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From Technologies to Market
Power Module
Packaging: Material
Market and
Technology Trends
Sample
May 2017
CourtesyofSystem...
2
REPORT OBJECTIVES
• Provide power module packaging market analysis and forecasts
• Provide a deep insight into state-of-...
3
REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology
©2017 | www.yole.fr | Power Module Packag...
4
REPORT METHODOLOGY
Technology analysis methodology Information collection
©2017 | www.yole.fr | Power Module Packaging: ...
5
TABLE OF CONTENTS
Part 1/1
 Who should be interested in this report 5
 Objectives of the report 6
 What we missed… Wh...
6
Biographies & Contacts
ABOUT THE AUTHORS
Mattin GraoTxapartegi
Mattin Grao Txapartegi is a Power Electronics Analyst at ...
Body sample
8
OVERALL POWER ELECTRONICS MARKET
Market metrics, split by device type
In 2016, the
power device
market was
worth $xxB
an...
9
POWER MODULE MARKET
Segmentation used in this report: discrete components and power modules
The two
main types of
packag...
10
THERMOMECHANICAL ISSUES IN POWER MODULES
Origins of thermally-induced stress and resulting failures
Origins of the ther...
11
GLOBAL TRENDS FOR POWER MODULE PACKAGING
Roadmap of power module packaging design
In the future
power
modules will
have...
12
GLOBAL TRENDS FOR POWER MODULE PACKAGING
Interconnections
• For interconnections the main challenge is to increase the ...
13
ENCAPSULATION
Focus on silicone gel for high temperatures
Encapsulant
solutions
suited for
continuous
high
temperature
...
14
SUBSTRATE
Future trends: ceramic substrates
• Even though new substrate alternatives are coming to the playground, stil...
15
THERMAL INTERFACE MATERIALS
Power modules with pre-appliedTIM
Some power
module
manufacturers
offers power
modules with...
16
RAW MATERIAL MARKET FOR POWER PACKAGING
Raw materials market size in 2016
Power
module
packaging
represented a
$1.1B ma...
17
DIE ATTACH FOR POWER MODULES
Die attach market size evolution in Mcm³ between 2016 and 2021, split by application
The d...
18
BUSINESS MODEL AND SUPPLY CHAIN ANALYSIS
Evolution of business models in the future
In the future
business
models will
...
19
DISCRETE DEVICE PACKAGING
How will discrete device packages evolve?
The key
objectives are
the same for
discrete device...
20
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Discover more related reports within our bundles here.
©2017 | www.yole.fr | Power Module Packaging: Ma...
In 2016, the power module market was worth
almost $3.2B and from there it will grow steadily
for the next five years. As o...
POWER MODULE PACKAGING: MATERIAL MARKET AND TECHNOLOGY TRENDS
(Yole Développement, May 2017)
Power packaging supply chain ...
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Power Module Packaging: Material Market and Technology Trends 2017 - Report by Yole Developpement

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How new applications drive the choice of power module materials and designs

The power module packaging market will grow at 9.5% per year from 2016-2021, reaching almost $1.8B

In 2016, the power module market was worth almost $3.2B and from there it will grow steadily for the next five years. As of 2016, almost 40% of the Bill-Of-Material of a power module concerns raw materials used for packaging. Materials for die-attach, substrate-attach, substrate, baseplate, encapsulation, interconnections and casings constitute a $1.1B market in 2016. This market will grow and reach $1.8B by 2021. Yet the growth will not be even across all raw material markets. Die-attach materials have the highest forecast compound annual growth rate (CAGR) for 2016-2021, at over 13%. Casings and encapsulation have the lowest CAGR, at 5-7% for 2016-2021. The main differences arise from technology choices for those materials and their impact on the each market segment. For instance, the greater presence of epoxy resin will reduce the cost of encapsulation in power modules.

Substrates and baseplates account for half of the packaging raw material market, and together are worth over $550M. Therefore, the choice of technology in ceramic substrates or baseplates can have a great impact on final power module cost. Around 25% of the cost is related to die-attach or substrate attach material. The rest of the cost is divided between encapsulation, interconnections and the casing.

