep Technologies, overseeing the development of cold cathodes made
by plasma-enhanced chemical vapor deposition for nanotechnology-based visible and UV lamp applications. She
holds a PhD in physics and chemistry of materials.
Email: lin@yole.fr
Dr. AnaVILLAMOR
Dr Ana Villamor serves as a Technology & Market Analyst | Power Electronics at Yole Développement. She is
involved in many custom studies and reports focused on emerging power electronics technologies, including
device technology and reliability analysis. Previously Ana was involved in a high-added value collaboration related
to of SJ Power MOSFETs, within the CNM research center for the leading power electronic company ON
Semiconductor. During this partnership, and after two years as Silicon Development Engineer, she acquired
relevant technical expertise and a deep knowledge of the power electronic industry. Ana is author and coauthor
of several papers as well as a patent. She holds an Electronics Engineering degree completed by a Master in
Micro and Nano electronics, both from UAB (SP).
Email: villamor@yole.fr
Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

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TABLE OF CONTENTS
• Executive Summary 9
• SiC Power Device market revenue
• SiC Power Device bare die market revenue
• SiC Power Device bare die market share
• SiC Power Device overview
• SiC diode market in 2017
• Projection of the SiC diode market by 2023
• SiC discrete transistor
• Why use SiC in the main inverter?
• Does SiC cross the chasm? (OBC market)
• Does SiC cross the chasm? (Main inverter
market)
• Full SiC module
• 2017 market share estimate for SiC power
device manufacturers
• Supplier development status
• How fast can new wafer capacity be ready?
• SiC substrate cost
• Production capacity vs demand
•
• What could happen for the SiC power industry in
5 to 10 years?
• Roadmap for SiC power industry drivers
• News 37
• Report Comparison 42
• What’s new in the 2018 report?
• Comparison withYole’s previous forecasts
• What we got right and what we missed
• Why use SiC for Power Electronics
Applications? 50
• Power device technology life cycle
• GaN vs SiC vs Si
• Why use SiC power devices?
• Power vs frequency in electronics
• Power density enhancement from 1980-2020
• WBG market segmentation as a function of
voltage range
• SiC Device Market 57
• SiC Device Market Revenue
• ElectrifiedVehicle Market 66
• EV/HEV market evolution

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TABLE OF CONTENTS
• Different types of electrified vehicles –
definition
• Power converters in EV/HEV - Si based
solutions
• Silicon power semiconductor market in
EV/HEV: 2017VS 2023
• SiC devices add value to electrified
vehicle applications
• SiC devices add value to electrified
• SiC advantages vs EV applications.
• Why use SiC in the main inverter? (cost
aspect)
• Trends towards higher battery voltage
• Why go to 800V battery pack voltage for
electric vehicles?
• SiC potential market in EV/HEV
• Opinions about SiC penetration in
EV/HEV (as of 2018)
• Device manufacturer visions
•
• Opinions about SiC penetration in EV/HEV
(As of 2018)
• Reasons for OEMs
• Electrified vehicle charging solutions
• SiC in on-board chargers
• Does SiC cross the chasm? (OBC market)
• Does SiC cross the chasm? (Main inverter
market)
• WBG implementation in EV/HEV
• Infineon’s roadmap for EV/HEV SiC
products
• SiC component evaluation by Toyota
• Automotive-grade SiC power devices
• Before mass adoption, what must SiC do?
• SiC device market revenue in electrified
• SiC device bare die market revenue in
electrified vehicle applications
• EV/HEV market – Conclusions
• Electrified Charging Infrastructure 105
• Electrified vehicle charging solutions

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TABLE OF CONTENTS
• Charging infrastructure development
• Geographical split of PHEV & BEV
• Chinese EV/HEV market development
versus government target
• Charging infrastructure development
• Worldwide newly installed DC charging
infrastructures (units)
• Increasing battery pack energy capacity
per electric vehicle
• Towards 800V battery pack for electric
vehicles
• Power charging voltage range
• 350 kW ultra-high power charging
points
• SIC device market value in xEV charging
infrastructure, in $M
• SIC device bare die market value in xEV
charging infrastructure applications
• Photovoltaic Inverters 122
• PV inverters
• SiC player positioning
• Added value from SiC in residential
applications
• SiC in photovoltaic string inverters
• SiC in central photovoltaic inverters
• SiC in microinverters
• SiC implementation as a function of PV
classification
• PV market provisions
• SiC device market revenue in
photovoltaic applications
• SIC device chip market revenue in
photovoltaic applications
• SiC for solar power – Conclusions
• PFC and Power Supply 140
• Power supply - industry trends
• Power supply market segmentation

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TABLE OF CONTENTS
• Power supply unit standard
• Replacing Si MOSFET with SiC
• Developments in PFC topology
• Replacing Si MOSFET with SiC
• SiC penetration in PFC and power
supply
• SiC device market revenue in PFC for
power supply applications
• SiC device bare die Market revenue in
PFC for power supply applications
• Power supply – Conclusions
• Uninterruptible Power Supplies 156
• UPS market - definition and architecture
• SiC use in the UPS sector
• SiC penetration in the UPS sector
• Can SiC help save money for UPS
applications?
• WBG penetration in the UPS sector
• SiC device market value in UPS
applications
• SiC device bare die market value in UPS
applications
• Motor Drive Market 166
• Motor drive application
• Opportunities for SiC in motor drives
• Challenges for SIC integration in motor
drives
• SiC implementation in motor drives
• SiC device market value in motor drive
applications
• SiC device bare market value in motor
drive applications
• SiC for motor drive – Conclusions
• Power Converters forWind Turbines 177
• Wind turbine market
• Architecture
• DFIGs vs. full converters
• Power devices used in wind applications
and SiC targets
• Silicon power devices currently used in
wind applications
• SiC in medium voltage drives for wind
power conversion

