Power Module Packaging: Material Market and Technology Trends 2017 - Report by Yole Developpement

From Technologies to Market
Power Module
Packaging: Material
Market and
Technology Trends
Sample
May 2017
CourtesyofSystemPlusConsulting

2
REPORT OBJECTIVES
• Provide power module packaging market analysis and forecasts
• Provide a deep insight into state-of-the-art package designs and materials
• Describe actual discrete devices packaging and innovations
• Identify the key technology trends that will shape the market in the future
• Understand the main challenges and proposed innovations
• Provide supply chain analysis and trends
©2017 | www.yole.fr | Power Module Packaging: Material Market and Technology Trends | Sample

3
REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology

4
REPORT METHODOLOGY
Technology analysis methodology Information collection

5
TABLE OF CONTENTS
Part 1/1
 Who should be interested in this report 5
 Objectives of the report 6
 What we missed… What we saw… 7
 What is in this report? 8
 Companies cited in the report 9
 List of abbreviations 10
 Executive summary 11
 Thermo-mechanical issues in power modules 32
 Overall power electronics market 39
 Power module market 46
 Global trends for power module packaging 53
 Power module packaging 69
o Composition of a conventional power module
o Power module materials and process choice
o Interconnections
o Die and substrate attach
o Encapsulation
o Substrate
o Baseplate
o Thermal interface materials (TIMs)
 Latest power modules - Case studies 162
 Raw material market for power packaging 175
o Yole’s methodology for market metrics
 Specific market analysis of each part of the module: 180
o Interconnections in power modules
o Die attach for power modules
o Substrate attach for power modules
o Encapsulation for power modules
o Substrates for power modules
o Baseplates for power modules
 Business model and supply chain analysis 215
 Discrete device packaging 233
 Trends in discrete device packaging 248
 General conclusion 260
 Yole Développement presentation 265

6
Biographies & Contacts
ABOUT THE AUTHORS
Mattin GraoTxapartegi
Mattin Grao Txapartegi is a Power Electronics Analyst at Yole Développement. He is engaged in many custom studies and reports dedicated to the
evolution of inverters architecture, passive components, and recently he has been in charge for the power packaging topics. Mattin is daily driving
technology and market scouting, roadmap definition, disruptive technologies and market opportunities identification and competitive landscape
analysis. Previously he acquired a comprehensive expertise in the design of power converters for electric vehicles at the car manufacturer Renault. He
graduated from Grenoble INP with an Engineering degree in Electrical Systems. He then earned an advanced master’s degree in Aeronautics
Engineering from Arts et Métiers ParisTech. During this time, he oversaw managerial, financial and marketing fields within the aeronautics industry.
grao@yole.fr
Dr. Milan Rosina
Dr. Milan Rosina is a Senior Analyst for Energy Conversion and Emerging Materials at Yole Développement. Before joining Yole, he worked as a
Research Scientist and a Project Manager in the fields of photovoltaics, microelectronics, and LED. Dr. Rosina has more than 15 years of scientific and
industrial experience with prominent research institutions, an equipment maker, and a utility company. His expertise includes new equipment and
process development, due diligence, technology, and market surveys in in the fields of power electronics, renewable energies, energy storage, batteries,
and innovative materials and devices.
rosina@yole.fr

8
OVERALL POWER ELECTRONICS MARKET
Market metrics, split by device type
In 2016, the
power device
market was
worth $xxB
and it will
grow steadily
for the next
five years.

9
POWER MODULE MARKET
Segmentation used in this report: discrete components and power modules
The two
main types of
packaging will
be studied in
this report:
discrete
components
and power
modules Semiconductor
Devices
Chips
(Dies)
One single device
in the package
Many devices in
the package
Discrete
components
Power
modules
• Two different
technologies are
used to assembly
devices for power
electronics:
- Discrete
components
- Power modules
• One or other
technology is
chosen according
to system needs, in
terms of:
- Power
- Voltage
- Current
- Geometry

10
THERMOMECHANICAL ISSUES IN POWER MODULES
Origins of thermally-induced stress and resulting failures
Origins of the thermally-induced stress Strain Failures
The strain as a response of
the system to an applied
stress depends on
• Properties of
materials used
(xxxxxxxxx,CTE
…)
• Device xxxx
(xxxxxxxxxxxxxx
xxxxxxxxxxxxxxx
xxxxxxxxxxx…) and other:
• Substrate fracture
• Loss of dielectric properties due to thermal
degradation of material
• …
T
Time
High temperature
T
Time
Long exposure to
elevated
temperature
T
Time
Rapid temperature
variation
T
Distance
Non-uniform
temperature distribution
High ∆T/∆L
t1 t2
L1
L2
High ∆T/∆t
*in operating condition or during device manufacturing (soldering…)
Solder delamination Wire bond lift off
Wire bond crackDie attach solder crack
Wire bond broken Solder fatigue
Crack in DBC
substrate copper layer
Cracks in substrate
attach solder
Baseplate
Solder
DBC