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Power Module Packaging: Material Market and Technology Trends 2017 - Report by Yole Developpement

  1. 1. From Technologies to Market Power Module Packaging: Material Market and Technology Trends Sample May 2017 CourtesyofSystemPlusConsulting
  2. 2. 2 REPORT OBJECTIVES • Provide power module packaging market analysis and forecasts • Provide a deep insight into state-of-the-art package designs and materials • Describe actual discrete devices packaging and innovations • Identify the key technology trends that will shape the market in the future • Understand the main challenges and proposed innovations • Provide supply chain analysis and trends ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  3. 3. 3 REPORT METHODOLOGY Market segmentation methodology Market forecast methodology ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  4. 4. 4 REPORT METHODOLOGY Technology analysis methodology Information collection ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  5. 5. 5 TABLE OF CONTENTS Part 1/1  Who should be interested in this report 5  Objectives of the report 6  What we missed… What we saw… 7  What is in this report? 8  Companies cited in the report 9  List of abbreviations 10  Executive summary 11  Thermo-mechanical issues in power modules 32  Overall power electronics market 39  Power module market 46  Global trends for power module packaging 53  Power module packaging 69 o Composition of a conventional power module o Power module materials and process choice o Interconnections o Die and substrate attach o Encapsulation o Substrate o Baseplate o Thermal interface materials (TIMs)  Latest power modules - Case studies 162  Raw material market for power packaging 175 o Yole’s methodology for market metrics  Specific market analysis of each part of the module: 180 o Interconnections in power modules o Die attach for power modules o Substrate attach for power modules o Encapsulation for power modules o Substrates for power modules o Baseplates for power modules  Business model and supply chain analysis 215  Discrete device packaging 233  Trends in discrete device packaging 248  General conclusion 260  Yole Développement presentation 265 ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  6. 6. 6 Biographies & Contacts ABOUT THE AUTHORS Mattin GraoTxapartegi Mattin Grao Txapartegi is a Power Electronics Analyst at Yole Développement. He is engaged in many custom studies and reports dedicated to the evolution of inverters architecture, passive components, and recently he has been in charge for the power packaging topics. Mattin is daily driving technology and market scouting, roadmap definition, disruptive technologies and market opportunities identification and competitive landscape analysis. Previously he acquired a comprehensive expertise in the design of power converters for electric vehicles at the car manufacturer Renault. He graduated from Grenoble INP with an Engineering degree in Electrical Systems. He then earned an advanced master’s degree in Aeronautics Engineering from Arts et Métiers ParisTech. During this time, he oversaw managerial, financial and marketing fields within the aeronautics industry. grao@yole.fr Dr. Milan Rosina Dr. Milan Rosina is a Senior Analyst for Energy Conversion and Emerging Materials at Yole Développement. Before joining Yole, he worked as a Research Scientist and a Project Manager in the fields of photovoltaics, microelectronics, and LED. Dr. Rosina has more than 15 years of scientific and industrial experience with prominent research institutions, an equipment maker, and a utility company. His expertise includes new equipment and process development, due diligence, technology, and market surveys in in the fields of power electronics, renewable energies, energy storage, batteries, and innovative materials and devices. rosina@yole.fr ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  7. 7. Body sample
  8. 8. 8 OVERALL POWER ELECTRONICS MARKET Market metrics, split by device type In 2016, the power device market was worth $xxB and it will grow steadily for the next five years. ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  9. 9. 9 POWER MODULE MARKET Segmentation used in this report: discrete components and power modules The two main types of packaging will be studied in this report: discrete components and power modules Semiconductor Devices Chips (Dies) One single device in the package Many devices in the package Discrete components Power modules • Two different technologies are used to assembly devices for power electronics: - Discrete components - Power modules • One or other technology is chosen according to system needs, in terms of: - Power - Voltage - Current - Geometry ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  10. 10. 10 THERMOMECHANICAL ISSUES IN POWER MODULES Origins of thermally-induced stress and resulting failures Origins of the thermally-induced stress Strain Failures The strain as a response of the system to an applied stress depends on • Properties of materials used (xxxxxxxxx,CTE …) • Device xxxx (xxxxxxxxxxxxxx xxxxxxxxxxxxxxx xxxxxxxxxxx…) and other: • Substrate fracture • Loss of dielectric properties due to thermal degradation of material • … T Time High temperature T Time Long exposure to elevated temperature T Time Rapid temperature variation T Distance Non-uniform temperature distribution High ∆T/∆L t1 t2 L1 L2 High ∆T/∆t *in operating condition or during device manufacturing (soldering…) Solder delamination Wire bond lift off Wire bond crackDie attach solder crack Wire bond broken Solder fatigue Crack in DBC substrate copper layer Cracks in substrate attach solder Baseplate Solder DBC ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  11. 11. 11 GLOBAL TRENDS FOR POWER MODULE PACKAGING Roadmap of power module packaging design In the future power modules will have been entirely reshaped, with the changes depending on the power targeted Bosch example • Molded package • Top leadframe interconnections • Low inductance xxxx example • Six Pack IGBT/Diode Package • Cooling fin • Thick copper layer for thermal spreading • xxxxxxxxxxxx Mid-power modules Design evolution Die on heatsink • Die attach: film sintering? Gold sintering? Glue? Xxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx 2018 2020 2014 • Over-molded package • Top leadframe • Flexible interconnection foils • Xxxxxxxxxxxxx • xxxxxxxxxxxxx • Double side cooling • Ribbon bonding • Silver (Ag) sintering for die attach • xxxxxxxxxxxxxxxx • xxxxxxxxxxxxxxxx Towards: ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  12. 12. 