Status of Power Electronics Industry 2015 Report by Yole Developpement

February © 2015
From Technologies to Market
Status of Power
Electronics
Industry 2015
Sample
From Technologies to Market

2
• Report Objectives 4
• What is in this report 5
• Glossary 8
• Executive Summary 9
• Power Electronics Basic Concepts 29
What are Power Electronics used for? 32
• PE Market 2010 - 2020 50
Wafer Market 58
Device Market 64
Inverter Market 71
• PETechnology Overview 75
Raw Materials 77
IGBTs Technology 86
SJ MOSFETs Technology 98
SiC FETs Technology 106
GaN HEMTs Technology 117
Power Packaging 130
• PE Applications Overview 138
PV Inverters 140
Wind Turbines 147
T&D 154
EV/HEV 163
Rail Traction 172
UPS 180
Industrial Motor Drives 187
• Key Players & PE Supply Chain 196
• PE Future Challenges 218
• Annex 223
• Yole Presentation 226
TABLE OF CONTENTS
©2015 | www.yole.fr | Status of Power Electronics Industry

3
COMPANIES CITED IN THE REPORT
ABB,Alstom,Amphenol,Amsc,AnsaldoBreda, BAIC, Baldor, BMW, Bolloré, Bombardier, Bosch, BYD, CAF, Chilicon Power,
Continental, Converteam, CREE, CSR, Curamik, Daimler Chrysler, Danfoss, Delphi, Delta Energy Systems, Denso, DTW
elektronika, Dynex, Eaco, Eagtop, Eaton, Emerson Liebert, Enecsys, Enercon, Enphase Energy, Envision, Fairchild, Ford, Fuji Electric,
EPC, EpiWorld, Gamesa, GaN Systems, General Electric, GeneSiC, Goldwind, Hitachi, Holy Stone Polytech, Honda, HYUNDAI
heavy industries, Icemos, Idealec, iEnergy, Infineon, Ingeteam, International Rectifier, Involar, Iveco, IXYS, KACO new energy,
Kawasaki, LAAS-CNRS, Leroy Somer, LS Power Semitech, MasterVolt, MCB, Mersen, Methode, MicroGaN, Microsemi, Mingyang,
Mitsubishi Electric, Multi Contact, New Flyer, Nissan, Nordex, NXP, Omron, ON Semiconductor, Panasonic, Parker, Powdec,
Powerex, Powersem, Poseico, Positronic, PSA, Raytheon, Renault, Renesas, RFMD, Rockwell Automation, Rogers Corporation,
Rohm, Schneider Electric, Samsung heavy industries, SanKen, SanRex, SBE, Semikron, Semisouth, SEPSA, Shindengen, SICC,
Siemens, SMA Solar Technology, SMBE, Sinovel, SolarMax, STMicroelectronics, Sungrow,Tabuchi,TDK,TE connectivity,Tesla
Motors,TMEIC,Toshiba,ToyoDenki,Toyota,Transphorm,TYSTC, United Power Technology,Vacon,Vestas,Vincotech,VisIC
Technologies,Vishay,Volvo,WDI, Yaskawa,Yutong…

4
OVERALL POWER ELECTRONICS MARKET
2014 – 2020 value chain analysis: system, device, wafer
The power
electronics
market
perspectives
are very
optimistic
with a CAGR
superior than
6% for the
period
2014-2020
Electronics Systems
$xxxx B
Power Inverters
$xxxx B
Semiconductor power
devices (discrete and
modules)
$11.5 B
Power
wafers
$xxxx B
Electronics Systems
$xxxx B
Power Inverters
$xxxx B
Semiconductor power
devices (discrete and
modules)
$17.2 B
Power
wafers
$xxxxB
2014 2020
CAGR: +xx%
CAGR: +6.9%
CAGR: +2%
CAGR: +6.1%

5
WAFER MARKET FORECAST 2010-2020
Market size split by diameter
The 6”
(150mm)
wafers are
the most
sold ones,
but 200mm
wafers will
considerably
increase its
market share

6
INVERTER MARKETS AND DRIVERS
The overall
inverter
market in
2014
exceeded
the $xx B
And
others…
Drivers for inverter
innovation
Drivers for application
growth
Size reduction
Weight reduction
Efficiency
improvement
Cost reduction
• Increase of CO2 emission taxes
• Demand and regulations for
clean energy generation
• Need for mass transportation
• Need for efficient transportation
• Regulation on energy efficiency
• Data center and data
storage market increase
• Utility grid stress increasing due to
the use of clean energy
Depending on
applications
Wind turbines
$2.7 B -2.1%
PV inverter
$xx B +2.2%
Motor drives
$xxx B +8%
Rail traction
$3.3 B +5.2%
UPS
$10 B +0.9%
EV/HEV
$xxxx B+15%
Inverter markets*
* In 2014