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TABLE OF CONTENTS
• SiC device market revenue in wind
power applications
• SiC device bare die market value in wind
power applications
• Are SiC devices ready for wind power?
• Rail Traction Market 187
• Segmentation
• Power devices in different train types
• SiC implementation in rail traction
• Hybrid SiC inverters for rail traction
• On-track testing of SiC hybrid inverters
• Full SiC inverters for rail traction
• SiC for auxiliary power in trains
• Focus on CRRC
• ROLL2RAIL – Shift2RAIL
• Is SiC ready? (Cost aspect)
• SiC device market value in rail traction
applications
• SiC device bare die market value in rail
traction applications
• SiC for rail – Conclusions
•
• Other SiC Applications 207
• Battery Chargers
• SiC for induction heating generators
• Possible applications of SiC in
aeronautics
• SiC for military applications
• SiC for space applications
• SiC JFET for protection applications
• Yole’s understanding of the status of SiC
in other applications
• SiC Device Market:Voltage Analysis 218
• SiC device market revenue
• SiC power device bare die market
revenue
• SiC diode bare die market share split by
voltage
• SiC transistor bare die market share split
by voltage
• SiC bare die market share split by
voltage
• SiC power device bare die market share

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TABLE OF CONTENTS
• SiC power device overview
• SiC diode market in 2017
• Projection of the SiC diode market by 2023
• SiC discrete transistor
• Hybrid and full SiC module
• SiC Power DeviceTechnology 234
• SiC power devices 236
• SiC MOSFET vs. Si device benchmark
• SiC MOSFET:Trench vs planar
• 200V SiC MOSFET technology evolution
• SiC diode vs MOSFET technology
process
• Critical step processes
• Packaging 245
• Discrete device packaging
• Discrete device packaging-Case study
• Commercially-available Intelligent Power
Module examples
• Full SiC module packaging
• Development of junction temperature
inside SiC power modules
• Innovative packaging for SiC in R&D
• Full SiC module
• SiC device packaging-conclusions
• Integration 268
• Integration of silicon vs SiC
• Integration challenges
• Gate driver
• Capacitors for SiC devices
• Capacitors for high temperature
• Capacitors forWBG semiconductors
• SiC power stacks
• Innovative integration for SiC in R&D
• SiC device integration-conclusions
• SiC Device Reliability Status 279
• SiC reliability analysis
• Reliability main concerns
• Is reliability an issue for SiC?
• SiC reliability analysis
• SiC power reliability
• SiC reliability
• SiC Power Device Commercial Status 289
• SiC power device timeline

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TABLE OF CONTENTS
• SiC MOSFET technology developments
• SiC power device overview
• Discrete SiC MOSFETs
• Known discrete SiC MOSFETs
• Focus on high-voltage SiC Devices
• SiC device roadmap
• SiC power device commercial status –
conclusions
• SiC Power Device Industry Landscape 299
• Involvement origins of SiC power device
manufacturers as of 2018
• Development of pure SiC power device
manufacturers
• SiC power industry business models as of
2018
• From prototype to mass production
• 2017 market share estimate for SiC power
device manufacturers
• 2017 revenue estimate for SiC power device
manufacturers
• SiC power industry – conclusions
• Focus on Cree/Wolfspeed
• Focus on China
• A special focus on China
• China’s surge in SiC Wafer production
capacity
• Will Chinese SiC wafer players reshape
the market?
• Focus on China – conclusions
• SiC Wafer and Epiwafer Market 314
• SiC wafer process
• SiC growth technologies
• Difficulty of SiC growth
• Technology readiness for SiC production
• SiC: From polytype to devices
• SiC wafer supplier status
• Map of SiC players, including R&D
players
• Development in SiC substrate size
• 6” SiC wafer supply
• Supplier development status
• SiC materials producer status
• SiC wafer development axes
• SiC wafer capital investment

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TABLE OF CONTENTS
• How much investment is needed for 1 million
6’’ SiC wafers?
• How fast can new wafer capacity be ready?
• SiC substrate cost
• SiC-based MOSFET wafer cost structure
• Wafer cost impact
• Production capacity vs demand
• SiC n-type substrates - average price
estimation
• SiC n-type substrate market - volume
projection, in units
• SiC n-type substrate market size projection
• SiC n-type substrate market value projection
• Market share estimate for n-type SiC
substrate players
• 2017 revenue estimate for SiC wafer
manufacturers
• SiC epi-wafer manufacturing
• SiC epi-house and epi-services
• SiC epiwafers
• Integration of SiC epi
• SiC epiwafer market
•
• SiC wafer and epiwafer market- conclusions
• IP 350
• SiC Schottky barrier diode (SBD)
• SiC MOSFET
• SiC power module/system
• SiC wafer
• Intellectual property - conclusions
• SiC Power Industry Ecosystem 358
• SiC wafering
• Power SiC industry Ecosystem
• SiC backside thinning
• SiC device processing
• Power SiC industry ecosystem – conclusions
• Open Discussion and Perspectives 383
• Primary drivers for using SiC in different
applications
• Lifecycle of the SiC transistor and diode
market
• SiC power industry - main challenges as of
2018
• SiC industry - Geographic analysis as of 2018

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TABLE OF CONTENTS
• Power device price: Si vs SiC
• SiC MOSFET vs Si IGBT
• Market Penetration rate of 600V/650V SiC
transistors
• Si vs SiC vs GaN: 600V
• Si vs SiC vs GaN: High voltage
• Transistor market 2017 vs 2023
• SiC vs silicon power semiconductor market
Share
• SiC transistor vs IGBT and MOSFET market
share
• SiC transistor vs IGBT market share
• SiC market share split by discrete vs module
• Outlook over ten years
• Key players and power electronics landscape
• What could happen to the SiC power
industry in 5 to 10 years?
• Roadmap for SiC power industry drivers
• General Conclusions 406

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WHAT IS IN THIS REPORT?
• Why SiC-based materials are interesting options for
power electronics applications.
• Yole’s vision for SiC penetration in different
applications:
• xEVs
• Charging infrastructure
• PV
• Power supplies
• UPSs
• Motor drives
• Wind power
• Rail applications
• State-of-the-art SiC-based devices, modules, and power
stacks and their commercial statuses.
• SiC power device market projections through to 2023,
including:
• Bare die market split between transistors and diodes.
• Device market split by application.
• Device market split into discrete components and
modules.
• Analysis of SiC power device voltages.
• Description of the SiC substrate and epiwafer market
and market size projections through to 2023
• A description of the industrial SiC power landscape,
from materials to systems.