12 GLOBAL TRENDS FOR POWER MODULE PACKAGING Interconnections • For interconnections the main challenge is to increase the contact surface area in order to decrease losses. However, this can also highlight some CTE issues. • Today’s primary solution is aluminum wire bonding, which is a cheap, mature and easy-to-process technology • Some players already position themselves in alternative solutions such as xxxxxxxxxxxx or xxxxxxxxxxx connections. Other advanced technologies will be developed inspired by Semikron’s flexible interconnection foil SKiN technology. • Xxxxxxxxxxxxxxx propose alternative technologies that needs still to prove their maturity/reliability, such as ball bonding. • In the future we expect interconnections to play a major role in heat dissipation inside the module, with wider acceptance of dual side cooling Key challenges for interconnection development: using larger contact areas providing better thermal and electrical performance and possibly dual side cooling 2016 2018 2025… Xxxxxxxxx is similar to wire bonding, but because the surface is bigger, losses are reduced Copper is a better material for interconnection than aluminum because it supports a higher current density “xxxxxxxxxxxxxxx allows a maximized contact surface between dies and connection AND dual side cooling Xxxxxxxx is an original solution that lengthens lifetime AND allows dual side cooling 2020 Flexible interconnections foils brings xxxxxxxxxxxxxxxxxx Xxxxxxxxxxxxxxxxxxxxxxx Xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  13. 13. 13 ENCAPSULATION Focus on silicone gel for high temperatures Encapsulant solutions suited for continuous high temperature operation are sought for power electronics. • Increasing operating temperatures for power electronics modules and progressive penetration of SiC devices, allowing high temperature operation, raise demand on high- temperature encapsulation solutions. • The thermally-driven oxygen degradation mechanisms deteriorate silicone gel encapsulant properties when exposed to elevated temperature for an extended period of time.  Silicone gel hardens and cracks • The encapsulant suppliers have developed encapsulant with improved resistance to cracking and void formation, suitable for high operating temperatures. Increasing operating temperature for power modules Higher current density Lower cooling requirements Packaging materials (encapsulation…) Enabler Benefits High-temperature encapsulation sought! 150°C  175°C and higher Silicon carbide power devices penetration Gel Manufacturer Dielectric strength (kV/mm) CTE (ppm/°C) Temperature range xxxxx xxxxx >23 N/A -50°C to +210°C xxxxx xxxxx 22 N/A -40°C to +185°C xxxxx Dow Corning 16 (21) 300 xxxxxxxx xxxxx NuSil Technology (now part of Avantor) 17.7 320 -65°C to +240°C Commercially available high-temperature silicone gel products Yole Développement ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  14. 14. 14 SUBSTRATE Future trends: ceramic substrates • Even though new substrate alternatives are coming to the playground, still the Al2O3 ceramic substrate is the mainstream in the industry. • The other two ceramics substrates will gain market shares in the coming years, driven by higher power density needs, and thereby enhanced thermal conductivity paths.The arrival of WBG devices will inevitably accelerate this trend. • Xxxxx ceramic, more expensive than xxxx today, will see the greatest growth due to their use in power modules for the expanding xxxxxx market. • Its mechanical robustness and longer life-time will make xxxxx the second choice substrate in the coming years. xxxx ceramic will be the technology having the greatest expansion in the coming years. Al2O3 DBC Today xxxxxx Japan uses widely xxxx AMB for xxxxxxxx Industrial applications starts using AlN for high thermal conductivity AlN DBA/DBC Europe starts using xxxx AMB for xxxxxxxxx With higher power densities, xxxx substrate market shares will grow considerably, driven by the EV/HEV growth Xxxxxxxxxxxxx Xxxxxxxxxxxxxx Xxxxxxxxxxxxxx characteristics, offered by AlN. Meanwhile,Al2O3 DBC will remain the mainstream, as a mature and cheap technology. Today,Al2O3 is the mainstream with around xx% of the market ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  15. 15. 15 THERMAL INTERFACE MATERIALS Power modules with pre-appliedTIM Some power module manufacturers offers power modules with pre-applied TIM layer • The benefits of that approach are the following: • Low thermal resistance • Reduced process time in manufacturing • xxxxxxxxxxxxxxxx • xxxxxxxxxxxxxxx • xxxxxxxxxxxxxxx • xxxxxxxxxxxxx • The thermally conductive paste is applied to the modules using a stencil-printing or screen- printing processes. • A honeycomb-like structure prevents xxxxxxxxxxxxx. • The power modules with pre-applied TIM should be stored in the blister boxes with a protective lid. + TIM + + Power module with pre-applied TIM The TIM layer and its thickness is already adjusted to a given power module type  enabling lower TIM thickness and thus better thermal management Power module with pre-applied TIM layer Infineon Printed TIM layer in form of a “honeycomb” structure, that allows xxxxxxxxxxxxx Thermal paste application using screen printing Vincotech TIM layer is to be adjusted to both power module and heat sink 1. 2. Conventional approach Pre-appliedTIM Conventional approach and pre-applied TIM approach Yole Développement ? Image: Semikron ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  16. 16. 16 RAW MATERIAL MARKET FOR POWER PACKAGING Raw materials market size in 2016 Power module packaging represented a $1.1B market in 2016 • In a power module, the materials cost for the packaging represented about 37% of the power module cost in 2016. This share is decreasing due to reduced material cost and numbers of interfaces. • This share does not include chassis materials, such as plastic moldings, lead frames, busbars and various chassis sealants. ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  17. 17. 17 DIE ATTACH FOR POWER MODULES Die attach market size evolution in Mcm³ between 2016 and 2021, split by application The die attach material demand will be driven by motor drives, and electrified vehicles. ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  18. 18. 18 BUSINESS MODEL AND SUPPLY CHAIN ANALYSIS Evolution of business models in the future In the future business models will be centered on power modules Power module (PM) maker Inverter makerDevice maker B C D • In coming years we expect companies to center their activities on power module manufacturing,but including vertical integration, whether integrating device manufacturing or inverter manufacturing • xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  19. 