7
FOUR MAIN DEVICES FOR POWER ELECTRONICS
We do a
focus on the
four main
recent
technologies
in this
report
SiC FETs
Production status in 2014: growing stage of production
Market size in 2014: $xxxxM
Main players involved: CREE, Infineon, Powerex, Rohm, Microsemi,
GeneSic, STMicroelectronics
Main applications: xxxx (for diodes), xxxx , xxxx (not yet), xxxx (not yet),
xxxxxx (for switches)
Power range: 10 kW to MW range
Voltage range: 1.2 kV to xxxkV (up to xxx kV so far)
SJ MOSFETs
Production status in 2014: mass production
Market size in 2014: ~$xxxxM
Main players involved: Infineon, STMicroelectronics, Toshiba,
Fairchild, Vishay
Main applications: Laptop adapters, xxxx, xxxx, xxxx, xxxx,…
Power range: up to 20 kW
Voltage range: up to xxxxV
GaN HFETs
Production status in 2014: early stage of production
Market size in 2014: ~$xxxxM
Main players involved: IR, EPC, GaN Systems, Transphorm, Freescale,
Infineon, Fuji Electric, Powdec, SanKen, Renesas, etc.
Main applications: xxx xxxx (not yet), xxxx(not yet), xxxx, xxx.
Power range: up to 100 kW
Voltage range: up to xxxx V
SILICON
COMPOUND
SEMICONDUCTORS
IGBT
Production status in 2014: mass production
Market size in 2014: $xxxxM
Main players involved: Infineon, Fairchild, STMicroelectronics,
Toshiba, Mitsubishi, Fuji Electric
Main applications: PV inverters, rail traction, EV/HEV, UPS,
motor drives, wind turbines, medical,…
Power range: From 1 kW to few hundreds kW
Voltage range: from 300 V to xxxx kV

8
SEMICONDUCTOR EVOLUTIONS
Power device technology positioning
WBG devices
are primarily
positioned in
high-end
applications
1200V or
more
600V or less
Productrange
Voltage
IGBT
Thyristor
IGCT
…
SiC
MOSFET
Triacs
Bipolar
…
3.3kV and more200
V
GaN GaN Yole Développement - December 2014

9
IMPLEMENTATION OF SiC MATERIALS IN POWER ELECTRONICS
• SiC diodes today are already
in production,mainly coupled
with IGBT technology.
• Penetration of SiC inWind
turbines will happen xxxx.
For all other segments, Yole
Développement roadmaps
have been confirmed. Use of
SiC in industrial motor drives
is still unclear.
2013 2014 2015 2016 2017 2018 2019
Industrial motor drives
UPS
Rail traction
Wind turbines
EV/HEV
PV inverters
Confirmed
Confirmed
Confirmed
Today
Confirmed
Diode Switch

10
IMPLEMENTATION OF GaN MATERIALS IN POWER ELECTRONICS
• Characteristics of GaN-based
inverters will be:
• They will primarily target medium
voltage applications (in the 200 –
600V range)
• GaN targeted applications will
be very different from SiC, at
first. We will observe a competition
in xxxx. For the EV/HEV, xxxxxxx.
• GaN devices are excluded from
high-voltage applications such as
wind turbines and rail traction.
2013 2014 2015 2016 2017 2018 2019
Industrial motor drives
UPS
Rail traction
Wind turbine
EV/HEV
PV inverters
PFC/Power supplies
Small DC/DC converters
Wireless chargers
Today
Confirmed

11
SJ MOSFET PLAYERS
Who does what?
Several new
players have
arrived, and
they will
bring more
competition
in this
market
Super junction MOSFET
Multiple epitaxy + implantation Deep trench
Production
R&D
Buy & sell
Production R&D
Deep trench +
epi filling
Deep trench +
implantation
R&D
Floating
island
Production
R&D
2013

12
COMPETITIVE PACKAGING TECHNOLOGY
Improvement aspects in packaging, with examples…
Many
innovations
are taking
place in
power
module
packaging
Die
interconnection
DBC
+
baseplate
Die attach
Infineon .XT Lexus/Toyota modules:
LS 600h
Prius 2010
Semikron Ag sintering
Semikron Skin
• GE power overlay
• Delphi Viper
• aPSI3D module
Improvements in packaging can be made in 3 different aspects:
• Die interconnection, which is searching for innovative wire bonding or
no-wires connection for better lifetime and reliability
• Die attach, which uses new materials for better lifetime
• DBC+baseplate, which uses new materials and suppress layers for
improved cooling and smaller size
All applicable to Si and SiC
Includes cooling
Danfoss
Shower power

13
INVERTER MARKET FORECAST
2010-2020
Description
and market
trends of
each
application
are
presented
on this
report

14
PV TECHNOLOGY ROADMAP
Penetration strategy status
New players
are trying to
find their
position in
the PV
market
1,000kW500kW200kW100kW10kW5kW250 W 1kW 50kW
Not yet
established
Well-
established
Inverter size
Establishment in the PV inverter business ≈
In 2014, PV inverter manufacturers focused
mainly on four target areas:
1. Microinverters (~250W)
2. Small-size (residential roofs) (3-10kW)
3. Medium-size inverters (20-50 kW)
4. Large inverters (500kW+)

15
WIND TURBINES MAIN PLAYERS LOCATION AND STRATEGY
Goldwind = No1. in China in 2013
GE Wind = No1. in the US in 2013
Chinese players are rapidly growing within China and looking for
foreign markets. Some Chinese players have chosen the strategy of JV
with key EU technology players in order to speed-up their development.
All players are looking for new market opportunities: some by developing
large turbines in 6MW+ size for offshore applications other via focusing on
promising new markets especially in South America.