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COMPANIES CITED IN THIS REPORT
ABB,Alstom,Ascatron,Aymont, Bombardier, Basic Semiconductor, Brückwell Technology, Caly Technology, Cree, CRRC, Danfoss,
Delphi, DENSO, Dow Corning, Episil, Epiworld, Fraunhofer IISB, Fuji Electric, GE, GeneSiC, Global Power Device, Global Power
Technology, Hestia Power, Hitachi, IBS, II-VI, Infineon, MicroSemi, Mitsubishi Electric, Norstel, Northrop Grumman, NXP, ON
Semiconductor, Panasonic, Philips, Powerex, Raytheon, RENESAS, ROHM, Sanrex, Schneider Electric, Semikron, Shindengen, SICC,
Siemens, SMA, STMicroelectronics,Toshiba,Toyota, United Silicon Carbide,WeEn, X-Fab,Yaskawa, and more

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LIST OF ABBREVIATIONS USED IN THIS REPORT
AMB Active Metal Brazed
A, Amp Ampere
ASP Average Selling Price
BEV Battery Electric Vehicle
BJT Bipolar Junction Transistor
BOM Bill Of Materials
BPD Basal Plane Dislocation
BTS Base Transceiver Station
CAGR Compound Annual Growth Rate
CCM Continuous Conduction Mode
CTE Coefficient of Thermal Expansion
CVD Chemical Vapor Deposition
DC Direct Current
DCB Direct Copper-Bonded
DD Dislocation Density
DFIG Double-Fed Induction Generator
DMOS Diffused Metal Oxide Semiconductor
EREV Extended Range Electric Vehicle
EMC ElectroMagnetic Compatibility
EMI ElectroMagnetic Interference
xEV
Electric Vehicle/Hybrid Electric
Vehicle
GaN Gallium Nitride
FCV Fuel Cell Vehicle
FET Field Effect Transistor
GIT Gate Injection Transistor
GTO Gate Turn-Off
HEMT High Electron Mobility Transistor
HEV Hybrid Electric Vehicle
HVAC Heating, Ventilation and Air Conditioning
HVDC High-Voltage Direct Current
JBS Juction Barrier Schottky
JFET Junction Field Effect Transistor
IC Integrated Circuit
IGBT Isolated Gate Bipolar Transistor
IGCT Integrated Gate-Commutated Thyristor
IPM Intelligent Power Module
IH Induction Heating
MESFET Metal-Semiconductor FET
MISFET Metal-Insulator FET
MOSFET Metal-Oxide-Semiconductor FET
MOCVD
Metal-Organic Chemical Vapor
Deposition
NEV Neighbourhood Electric Vehicle
Ron/Rdson On-state Resistance
LLC
A power converter that is a variant of a
series resonant converter, using two
inductors (Lmagnetizing and Lresonant)
and a capacitor (C).
LV-HV Low Voltage to High Voltage
OBC On-Board Charger
OEM Original Equipment Manufacturer
PEPDC
Primary Electrical Power Distribution
Center
PCB Printed Circuit Board
PCS Power Conversion System
PCU Power Control Unit
PFC Power Factor Correction
PHEV Plug-in Hybrid Electric Vehicle
POL Point-Of-Load
PSU Power Supply Unit
PV PhotoVoltaic
PWM Pulse Width Modulation
RF Radio Frequency
SBD Schottky Barrier Diode
SD Surface Defect
Si Silicon
SI Semi-insulating
SiC Silicon Carbide
SJMOSFET Super Junction MOSFET
SMD Surface Mount Device
SMPS Switching Mode Power Supply
SSV Start-Stop Vehicle
T° Temperature
TAM Total Available Market
T&D
Electricity Transport and
Distribution
UPS Uninterruptible Power Supply
VSC Voltage Source Converter
WBG Wide Band Gap

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YOLE METHODOLOGY:TOP-DOWN AND BOTTOM-UP APPROACHES
To achieve
market
estimations,
Yole uses two
approaches:
top down and
bottom up.
Top-down
Bottom-up
From systems to device market
From substrate to device market
System inverter device Wafer
Wafer

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Wafer Epiwafer Device Module Inverter
End
applications
REPORT OBJECTIVES
• Provide a clear understanding of the SiC power industry, covering markets from wafer to
discrete/module (Units & M$).
• Analysis the market drivers/bottlenecks of SiC power industry drivers
by analysis the SiC adoption by different end applications and supply chain.
• Understanding the technology status of SiC power device technology
• Describe the industry playground
Report focus

17
EXECUTIVE SUMMARY 2018

18
SIC POWER DEVICE MARKET REVENUE
Split by application
The total SiC-
based power
device market is
expected to grow
steadily, reaching
almost $1.4B in
2023.
Including discrete diodes, discrete transistors, diode bare die in hybrid modules and full SiC modules.

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SIC POWER DEVICE OVERVIEW
* Danfoss: customer power module Power SiC 2018: Materials, Devices and Applications | Sample | www.yole.fr | ©2018

20
DOES SIC CROSS THE CHASM? (MAIN INVERTER MARKET)
As of 2018 understanding
As shown
earlier, main
inverter
presents the
biggest
opportunity for
SiC.The
adoption or not
of SiC will be
critical for the
SiC power
device market.
We indeed
heard about
different
projects, but we
don’t have any
concrete names
behind these
projects.
100%

21
SIC POWER RELIABILITY
What will be changed? (1/2)

22
ROADMAP FOR SIC POWER INDUSTRY DRIVERS
Yole’s interpretation as of 2018
2000 2010 2020 2030
Schematic illustration
Unipolar: power
conversion