19. 19 DISCRETE DEVICE PACKAGING How will discrete device packages evolve? The key objectives are the same for discrete devices and for power modules: increase efficiency and power density • Discrete component packaging evolution shares the same motivations as power modules: • Miniaturization • Power density increase • Efficiency increase • Yield increase Time Package Size 2000 2010Before 2000 2020 ~ mm ~ 10mm ~ 100mm ~ cm xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx Growing challenges related to heat dissipation  focus on development of excellent heat dissipation products ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  20. 20. 20 RELATED REPORTS Discover more related reports within our bundles here. ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  21. 21. In 2016, the power module market was worth almost $3.2B and from there it will grow steadily for the next five years. As of 2016, almost 40% of the power module cost concerns raw materials used for packaging. Materials for die- attach, substrate-attach, substrate, baseplate, encapsulation, interconnections and casings constitute a $1.1B market in 2016. This market will grow and reach $1.8B by 2021. Yet the growth will not be even across all raw material markets. Die-attach materials have the highest forecast compound annual growth rate (CAGR) for 2016- 2021, at over 13%. Casings and encapsulation have the lowest CAGR, at 5-7% for 2016-2021. The main differences arise from technology choices for those materials and their impact on the each market segment. For instance, the greater presence of epoxy resin will reduce the cost of encapsulation in power modules. Substrates and baseplates account for half of the packaging raw material market, and together are worth over $550M. Therefore, the choice of technology in ceramic substrates or baseplates can have a great impact on final power module cost. Around 25% of the cost is related to die- attach or substrate attach material. The rest of the cost is divided between encapsulation, interconnections and the casing. Industrial applications remain the biggest part of the power module market. However, the electric and hybrid car market, with its double digit growth forecast for the period 2016-2021, will represent around 40% of this market by 2021. Moreover, the automotive industry is leading in technological innovations in packaging, helping and accelerating the implementation of these new technologies thanks to high manufacturing volumes. POWER MODULE PACKAGING: MATERIAL MARKET AND TECHNOLOGY TRENDS Market & Technology report - May 2017 THE POWER MODULE PACKAGING MARKET WILL GROW AT 9.5% PER YEAR FROM 2016-2021, REACHING ALMOST $1.8B How new applications drive the choice of power module materials and designs. KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com • 2016-2021 market value for the power electronics field and especially for power modules • Complete analysis of power module packaging design • Deep insight into each part of a standard power module package: substrate, baseplate, die attach, substrate attach, encapsulation and interconnections • Detailed analysis of thermal interface materials (TIMs) • Presentation of case studies and technological innovations • 2016-2021 market metrics and forecasts for each type of packaging component covering substrate, baseplate, die attach, substrate attach, encapsulation and interconnections • Presentation of thermomechanical issues in power modules • Complete presentation of discrete devices packaging • Trends for discrete device packaging • Supply chain analysis and evolution trends WHAT’S NEW • Focus on thermo-mechanical issues in power modules • Analysis of the newest power module designs • Insight into emerging business models within the supply chain • Focus on parylene encapsulation solution (Yole Développement, May 2017) Material market size evolution for power module packaging between 2016-2021 (M$) Split by component: substrate, baseplate, die attach, substrate attach, encapsulation, interconnections and casing STRONG RESHAPING OF THE SUPPLY CHAIN EXPECTED According to Yole Développement’s analysis, the power module market is becoming extremely competitive with several new players arriving from different directions. In recent years, we have also seen consolidation among power semiconductor market leaders with several acquisitions, such as Infineon Technologies buying International Rectifier and ON Semiconductor buying Fairchild Semiconductor. These moves were intended to strengthen positions in the overall power semiconductor business. Nevertheless, in coming years the market leaders will face strong competition from Tier-1 automotive manufacturers such as Denso or Bosch and new entrants from China such as Starpower and CRRC. Outsourced Semiconductor Assembly and Test companies (OSATs) could also propose services to provide advanced packaging technologies to - 200 400 600 800 1 000 1 200 1 400 1 600 1 800 2016 2017 2018 2019 2020 2021 Marketvalue(M$)
  22. 22. POWER MODULE PACKAGING: MATERIAL MARKET AND TECHNOLOGY TRENDS (Yole Développement, May 2017) Power packaging supply chain reshaping HOW NEW POWER MODULE DESIGN TECHNOLOGY CHOICES IMPACT THE BUSINESS ECOSYSTEM’S EVOLUTION (Yole Développement, May 2017) Impact of power module design on the choice of packaging materials: example of a double-side cooling design In recent years, several new power module designs have emerged, principally driven by the severely challenging requirements for high power density and integration fromtheautomotiveindustry.Indeed,electricandhybrid cars are the best example of technology innovation in the design of power modules. The Toyota Prius’ fourth generation double-sided cooling power modules might be the most well-known example. Yet today many other module manufacturers are also proposing new designs that move away from conventional power module layers and technologies. In this report, Yole Développement shows the latest power module designs with their cross sections, explanations about materials used, etc. The innovations in power module design will not be made without impacting the materials and processes used in power module packaging. The role of the ceramic substrate and baseplate is being rethought, as in order to achieve smaller and better integrated power modules. A trend towards layer suppression has clearly been adopted in those industries where size, weight and integration is a must. Again, principally in the automotive industry, direct cooled baseplates using pin-fins have become common. They avoid the use of Thermal