16
ARCHITECTURES OF SMART POWER DISTRIBUTION SYSTEMS
HVDC & FACTS
HVDC and
FACTS fulfil
the needs
for more
power
management
and long
distance
transmission
Smart
Power
Distribution
HVDC
HVDC
standard
VSC /
HVDC light
FACTS
SVC
TCSC
STATCOM
SVC light
Thyristors IGBT Thyristors IGBT
Power
systems
technologies
Power
systems
sub category
Main silicon
device in use:
HVDC : HighVoltage Direct Current
FACTS : Flexible Alternating CurrentTransmission System
VSC :Voltage Source Converters (“IGBT Light” is a brand of ABB)
SVC : StaticVAR Compensator (VAR: Reactive Power)
STATCOM (SVC light) : Static Synchronous Compensator
DC AC

17
EV/HEV SUPPLY CHAIN EVOLUTION
Integration trends
Tier 1 et chip makers are willing to acquire power module manufacturing. Pure
power module makers have to develop their competences to stay in the game.
Power module Inverter/converter VehiclesDiscrete component
Car
manufacturers
Tier 1
Chip makers
Module
makers
Tough concurrence
zone Car manufacturers see
electric motors as a
know-how to master, and
are capturing
competencies from tier
ones
 the goal is to
manufacture the overall
powertrain.
Some car makers are also
working on batteries to
complete this value chain
integration.
The
description
of the supply
chain for
each
application
can be found
on the
report

18
RAIL TRACTION SUPPLY CHAIN
DYNEX’s
acquisition
by CSR is an
example of
Asiatic
vertical
integration.
Dies IGBT modules Power Inverter Modules Train makers

19
UPS POWER ELECTRONICS
Component adoption for UPS inverters
• At the component level, we have observed two main trends:
• Adoption of power modules in opposition to power discrete devices, for the low power segment:
• xxxxx
• IGBT will be the most demanded device for UPS business within the next five years:
• xxxxxx
• xxxxxx
IGBTs are
and will be
the most
used devices
in UPS
Power range Number of devices Topology Device voltage
Low power UPS xxxx
• H-bridge topology
• Single phase
xxxx
Medium power UPS xxxx
• IGBT rectifier
• 3 phase
• Cascaded H-bridge or NPC topologies
xxxx
High power UPS xxxx
• IGBT rectifier
• 3 phase
• Multi-level topologies

20
POWER ELECTRONICS SUPPLY CHAIN TRENDS
Many other
M&A
examples
are analysed
on the
report
Europe and USA Asia
 Vertical integration:
Acquisition of competencies internally to build an
overall system, for different motivations.
• To grasp the entire value chain margin
• To reach local markets also for some companies
(example with CSR which bought Dynex in 2008
both to grasp EU market and outsourced Dynex’s
manufacturing)
 Diversification (also called horizontal integration):
Outsourced manufacturing:
Typically in Asia for low value levels of manufacturing
 Proposition of advanced R&D services
- IMEC
- APEI
- Fraunhofer
- PRIMES
- GE Global Research
Product consolidation
Cost reduction
Quality and reliability offers
Domestic market protection
and worldwide expansion

21
VERTICAL & HORIZONTAL INTEGRATION
A technological need
• The main purpose of power electronics continue to be integration.
• Therefore, establishing interactions and synergy dynamics among different players is necessary so that knowledge can
be shared and the overall system improved.Acquisitions and partnerships are the key:
Vertical
integration
helps reducing
costs.
Diversification
takes profit of
different
synergies to
get a more
compact
system.
Capacitor
Laminated
busbar
Cooling
system
INVERTER
Possible by mastering both
technologies (examples: SBE and
Methode Electronics, Eagtop…)
Can be extended toward IGBT
stack/inverter assembly
with cooling systems, and other components
(Power modules, IGBT drivers…)
IGBT driver
Power
module
IGBT stack/inverter
assembly
Capacitor+busbar assembly:
Resistor
Power stack
backbone

22
UP-FRONT INTEGRATION
From chips to inverters
Many Japanese
chip
manufacturers
have accessed
higher added
value markets
• Drivers for this integration are:
• Technology development: access to new skills
• Partnering, developing sales network
• Access to higher added value markets
• Main risks are:
– Customers becoming competitors
– Access new technologies, especially at the inverter
level
• Most concerned are Japanese players
Inverter makers
System
integrators
Power module
makers
Chip makers
Power discrete
makers
Passive
makers
Busbar and connector
makers
Supplies to…
Expansion trend

23
FOCUS ON CHINA
Vertical integration by Chinese companies: from toward to vertical backward
Huge
Chinese
companies
are
conquering
their supply
chain and
their
respective
markets
SystemInverterPower modulePower Chip
Rail
EV/HEV
PV inverter
Wind turbines
Strong R&D effort

Status of Power Electronics Industry 2015 Report by Yole Developpement

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