23
NOTEWORTHY NEWS - 4/4
• Aug 2017, Nippon Steel & Sumitomo Metal Corporation (NSSMC) and Nippon Steel & Sumikin Materials Co., Ltd. decided to
terminate SiC research and business development in 2018. NSSMC group decided to transfer relevant assets and technologies to Showa
Denko K.K. (“Showa Denko”).
• Aug 2017, Pallidus launched M-SiC silicon carbide source material and technology platform.
• Sep 2017, Ascatron announced the availability of SiC components using its in-house technology. SBD and PiN diodes are available and
MOSFETs are under development and will be available in 2018.
• Oct 2017, Infineon released the sixth and latest generation of SiC diodes.
• Oct 2017, Littelfuse launched its first series of SiC MOSFETs as the latest addition to its growing power semiconductor line.
• Dec 2017, ROHM tested SiC power module in FORMULA E race cars.
• Jan 2018, CRRCTimes Electric announced the success of the trial production of 6 inch SiC chip production line.
• Jan 2018, Littelfuse completed the acquisition of IXYS.
• Jan 2018, Disco developed DAL7440 KABRA laser saw for 8-inch SiC wafers.
• Jan 2018, SDK to expand SiC epi capacity to 7000 wafers per month by September in 2018.
• Jan 2018, CRRC completed 6’’ SiC production line.
• Feb 2018, Cree signed $100M long-term deal to supply 150mm SiC wafers to Infineon.
• Feb 2018, SILTECTRA validated twinned SiC wafer produced using COLD SPLIT laser-based wafer thinning technique.
• March 2018, Bombardier tested SiC-equipped Mitrac TC1500 traction converter.
• May 2018, Rohm announced plans for a new production building at the Apollo plant in Chikugo, Japan.The expanded production
capacity is intended to meet the growing demand for SiC power devices.The construction is scheduled to begin in February 2019 and be
completed by the end of 2020.

24
AUTOMOTIVE-GRADE SIC POWER DEVIC
Example (Reverse engineering): Tesla - ST
ST has
developped
1-1 SiC
MOSFET
module for
Tesla model
3.
SiC MOSFET one in one
module:
• 2 dies of 650V, 100A

25
PV MARKET
Geographic distribution
• China is by far the biggest
market of PV in 2017,
presenting more than 50%
of market share.
• On I June 2018, China
released a heavyweight
solar PV policy (823) to
rationalize capacity growth.
• The policy, which comes as
a shock to the industry,
suspends approving new
subsidised utility-scale PV
power stations in 2018.
• It also caps the scale of
distributed projects at 10
GW.
• In addition, all utility-scale
projects are mandated to
set power prices through
competitive auctions.
China is the
biggest PV
market in
2017.
But the latest
policy
indicated a
clear trend
to reduce
subvention
for the PV
market.
Source: SolarPower Europe
The announcement of
the new policy in China
has a strong impact on
the PV market, the
stock price of top PV
inverter price has
plunged.

26
Full SiC
modules
FULL SIC MODULE PACKAGING SOLUTIONS - SOME EXAMPLES
There is a
wide range
of module
packaging on
the market
for full SiC
modules.
Fuji: 1200V, 35A/50A/75A
1700V, 25A, 35A, 50A.
1200V, 120A, 13mΩ
copper baseplate and
aluminum nitride insulator.
1200V, 325A, 3.6mΩ:
AlSiC baseplate and Si3N4 AMB
insulator, enhancing ruggedness in
thermal cycling.
• 600V, 75A package
from Mitsubishi,
compatible with
conventional
products.
• Incorporates SiC
MOSFETs with
current sensors and
built-in drive circuit
and protection
functions.
GeneSiC:1200V, 100A
Panasonic and SanRex:
1200V/150A.
Infineon:
Easy1B with six-pack
topology.
Mass production in 2017.
Rohm:
Up to 120A, with 50%
volume reduction than if
IGBT were used

27
INTEGRATION SIVS SIC
Increased
efficiency
and
smaller
size by
replacing
Silicon
with SiC
MOSFET
3-phase SiC-based boost converter
prototype without copper bus bars and
common mode chokes
This can be parallelized to
get a 9-phase SiC converter,
resulting in 126 kW peak
power
485 mm
226 mm
73 mm
Source:Aachen University
Case study

28
SIC POWER DEVICE TIMELINE
SiC JFET 2016
First SiC
MOSFET
2017
• First hybrid solution in production since 2006 by Infineon.
• Once SiC MOSFETs were in production, several players started
to release full SiC modules.

29
CREE’S TRANSFORMATION PATH (1/3)
LED
Lighting
Power & RF
2015 2016 2017 2018
Materials
Plan for
LED
Lighting
Power & RF + Materials +
Infineon RF Power
Focus
New Focus

30
SIC DIODE
Time evolution of patent publications
• SiC SCHOTTKY BARRIER DIODE (SBD)
* A patent family is a set of patents filed in multiple countries to protect a single invention by a common inventor. A first application is made in one
country – the priority country – and is then extended to other countries.
Note: The patent search was performed in March 2018,
thus the data corresponding to the year 2018 are not
complete. At the time of the patent search, 12 patent
families had been published in 2018.
High number of JP 1st publication in
2013 like Fuji Electric (14 patent
families)
High number of JP 1st
publication in 2003 and
2006
First wave first
commeral
introduction of
SiC diode
Second wave 
SiC device market
took off

31
SiC POWER INDUSTRY - MAIN CHALLENGES (AS OF 2018)
From materials to system integration
Material
• High cost.
• Limited wafer size.
• Short supply at 6’’
Device
• Less maturity compared to Si
• Lower manufacturing yield.
• Higher cost.
• Long-term reliability.
• Short circuit capability
• What is the right packaging?
System
• How to integrate the active component e.g. for driving, EMI, topology choices.
• What are the available choices for passive components and dielectric materials?
• What are the right price?