Interface Materials (TIMs) that are responsible for a considerable part of the thermal resistance and form voids over time, deteriorating the thermal conductivity and reliability even more. IGBT dies directly soldered to leadframes have also appeared, enabling a highly conductive substrate, but still requiring some sort of electrically insulating layer. Power modules designed for double-sided cooling will use epoxy resin encapsulation and wire-bond-free interconnections. On the substrate side, both ceramic and leadframe options could be used. Yole Développement has also analyzed the other industries where the classical power module design will persist. However, even in those cases very interesting advanced material technologies will come to enhance their reliability, robustness and thermal/ electrical efficiency. Silver sintering is obviously one of the big stars, as a growing number of players are being seduced by this technology as a replacement for soldering in die attach. The report highlights the advantages of sintering, but also the remaining manufacturing barriers that it must overcome to be widely adopted by the industry. The differences between Al2O3, AlN and Si3N4 ceramics and the expansion of the highly thermally conductive AlN and Si3N4 over coming years will be explained. AlN will continue its growth in industrial and renewable energy markets, while a strong push for Si3N4 could come from the automotive industry. The arrival of wide-band gap devices using SiC and GaN semiconductor materials calls for specially-adapted packaging solutions. Encapsulation technologies must power module manufacturers. This will define a new business model that diverges from the traditional power module supplier business. Thereby, all companies involved in the power module market will need to adapt or rethink their offerings and especially secure their technological advances via continuous innovations. $5.2B in 2021 OSATs … *OSAT: Outsourced Semiconductor Assembly andTest $3.2B in 2016 Power module market New players are coming... Interconnections Wire-bonds Wire-bond-free Encapsulation Epoxy Silicone gel Substrate Ceramics Lead frame Other Baseplate + Top-die attach + Spacers Double-side power module cooling design Impact of power module design on the choice of packaging materials: example of a double-side cooling design
  23. 23. Find more details about this report here: MARKET TECHNOLOGY REPORT Who should be interested in this report 5 Objectives of the report 6 What we missed… What we saw… 7 What is in this report? 8 Companies cited in the report 9 List of abbreviations 10 Executive summary 11 Thermo-mechanical issues in power modules 32 Overall power electronics market 39 Power module market 46 Global trends for power module packaging 53 Power module packaging 69 Composition of a conventional power module Power module materials and process choice Interconnections Die and substrate attach Encapsulation Substrate Baseplate Thermal interface materials (TIMs) Latest power modules - Case studies 162 Raw material market for power packaging 175 Yole’s methodology for market metrics Specific market analysis of each part of the module 180 Interconnections in power modules Die attach for power modules Substrate attach for power modules Encapsulation for power modules Substrates for power modules Baseplates for power modules Business model and supply chain analysis 215 Discrete device packaging 233 Trends in discrete device packaging 248 General conclusion 260 Yole Développement presentation 265 TABLE OF CONTENTS (complete content on i-Micronews.com) COMPANIES CITED IN THE REPORT (non exhaustive list) ABB, ACC, Alpha, AM2T, Amkor, AOS, APE, aPSI3D, Avator, ATS, BlueStar, Silicones Bosch, BYD, CeramTec, Comelec, Continental, CPS Technologis, Danfoss, Delphi, Denso, Dow Corning, Dowa, Dupont, Dynex, Electrolube, Fuji Electric, GaN Systems, GE, General Electric, Hala, Henkel, Heraeus, Hitachi, Hitachi Chemical, Honda, Indium Corporation, Infineon, Intel, International Rectifier, KCC, Kisco Conformal Coating, Kyocera, LS, Mersen, Mitsubishi Electric, Mitsubishi Materials, Momentive, Müller-Ahlhorn, Nusil Technology, Plansee, Powerex, Powerstax, Ravelin Materials, RHP Technology, RUISIL, Schneider Electric, Semikron, ShinEtsu, Specialty Coating Systems (SCS), Shanghai Hua Hong NEC, Shin Etsu, Siemens, Starpower, STATS ChipPAC, STMicroelectronics, Texas Instruments, Toshiba, Toyota, TSMC, Valeo, Vincotech, Wacker • Power Electronics for EV/HEV 2016: Market, Innovations and Trends • Inverter Technology Trends and Market Expectations • Gate Driver Market and Technology Trends 2017 • Toyota Prius 4 PCU Power Modules • Infineon CooliR²Die™ Power Module Find all our reports on www.i-micronews.com RELATED REPORTS Benefit from our Bundle Annual Subscription offers and access our analyses at the best available price and with great advantages AUTHORS Mattin Grao Txapartegi is a Power Electronics Analyst at Yole Développement. He is engaged in many custom studies and reports dedicated to the evolution of inverters architecture, passive components, and recently he has been in charge for the power packaging topics. Mattin is daily driving technology and market scouting, roadmap definition, disruptive technologies and market opportunities identification and competitive landscape analysis. Previously he acquired a comprehensive expertise in the design of power converters for electric vehicles at the car manufacturer Renault. He graduated from Grenoble INP with an Engineering degree in Electrical Systems. He then earned an advanced master’s degree in Aeronautics Engineering from Arts et Métiers ParisTech. During this time, he oversaw managerial, financial and marketing fields within the aeronautics industry. Dr. Milan Rosina is a Senior Analyst for Energy Conversion and Emerging Materials at Yole Développement. Before joining Yole, he worked as a Research Scientist and a Project Manager in the fields of photovoltaics, microelectronics, and LED. Dr. Rosina has more than 15 years of scientific and industrial experience with prominent research institutions, an equipment maker, and a utility company. His expertise includes new equipment and process development, due diligence, technology, and market surveys in in the fields of power electronics, renewable energies, energy storage, batteries, and innovative materials and devices. evolve to handle high operating temperatures. Standard silicone gel and epoxy are limited in terms of temperature, and new materials such as parylene are being developed, although still struggling with high costs. Low-inductance interconnections, and die attach compatible