32
SIC MOSFETVS SI IGBT
Which is the R&D status as of 2018?
Nowadays,
companies
still invest in
R&D for
IGBT.
SiC MOSFET
development
timeline
IGBT
development
timeline
Gen 5 IGBT
Decreased
switching losses
Vth inestabilities
SBD
integrated
Enhanced short
circuit
characteristics
Improved screening
in production for
dynamic tests
Still investments
in IGBT
technology
Switching
transients
*Non-exhaustive list
Packaging
Improving Power
cycling
All SiC players
(device +
module makers)
Who? What?
Who? What?
As back-up solution for
SiC MOSFETs
SiC transistors will not be
used in all IGBT
applications as of 2018
IGBT market still grow.

33
RELATED REPORTS

Following 2017’s trend, SiC transistors are
clearly being adopted, penetrating smoothly into
different applications. Yole Développement’s
(Yole) forecast for the value of the SiC power
semiconductor market is more than $1.5B by
2023 with a compound annual growth rate
(CAGR) of 31% for 2017-2023. Today the
market is still being driven by diodes used in
power factor correction (PFC) and photovoltaic
(PV) applications. However Yole expects that in
five years from now the main SiC device market
driver will be transistors, with an impressive
50% CAGR for 2017-2023. This adoption is
partially thanks to the improvement of the
transistor performance and reliability compared
to the first generation of products, which gives
confidence to customers for implementation.
One of the topics that has been discussed in all
Yole’s exchanges with industrial players is SiC
adoption for automotive applications over the
next 5-10 years. Its implementation rate differs
depending on where SiC is being used. That
could be in the main inverter, in the on-board-
charger (OBC) or in the DC/DC converter.
By 2018, more than 20 automotive companies
are already using SiC Schottky barrier diodes
(SBDs) or SiC MOSFET transistors for the
OBC, which will lead to 44% CAGR through
to 2023. Yole expects SiC adoption in the main
inverter by some pioneers, with an inspiring
108% market CAGR for 2017-2023. This will
be possible because nearly all carmakers
have projects to implement SiC in the main
inverter in coming years. In particular, Chinese
automotive players are strongly considering the
adoption of SiC.
PV has also caught our attention during recent
months. China claimed almost the half of
the world’s installations in the last year. This
segment could have therefore helped grow
the SiC device market, but new governmental
regulations mean Yole has lowered its
expectation for the segment.
System manufacturers are interested in
implementing cost effective systems which are
reliable, without taking into account if the power
devices are silicon or SiC based. Therefore,
even if it’s certified that SiC performs better
than silicon, system manufacturers still get
questions about long term reliability and the
total cost of the SiC inverter.
This report gives an overview of SiC power
device markets, including electric and
hybrid electric vehicles (EV/HEV), charging
POWER SIC 2018: MATERIALS, DEVICES AND APPLICATIONS
Market & Technology report - July 2018
AUTOMOTIVE IS DRIVING THE SIC POWER MARKET
Automotive is putting SiC on the road. Is the supply chain ready?
Do SiC technologies cross the chasm? As of 2018 understanding…
WHAT’S NEW
• Update of market size for discrete
diodes, diodes in hybrid modules,
discrete transistors and full SiC
modules
• Update of market size for the diode
and transistor bare die market
• Update of voltage analyses of SiC
power devices: 650V, 1200V, 1700V
and over 1700V
• Update of player status
• Discussion of SiC penetration in
EV/HEV in detail
• Discussion of SiC penetration in
the PV market under the impact of
new policy in China
• Estimation of SiC wafer investment
and analysis of short supply situation
• SiC epiwafer market
• A new chapter about the reliability
discussion
• A new chapter about the SiC
materials and device IP landscape
KEY FEATURES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
• Yole’s deep understanding of SiC
penetration in different applications
including xEV, xEV charging
infrastructure, PFC/power supply,
PV, UPS, motor drives, wind and
rail
• State-of-the-art SiC-based devices,
modules, and power stacks,
including product charts for each
• Description of the SiC power
industrial landscape from materials
to systems, and discussion of SiC
power market dynamics
• SiC power device market value
projections to 2023, including
bare die market with transistor/
diode split, device market split by
application and device market with
discrete/ module split
• SiC power device voltage analysis
• Market value and volume
projections for the SiC wafer and
epiwafer market through 2023
• SiC power industry roadmap (Yole Développement, July 2018)
Marketadoption
100%
More than 20 automotive
companies use SBD and
MOSFET in OBC.
OBC: On board charger
SBD: Schottky barrier diodes
The Chasm
The Early
Market
Tech
Euthusiasts
Visionaries Pragmatists Conservatives Skeptics
The Mainstream
Market
*Non exhaustive list of companies

Automotive-grade SiC power device
Example : Tesla STMicroelectronics*
2018 SiC wafer market : competitive landscape,
including RD players
(Yole Développement, July 2018)
POWER SIC 2018: MATERIALS, DEVICES AND APPLICATIONS
AUTOMOTIVE-GRADE SIC POWER DEVICE
EXAMPLE : TESLA STMICROELECTRONICS*
SIC ADOPTION IS ACCELERATING: IS THE SUPPLY CHAIN READY?
A fast-evolving market is seeing plenty of activity
from its participants, with several important events
in 2017-2018. In February 2018, Cree announced a
180° turnaround in its strategy on its investor day,
after the abortive sale of its Wolfspeed business
to Infineon. The company decided to instead
focus on Wolfspeed which, despite being Cree’s
smallest business, is the market leader in both the
SiC wafer and SiC power device markets as of
2017. This strategy pivot will allow Cree to invest
more into its SiC activities, expanding wafer,
epiwafer and device capacity and prepare for
market growth. On the other side of the abortive
acquisition, Infineon has also developed its SiC
power business. The company signed a long term
SiC wafer supply agreement with Cree and began
to actively promote its CoolSiCTM MOSFETs
at different power electronic tradeshows and
conferences in 2018.
Meanwhile, excitement surrounds Tesla’s
adoption of SiC MOSFETs in its electric vehicles.
This had been rumoured since 2016, but without
detailed information about whether it would be
in the OBC and/or main inverters. Confirmation
came through reverse engineering, which shows
that the Model 3 uses STMicroelectronics’ 1-in-
1 top lead frame module, containing two SiC
MOSFETs.
In 2018, Yole is confident that the market is going
to grow. The question for the SiC device market
today is how big it will be in five years, rather
than whether the market will increase. Another
question is whether the supply chain is ready to
embrace the market acceleration? Wafer supply
is one of the bottlenecks as of 2018.
Analysts have to talk about the short SiC wafer
supply situation, which has been in place since late
2016. Some expected the situation to be resolved
in the second half of 2017. But we are in the
middle of 2018 and the supply issue remains. Two
main reasons account for the current situation.
First, the transition from 4” to 6” wafers is much
faster than suppliers expected. Second, the wafer
demand increase is also faster than expected.
Will the situation continue? Some say that it
is temporary and quite normal and typically
happens when shifting to larger wafer sizes.
Others consider the situation to be critical. It’s
a good problem for wafer suppliers as the supply
constrained situation allows them to maintain high
wafer prices. But they are also investing heavily
to satisfy demand from numerous clients. Yole
estimates that several hundred million US dollars
will be invested in coming years. The leading SiC
wafer suppliers, Cree-Wolfspeed, II-VI and Dow,
are all investing to expand their capacity.
At the epiwafer level, the market has struggled to
take off several years, but the situation is evolving
quickly. For example, Yole’s analysts have seen
Showa Denko expand its capacity consecutively
in 2015, 2016 and 2018 as the technology
becomes more mature and the outsourcing ratio
is increasing.
Yole invites you to read its analysis about the
short wafer supply situation and its impact,
as well as forecasts for the wafer and epiwafer
markets.
infrastructure, PV, power supply, rail, motor
drives and uninterruptible power supplies (UPS)
and wind. It also has an overview on the current
reliability status and comparison on the added
cost of a SiC system compared to silicon IGBTs.
(Yole Développement, July 2018)
Newly identified in 2018
module:
• 2 dies of 650V, 100A
* Extracted from System Plus Consulting
report :Tesla Model 3 Inverter with SiC Power
Module from STMicroelectronics, June 2018
module:
• 2 dies of 650V, 100A
* Extracted from System Plus Consulting
report :Tesla Model 3 Inverter with SiC Power
Module from STMicroelectronics, June 2018

MARKET TECHNOLOGY REPORT
A foundry model is clearly forming which
facilitates fabless and fab-lite companies to
launch SiC products and make the technology
more accessible. But there was also short
supply of foundry services in 2017. A new 6”
wafer foundry, Clas-SiC Wafer Fab Limited
(6”) was founded in 2017, with the entire SiC
team from Raytheon, which has stopped its
SiC activities. Taiwanese foundry Episil is also
now active.
This report provides an overview of the SiC
power industry, covering the value chain from
material to epitaxy to module. It also outlines
Yole’s understanding of the market’s current
dynamics and future evolution.
Find more
details about
this report here:
COMPANIES CITED IN THE REPORT (non exhaustive list)
ABB, Alstom, Ascatron, Aymont, Bombardier, Basic Semiconductor, Brückwell Technology, Caly
Technology, Clas-SiC wafer fab, Cree, CRRC, Danfoss, Delphi, DENSO, Dow Corning, Epiworld,
Episil, Fraunhofer IISB, Fuji Electric, GE, GeneSiC, Global Power Device, Global Power Technology,
Hestia Power, Hitachi, IBS, II-VI, Infineon, MicroSemi, Mitsubishi Electric, Norstel, Northrop
Grumman, NXP, ON Semiconductor, Panasonic, Philips, Powerex, Raytheon, RENESAS, ROHM,
Sanrex, Schneider Electric, Semikron, Shindengen, SICC, Siemens, SMA, STMicroelectronics, Toshiba,
Toyota, United Silicon Carbide, WeEn, Wolfspeed, X-Fab, Yaskawa, and more

Executive summary 9
News37
Report comparison 42
Why use SiC for power electronics
applications?50
Electrified vehicle market 66
Electrified charging infrastructure 105
Photovoltaic inverters 122
PFC and power supply 140
Uninterruptible power supplies 156
Motor drive market 166
Power converters for wind turbines 177
Rail traction market 187
Other SiC applications 207
SiC device market: voltage analysis 218
SiC power device technology 234
SiC power devices
Packaging
Integration
SiC device reliability status 279
SiC power device commercial status 289
SiC power device industry landscape 299
SiC wafer and epiwafer market 314
IP350
SiC power industry ecosystem 358
Open discussion and perspectives 383
General conclusions 406
TABLE OF CONTENTS (complete content on i-Micronews.com)
• Power GaN 2017: Epitaxy, Devices,
Applications, and Technology Trends
• Cree-Wolfspeed
• Tesla Model 3 Inverter with SiC Power
Module from STMicroelectronics
• UnitedSiC UJN1205K
1200V SiC JFET
RELATED REPORTS
Benefit from our Bundle Annual Subscription offers and access our analyses at the best available
price and with great advantages
AUTHORS
Dr. Hong Lin works as a
Technology and Market Analyst,
Compound Semiconductors since
2013. She is specialized in compound
semiconductors and provides technical
and economic analysis. Before joining
Yole Développement, she worked as
RD engineer at Newstep Technologies.
She was in charge of the development
of cold cathodes by PECVD for visible
and UV lamp applications based on
nanotechnologies. She holds a Ph.D in
Physics and Chemistry of materials.
Dr. Ana Villamor serves as
a Technology Market Analyst,
Power Electronics Compound
Semiconductors. She is involved in many
custom studies and reports focused on
emerging power electronics technologies
at Yole Développement, including
device technology and reliability analysis
(MOSFET, IGBT, HEMT, etc). In addition,
Ana is leading the quarterly power
management market updates released
in 2017.
Previously Ana was involved in a high-
added value collaboration related to
SJ Power MOSFETs, within the CNM
research center for the leading power
electronic company ON Semiconductor.
During this partnership and after two
years as Silicon Development Engineer,
she acquired a relevant technical
expertise and a deep knowledge of the
power electronic industry.
Ana is author and co-author of several
papers as well as a patent. She holds
an Electronics Engineering degree
completed by a Master in micro and
nano electronics, both from Universitat
Autonoma de Barcelona (SP).
Find all our reports on www.i-micronews.com
OBJECTIVES OF THE REPORT
• Provide a clear understanding of the SiC power industry, covering markets from wafer to
discrete and module level, with valuations in units and $M.
• Analyze the market drivers and bottlenecks of the SiC power industry by studying SiC
adoption by different end applications and supply chains.
• Understand the status of SiC power device technology
• Describe the industry landscape
Dr. Hong Lin and Dr. Ana Villamor, all part
of the Power Wireless division at Yole
Développement co-authored the Power SiC
2018: Materials, Devices and Applications
report:

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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and
corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications
using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and
image sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, Software, Optoelectronics, Microfluidics Medical, Advanced
Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries Energy Management.
The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting,
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2©2018 | www.yole.fr | About Yole Développement
YOLE DEVELOPPEMENT – 4 DIVISIONS
Life Sciences
Healthcare
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o BioMEMS
o Inkjet Printing
o Solid-State Medical Imaging BioPhotonics
o Bio Technologies
Power
Wireless
o RF Devices Technology
o Compound Semiconductors Emerging Materials
o Power Electronics
o Batteries Energy Management
Semiconductor
Software
o Package Assembly Substrates
o Semiconductor Manufacturing
o Memory
o Software Computing
Photonics,
Sensing Display
o Solid-State Lighting Display
o MEMS, Sensors Actuators
o Imaging
o Photonics Optoelectronics
Semiconductor
Software
Power Wireless
Photonics,
Sensing
Display
Life
Sciences
Healthcare

3 BUSINESS MODELS
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• Market data research,
marketing analysis
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MA with our partner)
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6 COMPANIES TO SERVEYOUR BUSINESS
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Cost simulation tools
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www.yole.fr
IP analysis
Patent assessment
www.knowmade.fr
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www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
Yole Group of Companies

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users and software
developpers
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Suppliers: material, equipment,
OSAT, foundries…
Financial investors, RD centers

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o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market technology analysis, patent
investigation and patent infringement risk analysis, teardowns reverse costing analysis.They cover:
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REPORTS COLLECTION
www.i-Micronews.com
• MEMS Sensors
• RF devices technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software
• Memory

OUR 2018 REPORTS COLLECTION (1/4)
MEMS SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 – Update
− Silicon Photonics 2018 – Update
− Consumer Biometrics: Hardware Software 2018 – Update
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Acoustic MEMS and Audio Solutions 2017
− MEMS Sensors for Automotive Market Technology Trends 2017
− High End Inertial Sensors 2017
− Magnetic Sensor 2017
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT
– by System Plus Consulting
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product
Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− MEMS Pressure Sensor 2018 – Market Technology Report
− MEMS Pressure Sensor Comparison 2018 – Structure, Process Cost Report
− Gas Particles 2018 – Market Technology Report
− Gas Particles Comparison 2018 – Structure, Process Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market
Technology Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
− MEMS Packaging 2017 – Market Technology Report
− MEMS Packaging Comparison 2017 – Structure, Process Cost Report
RF DEVICES ANDTECHNOLOGIES
− Wireless technologies (Radar, V2X) for Automotive 2018
− RF Standards and Technologies for Connected Objects 2018
− RF Photonic Components Technologies for 5G Infrastructure 2018
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT– by System
Plus Consulting
− Automotive Radar Comparison 2018
− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis
− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market
Technology Report – Update
− RF Front-End Module Comparison 2018 – Structure, Process Cost Report
− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis
− Advanced RF System-in-Package for Cellphones 2018 – Market Technology
Report – Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
Market Technology Report – Update
− RF GaN Comparison 2018* – Structure, Process Cost Report
− RF GaN 2018 – Patent Landscape Analysis
SOFTWARE
− Consumer Biometrics: Sensors Software 2018 – Update
− Processing Hardware and Software for AI 2018 - Vol. 1 2
− From Image Processing to Deep Learning, Introduction to Hardware and Software
Update : 2017 version still available / *To be confirmed

IMAGING OPTOELECTRONICS
− Status of the Compact Camera Module and Wafer Level Optics
− Industry 2018 – Update
− 3D Imaging and Sensing 2018 – Update
− Sensors for Robotic Vehicles 2018
− Machine Vision for Industry and Automation 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− Uncooled Infrared Imagers 2017
− iPhone X Dot Projector – Patent-to-Product Mapping
− Status of the CMOS Image Sensor Industry 2018 – Market Technology Report -
Update
− CMOS Image Sensor Comparison 2018 – Structure, Process Cost Report
− CMOS Image Sensors Monitor 2018* – Quaterly Update**
− Camera Module 2017 – Market Technology Report
− Compact Camera Module Comparison 2018 – Structure, Process Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market Technology
Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
ADVANCED PACKAGING
− Status of Advanced Packaging Industry 2018 – Update
− Status of Advanced Substrates 2018: Embedded Die and Interconnects,
Substrate Like PCB Trends
− 3D TSV and Monolithic Business Update 2018 – Update
− Power Modules Packaging 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Status of Panel Level Packaging 2018
− Trends in Automotive Packaging 2018
− Hardware and Software for AI 2018 - Vol. 1 2
− Thin-Film Integrated Passive Devices 2018
− Memory Packaging Market and Technology Report 2018 – Update*
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
o LINKED REPORTS– by Yole Développement and System Plus Consulting
− Advanced RF System-in-Package for Cellphones 2018 – Market Technology Report -
Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− Fan-Out Packaging 2018 – Market Technology Report – Update*
− Fan-Out Packaging Comparison 2018* – Structure, Process Cost Report
MANUFACTURING
− Wafer Starts for More Than Moore Applications 2018
− Equipment for More than Moore: Technology Market Trends
for Lithography Bonding/Debonding 2018
− Polymeric Materials for wafer-level Advanced Packaging 2018
− Laser Technologies for Semiconductor Manufacturing 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Equipment and Materials for 3D TSV Applications 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− Equipment for More than Moore: Technology Market Trends for
Lithography Bonding/Debonding 2018 – Market Technology Report
− Wafer Bonding Comparison 2018 – Structure, Process Cost Report