with high operating temperatures are also needed. All these technology trends are creating opportunities for some material suppliers, but at the same time, they are threatening some of today’s businesses for power packaging. The most obvious case is the risk for TIM suppliers that direct cooled baseplates could result in no need for TIMs. Also, the largely used aluminum wire bonding solution can be supplanted by top leadframe connections, flexible interconnection foils or copper and gold wire bonding. Meanwhile, double sided cooling technology will open a second market for top die- attach connection for solder and sintering solution suppliers. Thereby, it is crucial to understand the synergies and impacts of the technology choices on the other materials or technology solutions. Yole Développement’s report summarizes these synergies with illustrative visual figures. REPORT OBJECTIVES • Provide power module packaging market analysis and forecasts • Provide a deep insight into state-of-the-art package designs and materials • Describe actual discrete devices packaging and innovations • Identify the key technology trends that will shape the market in the future • Understand the main challenges and proposed innovations • Provide supply chain analysis and trends
  24. 24. ORDER FORM Power Module Packaging: Material Market and Technology Trends SHIPPING CONTACT First Name: Email: Last Name: Phone: PAYMENT BY CREDIT CARD Visa Mastercard Amex Name of the Card Holder: Credit Card Number: Card Verification Value (3 digits except AMEX: 4 digits): Expiration date: BY BANK TRANSFER BANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France, Bank code: 30056, Branch code: 00170 Account No: 0170 200 1565  87, SWIFT or BIC code: CCFRFRPP, IBAN: FR76 3005 6001 7001 7020 0156 587 RETURN ORDER BY • FAX: +33 (0)472 83 01 83 • MAIL: YOLE DÉVELOPPEMENT, Le Quartz, 75 Cours Emile Zola, 69100 Villeurbanne/Lyon - France SALES CONTACTS • North America - Steve Laferriere: +13106 008 267 laferriere@yole.fr • Europe RoW - Lizzie Levenez: + 49 15 123 544 182 levenez@yole.fr • Japan Rest of Asia - Takashi Onozawa: +81 3 6869 6970 onozawa@yole.fr • Greater China - Mavis Wang: +886 979 336 809 wang@yole.fr • Specific inquiries: +33 472 830 180 – info@yole.fr (1) Our Terms and Conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx The present document is valid 24 months after its publishing date: May 25, 2017 / ABOUT YOLE DEVELOPPEMENT BILL TO Name (Mr/Ms/Dr/Pr): Job Title: Company: Address: City: State: Postcode/Zip: Country*: *VAT ID Number for EU members: Tel: Email: Date: PRODUCT ORDER - Ref YDPE17018 Please enter my order for above named report: One user license*: Euro 5,490 Multi user license: Euro 6,490 - The report will be ready for delivery from May 25, 2017 - For price in dollars, please use the day’s exchange rate. All reports are delivered electronically at payment reception. For French customers, add 20% for VAT I hereby accept Yole Développement’s Terms and Conditions of Sale(1) Signature: *One user license means only one person at the company can use the report. Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Displays, Image Sensors, Optoelectronics, Microfluidics Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries Energy Management. The “More than Moore” company Yole and its partners System Plus Consulting, Blumorpho, KnowMade and PISEO support industrial companies, investors and RD organizations worldwide to help them understand markets and follow technology trends to develop their business. MEDIA EVENTS • i-Micronews.com, online disruptive technologies website • @Micronews, weekly e-newsletter • Communication webcasts services • Events: Yole Seminars, Market Briefings… More information on www.i-micronews.com CONTACTS For more information about : • Consulting Services: Jean-Christophe Eloy (eloy@yole.fr) • Financial Services: Jean-Christophe Eloy (eloy@yole.fr) • Report Business: Fayçal Khamassi (khamassi@yole.fr) • Press relations: Sandrine Leroy (leroy@yole.fr) CONSULTING • Market data research, marketing analysis • Technology analysis • Reverse engineering costing services • Strategy consulting • Patent analysis More information on www.yole.fr REPORTS • Collection of technology market reports • Manufacturing cost simulation tools • Component reverse engineering costing analysis • Patent investigation More information on www.i-micronews.com/reports FINANCIAL SERVICES • Mergers Acquisitions • Due diligence • Fundraising More information on Jean-Christophe Eloy (eloy@yole.fr)
  25. 25. © 2017 From Technologies to Market Yole Développement FromTechnologies to Market
  26. 26. 22 FIELDS OF EXPERTISE Yole Développement’s 30 analysts operate in the following areas MEMS Sensors Compound Semi. Imaging Photonics MedTech Manufacturing Advanced Packaging Batteries / Energy Management Power Electronics Displays RF Devices Techno. Advanced Substrates Solid State Lighting (LED, OLED, …) ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  27. 27. 23 4 BUSINESS MODELS o Consulting and Analysis • Market data research, marketing analysis • Technology analysis • Strategy consulting • Reverse engineering costing • Patent analysis www.yole.fr o Reports • Market technology reports • Patent Investigation and patent infringement risk analysis • Teardowns reverse costing analysis • Cost simulation tool www.i-Micronews.com/reports o Financial services • MA (buying and selling) • Due diligence • Fundraising • Maturation of companies • IP portfolio management optimization www.yolefinance.com www.bmorpho.com o Media • i-Micronews.com website • @Micronews e-newsletter • Communication webcast services • Events www.i-Micronews.com ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  28. 28. 24 A GROUP OF COMPANIES Market, technology and strategy consulting www.yole.fr MA operations Due diligences www.yolefinance.com Manufacturing costs analysis Teardown and reverse engineering Cost simulation tools www.systemplus.fr IP analysis Patent assessment www.knowmade.fr Innovation and business maker www.bmorpho.com Test Measurement Expertise Research Innovation www.piseo.fr ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  29. 29. 25 OUR GLOBAL ACTIVITY 30%of our business 40%of our business 30%of our business Yole Inc. Greater China office Yole Japan HQ in Lyon Nantes Paris Nice Vénissieux Europe office Frankfurt Hsinchu Tokyo Phoenix Yole Korea Seoul ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  30. 30. 26 RESEARCH PRODUCTS - CONTENT COMPARISON Custom analysis scope is defined with you to meet your information and budget needs Breadth of the analysis Depthoftheanalysis Custom Analysis Workshops Standard Reports ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  31. 