MEMORY
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update*
o QUARTERLY UPDATE – by Yole Développement**
− Memory Market Monitor 2018 (NAND DRAM)
o MONTHLY UPDATE – by Yole Développement**
− Memory Pricing Monitor 2018 (NAND DRAM)
o REVERSE ENGINEERING COSTING REVIEW – by System Plus Consulting
− DRAM Technology Cost Review 2018
− NAND Memory Technology Cost Review 2018
− 3D Non-Volatile Memories – Patent Landscape
COMPOUND SEMICONDUCTORS
− Status of Compound Semiconductor Industry 2018*
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Bulk GaN Substrate Market 2017
− Power SiC 2018: Materials, Devices, and Applications – Market Technology
Report – Update
− SiC Transistor Comparison 2018 – Structure, Process Cost Report
− Power SiC 2018 – Patent Landscape Analysis
− Power GaN 2018: Materials, Devices, and Applications – Market Technology Report
– Update
− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process Cost Report
− Status of the GaN IP – Patent Watch 2018 Patent Activity 2017
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
– Market Technology Report – Update
− RF GaN – Patent Landscape Analysis
POWER ELECTRONICS
− Status of Power Electronics Industry 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Power Electronics for Electric Vehicles 2018 – Update
− Integrated Passive Devices (IPD) 2018
− Wireless Charging Market Expectations and Technology Trends 2018
− Thermal Management Technology and Market Perspectives in Power
− Electronics and LEDs 2017
− Gate Driver 2017
− Power MOSFET 2017
− IGBT 2017
− Market Opportunities for Thermal Management Components in
Smartphones 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting
and KnowMade
− Power Modules Packaging 2018 – Market Technology Report – Update
− Automotive Power Module Packaging Comparison 2018 – Structure,
Process Cost Report
− Power ICs Market Monitor 2018 – Quaterly Update**
− Power ICs Market Comparison 2018* – Structure, Process Cost Report
BATTERY AND ENERGY MANAGEMENT
− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –
Update
− Status of the Battery Patents – Patent Watch 2018 Patent Activity 2017
o LINKED REPORTS – by Yole Développement and KnowMade
− Solid State Electrolyte Battery 2018 – Market Technology Report
− Solid-State Batteries 2018 – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer

SOLID STATE LIGHTING
− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update
− Automotive Lighting 2018: Technology, Industry and Market Trends – Update
− UV LEDs 2018: Technology, Industry and Market Trends – Update
− LiFi: Technology, Industry and Market Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− CSP LED Lighting Modules
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
− Horticultural Lighting 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− VCSELs 2018: Technology, Industry and Market Trends – Market Technology
Report
− VCSELs Comparison 2018 – Structure, Process Cost Report
DISPLAYS
− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update
− Displays and Optical Vision Systems for VR/AR/MR 2018
− MicroLED Displays 2018 – Market Technology Report – Update
− MicroLED Display – Patent Landscape Analysis
MEDTECH
− BioMEMS Non Invasive Emerging Biosensors: Microsystems for Medical
− Applications 2018 – Update
− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update
− Neurotechnologies and Brain Computer Interface 2018
− CRISPR-Cas9 Technology: From Lab to Industries 2018
− Ultrasound Technologies for Medical, Industrial and Consumer Applications 2018
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Liquid Biopsy: from Isolation to Downstream Applications 2018
− Chinese Microfluidics Industry 2018
− Scientific Cameras for the Life Sciences Analytical Instrumentation
Laboratory Markets 2018*
− Artificial Organ Technology and Market 2017
− Connected Medical Devices Market and Business Models 2017
− Status of the Microfluidics Industry 2017
− Organs-On-Chips 2017
− Solid-State Medical Imaging 2017
− Medical Robotics Market Technology Analysis 2017
− Microfluidic IC Cooling – Patent Landscape
− Circulating Tumor Cell Isolation – Patent Landscape
− OCT Medical Imaging – Patent Landscape
− Pumps for Microfluidic Devices – Patent Landscape 2017
− Microfluidic Technologies for Diagnostic Applications – Patent Landscape 2017
− FLUIDIGM – Patent Portfolio Analysis 2017
− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017
− Organs-On-Chips 2017 – Market Technology Report
− Organ-on-a-Chip – Patent Landscape Analysis

OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N Patent Watch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− Microfluidic Technologies for Diagnostic Applications Patent Landscape
TEARDOWN REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
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o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).

MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person. Events
are the best way to exchange
ideas with your customers,
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Targeted audience
involvement equals clear,
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Webcasts are a smart,
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Benefit from the i-Micronews.com
traffic generated by the 11,200+
monthly unique visitors, the
10,500+ weekly readers of
@Micronew se-newsletter
Several key events planned for
2018 on different topics to
attract 120 attendees on average
Gain new leads for your business
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registrants per webcast
Contact: CamilleVeyrier (veyrier@yole.fr), Marketing Communication Project Manager

CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS, REPORT
BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director forWestern US
Canada
Email: laferriere@yole.fr – + 1 310 600-8267
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• Japan Rest of Asia:
• Takashi Onozawa, General Manager,Asia Business
Development (Korea, Singapore, India ROA)
Email: onozawa@yole.fr - +81 34405-9204
• Miho Othake, Account Manager (Japan)
Email: ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Japan)
Email: oshiba@yole.fr - +81-80-3577-3042
• Greater China: Mavis Wang, Director of Greater China Business
Development
Email: wang@yole.fr - +886 979 336 809
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• RoW: Jean-Christophe Eloy, CEO President,Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnership withWoodside
Capital Partners)
• Jean-Christophe Eloy, CEO President
Email: eloy@yole.fr - +33 4 72 83 01 80
• Ivan Donaldson,VP of Financial Market Development
Email: ivan.donaldson@yole.fr - +1 208 850 3914
o GENERAL
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