31. 27 SERVING THE ENTIRE SUPPLY CHAIN Our analysts provide market analysis, technology evaluation, and business plan along the entire supply chain Integrators and end-users Device makers Suppliers: material, equipment, OSAT, foundries… Financial investors, RD centers ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  32. 32. 28 SERVING MULTIPLE INDUSTRIAL FIELDS We are working accross multiples industries to understand the impact of More-than- Moore technologies from device to system From A to Z… Transportation makers Mobile phone and consumer electronics Automotive Medical systems Industrial and defense Energy ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  33. 33. 29 REPORTS COLLECTION o Yole Développement publishes a comprehensive collection of market technology reports and patent analysis in: • MEMS Sensors • RF devices technologies • Imaging • Medical technologies (MedTech) • Photonics • Advanced packaging • Manufacturing • Power electronics • Batteries and Energy management • Compound semiconductors • LED • Displays o You are looking for: • An analysis of your product market • A review of your competitors evolution • An understanding of your manufacturing and production costs • An understanding of your industry technology roadmap and related IPs • A clear view on the evolution of the supply chain The combined team of 50+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape. In the past 18 years, we worked on more than 1 500 projects, interacting with technology professional and high level opinion makers from the main players of the industry. o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers. www.i-Micronews.com ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  34. 34. 30 OUR 2017 REPORTS PLANNING (1/2) MARKET ANDTECHNOLOGY REPORTS byYole Développement o MEMS SENSORS − Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017 − MEMS Microphones, Speakers and Audio Solutions 2017 − Status of the MEMS Industry 2017 − MEMS Sensors for Automotive 2017 − High End Inertial Sensors for Defense and Industrial Applications 2017 − Sensor Modules for Smart Building 2017 − Sensing and Display for AR/VR/MR 2017 (Vol 1) − MEMS Packaging 2017 − Magnetic Sensors Market and Technologies 2017** − Microspectrometers Markets and Applications 2017** o RF DEVICES AND TECHNOLOGIES − RF Components and Modules for Cellphones 2017 − Advanced RF SiP for Cellphones 2017 − 5G and Beyond (Vol 1): Impact on RF Industry, from Infrastructure to Terminals 2017 − 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals 2017 − RF Technologies for Automotive Applications 2017 − GaN and Si LDMOS Market and Technology Trends for RF Power 2017 o IMAGING OPTOELECTRONICS − 3D Imaging Sensing 2017 − Status of the CMOS Image Sensor Industry 2017 − Camera Module for Consumer and Automotive Applications 2017 − Uncooled Infrared Imaging Technology Market Trends 2017 − Active Imaging and Lidars 2017 (vol 1) o MEDTECH − Status of the Microfluidics Industry 2017 − Solid State Medical Imaging 2017 − Sensors for HomeCare 2017 − Sensors for Medical Robotics 2017 − Organs-on-a Chip 2017 o ADVANCED PACKAGING − Advanced Substrates Overview 2017 − Status of the Advanced Packaging Industry 2017 − Fan Out Packaging: Market Technology Trends 2017 − 3D Business Update: Market Technology Trends 2017 − Advanced QFN: Market Technology Trends 2017** − Inspection and Metrology for Advanced Packaging Platform 2017** − Advanced Packaging for Memories 2017 − Embedded Die Packaging: Technologies and Markets Trends 2017 o MANUFACTURING − Glass Substrate Manufacturing 2017 − Equipment Materials for Fan Out Technology 2017 − Equipment Materials for 3D T(X)V Technology 2017 − Emerging Non Volatile Memories 2017 ** To be confirmed ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  35. 35. 31 OUR 2017 REPORTS PLANNING (2/2) o POWER ELECTRONICS − Status of Power Electronics Industry 2017 − Power Mosfets Market and Technology Trends 2017 − IGBT Market and Technology Trends 2017 − Power Packaging Market and Technology Trends 2017 − Power SiC 2017: Materials, Devices, and Applications − Power GaN 2017: Materials, Devices, and Applications − Materials Market Opportunities for Cellphone Thermal Management (Battery Cooling, Fast Charging, Data Processing, Battery Cooling, etc.) 2017 − Gate Driver Market and Technology Trends in Power Electronics 2017 − Power Management ICs Market Quarterly Update 2017 − Power Electronics for Electrical Aircraft, Rail and Buses 2017 − Thermal Management for LED and Power 2017 o BATTERY AND ENERGY MANAGEMENT − Status of Battery Industry for Stationary, Automotive and Consumer Applications 2017 o COMPOUND SEMICONDUCTORS − Power SiC 2017: Materials, Devices, and Applications − Power GaN 2017: Materials, Devices, and Applications − GaN and Si LDMOS Market and Technology Trends for RF Power 2017 − Bulk GaN Technology Status and Market Expectations (Power, LED, Lasers) 2017 o DISPLAYS − Microdisplays and MicroLEDs 2017 − Display for Augmented Reality, Virtual Reality and Mixed Reality 2017 − QD for Display Applications 2017 − Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays − Emerging Display Technologies 2017** o LED − UV LEDs 2017 - Technology, Manufacturing and Application Trends − Agricultural Lighting 2017 - Technology, Industry and Market Trends − Automotive Lighting 2017 - Technology, Industry and Market Trends − Active Imaging and Lidar 2017 (Vol 2) - IR Lighting** − LED Lighting Module 2017 - Technology, Industry and Market Trends − IR LEDs 2017 - Technology, Manufacturing and Application Trends − Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays − CSP LED Module 2017 − LED Packaging 2017 PATENT ANALYSIS by Knowmade − 3D Monolithic Memory: Patent Landscape Analysis − Microfluidic Diagnostic: Patent Landscape Analysis − GaN Technology: Top-100 IP profiles** − Uncooled Infrared Imaging: Patent Landscape Analysis** − MEMS Microphone: Patent Landscape Analysis** − MEMS Microphone: Knowles' Patent Portfolio Analysis** − MicroLEDs: Patent Landscape Analysis** − Microbolometer: Patents used in products** − Micropumps: Patent Landscape Analysis** − Flexible batteries: Patent Landscape Analysis** TEARDOWN REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be published in 2017. ** To be confirmed ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  36. 36. 32 OUR 2016 PUBLISHED REPORTS LIST (1/2) MARKET AND TECHNOLOGY REPORTS by Yole Développement o MEMS SENSORS − Gas Sensors Technology and Market 2016 − Status of the MEMs Industry 2016 − Sensors for Cellphones and Tablets 2016 − Market and Technology Trends of Inkjet Printheads 2016 − Sensors for Biometry and Recognition 2016 − Silicon Photonics 2016 o IMAGING OPTOELECTRONICS − Status of the CMOS Image Sensor Industry 2016 − Uncooled Infrared Imaging Technology Market Trends 2016 − Imaging Technologies for Automotive 2016 − Sensors for Drones Robots: Market Opportunities and Technology Evolution 2016 o MEDTECH − BioMEMS 2016 − Point of Care Testing 2016: Application of Microfluidic Technologies o ADVANCED PACKAGING − Embedded Die Packaging: Technology and Market Trends 2017 − 2.5D 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016 − Fan-Out: Technologies and Market Trends 2016 − Fan-In Packaging: Business update 2016 − Status and Prospects for the Advanced Packaging Industry in China 2016 o MANUFACTURING − Thin Wafer Processing and Dicing Equipment Market 2016 − Emerging Non Volatile Memories 2016 o COMPOUND SEMICONDUCTORS − Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends − GaN RF Devices Market: Applications, Players, Technology and substrates 2016 − Sapphire Applications Market 2016: from LED to Consumer Electronics − Power SiC 2016: Materials, Devices, Modules, and Applications o LED − UV LED Technology, Manufacturing and Applications Trends 2016 − OLED for Lighting 2016 – Technology, Industry and Market Trends − Automotive Lighting: Technology, Industry and Market Trends 2016 − Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 − Organic Thin Film Transistor 2016: Flexible Displays and Other Applications − Sapphire Applications Market 2016: from LED to Consumer Electronics − LED Packaging 2017: Market, Technology and Industry Landscape o POWER ELECTRONICS − Power Electronics for EV/HEV 2016: Market, Innovations and Trends − Status of Power Electronics Industry 2016 − Passive Components Technologies and Market Trends for Power Electronics 2016 − Power SiC 2016: Materials, Devices, Modules, and Applications − Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends − Inverter Technologies Trends Market Expectations 2016 − Opportunities for Power Electronics in Renewable Electricity Generation 2016 − Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 − GaN RF Devices Market: Applications, Players, Technology and substrates 2016 o BATTERY AND ENERGY MANAGEMENT − Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016 − Stationary Storage and Automotive Li-ion Battery Packs 2016 − Opportunities for Power Electronics in Renewable Electricity Generation 2016 ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  37. 37. 33 OUR 2016 PUBLISHED REPORTS LIST (2/2) PATENT ANALYSIS by Knowmade − Microbattery Patent Landscape Analysis − Miniaturized Gas Sensors Patent Landscape Analysis − 3D Cell Culture Technologies Patent Landscape − Phosphors and QDs for LED Applications Patent Landscape 2016 report − TSV Stacked Memory Patent Landscape − Fan-Out Wafer Level Packaging Patent Landscape Analysis TEARDOWN REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be published in 2017. MORE INFORMATION o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com. o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer.You then have up to 12 months to select the required reports from theYole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports automatically (multi-user format). Contact your sales team according to your location (see the last slide). ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  38. 38. 34 MICRONEWS MEDIA o About Micronews Media To meet the growing demand for market, technological and business information, Micronews Media integrates several tools able to reach each individual contact within its network.We will ensure you benefit from this. ONLINE ONSITE INPERSON @Micronews e-newsletter i-Micronews.com i-Micronewsjp.com FreeFullPDF.com Events Webcasts Unique, cost-effective ways to reach global audiences. Online display advertising campaigns are great strategies for improving your product/brand visibility.They are also an efficient way to adapt with the demands of the times and to evolve an effective marketing plan and strategy. Brand visibility, networking opportunities Today's technology makes it easy for us to communicate regularly, quickly, and inexpensively – but when understanding each other is critical, there is no substitute for meeting in-person. Events are the best way to exchange ideas with your customers, partners, prospects while increasing your brand/product visibility. Targeted audience involvement equals clear, concise perception of your company’s message. Webcasts are a smart, innovative way of communicating to a wider targeted audience.Webcasts create very useful, dynamic reference material for attendees and also for absentees, thanks to the recording technology. Benefit from the i-Micronews.com traffic generated by the 8,500+ monthly visitors, the 11,500+ weekly readers of @Micronews e-newsletter Seven main events planned for 2017 on different topics to attract 140 attendees on average Gain new leads for your business from an average of 300 registrants per webcast Contacts: CamilleVeyrier (veyrier@yole.fr) and Clotilde Fabre (fabre@yole.fr), Marketing Communication Project Managers. ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample
  39. 39. 35 CONTACT INFORMATION Follow us on o CONSULTING AND SPECIFIC ANALYSIS • North America: Steve LaFerriere, Director of Northern America Business Development Email: laferriere@yole.fr – +1 31 06 008 267 • Japan Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development Email: onozawa@yole.fr - +81 3 4405 9204 • Greater China: Mavis Wang, Director of Greater China Business Development Email: wang@yole.fr - +886 979 336 809 • RoW: Jean-Christophe Eloy, CEO President, Yole Développement Email eloy@yole.fr - +33 4 72 83 01 80 o REPORT BUSINESS • North America: Steve LaFerriere, Director of Northern America Business Development Email: laferriere@yole.fr – +1 31 06 008 267 • Europe: Lizzie Levenez, EMEA Business Development Manager Email: levenez@yole.fr - +49 15 123 544 182 • Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development Email: onozawa@yole.fr - +81 3 4405 9204 • Japan Asia: Miho Othake, Account Manager Email: ohtake@yole.fr - +81 3 4405 9204 • Greater China: Mavis Wang, Director of Greater China Business Development Email: wang@yole.fr - +886 979 336 809 o FINANCIAL SERVICES • Jean-Christophe Eloy, CEO President Email: eloy@yole.fr - +33 4 72 83 01 80 o GENERAL • Public Relations: leroy@yole.fr - +33 4 72 83 01 89 • Email: info@yole.fr - +33 4 72 83 01 80 ©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample

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