11
GLOBAL TRENDS FOR POWER MODULE PACKAGING
Roadmap of power module packaging design
In the future
power
modules will
have been
entirely
reshaped, with
the changes
depending on
the power
targeted
Bosch example
• Molded package
• Top leadframe interconnections
• Low inductance
xxxx example
• Six Pack IGBT/Diode Package
• Cooling fin
• Thick copper layer for thermal
spreading
• xxxxxxxxxxxx
Mid-power modules
Design evolution
Die on heatsink
• Die attach: film
sintering? Gold
sintering? Glue?
Xxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxx
2018
2020
2014
• Over-molded package
• Top leadframe
• Flexible interconnection foils
• Xxxxxxxxxxxxx
• xxxxxxxxxxxxx
• Double side cooling
• Ribbon bonding
• Silver (Ag) sintering for die
attach
• xxxxxxxxxxxxxxxx
Towards:

12
GLOBAL TRENDS FOR POWER MODULE PACKAGING
Interconnections
• For interconnections the main challenge is to increase the contact surface area in order to decrease losses. However, this can also
highlight some CTE issues.
• Today’s primary solution is aluminum wire bonding, which is a cheap, mature and easy-to-process technology
• Some players already position themselves in alternative solutions such as xxxxxxxxxxxx or xxxxxxxxxxx connections. Other
advanced technologies will be developed inspired by Semikron’s flexible interconnection foil SKiN technology.
• Xxxxxxxxxxxxxxx propose alternative technologies that needs still to prove their maturity/reliability, such as ball bonding.
• In the future we expect interconnections to play a major role in heat dissipation inside the module, with wider acceptance of dual
side cooling
Key challenges for
interconnection
development: using
larger contact
areas providing
better thermal and
electrical
performance and
possibly dual side
cooling
2016 2018 2025…
Xxxxxxxxx is similar to
wire bonding, but because
the surface is bigger, losses
are reduced
Copper is a better
material for
interconnection than
aluminum because it
supports a higher current
density
“xxxxxxxxxxxxxxx allows a
maximized contact surface
between dies and connection
AND dual side cooling
Xxxxxxxx is an original
solution that lengthens
lifetime AND allows dual
side cooling
2020
Flexible interconnections foils
brings xxxxxxxxxxxxxxxxxx
Xxxxxxxxxxxxxxxxxxxxxxx
Xxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx

13
ENCAPSULATION
Focus on silicone gel for high temperatures
Encapsulant
solutions
suited for
continuous
high
temperature
operation
are sought
for power
electronics.
• Increasing operating
temperatures for power
electronics modules and
progressive penetration of
SiC devices, allowing high
temperature operation,
raise demand on high-
temperature encapsulation
solutions.
• The thermally-driven
oxygen degradation
mechanisms deteriorate
silicone gel encapsulant
properties when exposed
to elevated temperature
for an extended period of
time.
 Silicone gel hardens and
cracks
• The encapsulant suppliers
have developed
encapsulant with improved
resistance to cracking and
void formation, suitable for
high operating
temperatures.
Increasing operating
temperature for
power modules
Higher current
density
Lower cooling
requirements
Packaging materials
(encapsulation…)
Enabler
Benefits
High-temperature encapsulation
sought!
150°C  175°C and higher
Silicon carbide
power devices
penetration
Gel Manufacturer
Dielectric strength
(kV/mm)
CTE
(ppm/°C)
Temperature
range
xxxxx xxxxx >23 N/A -50°C to +210°C
xxxxx xxxxx 22 N/A -40°C to +185°C
xxxxx Dow Corning 16 (21) 300 xxxxxxxx
xxxxx
NuSil Technology
(now part of Avantor)
17.7 320
-65°C to +240°C
Commercially available high-temperature silicone gel products
Yole Développement

14
SUBSTRATE
Future trends: ceramic substrates
• Even though new substrate alternatives are coming to the playground, still the Al2O3 ceramic substrate is the mainstream in the
industry.
• The other two ceramics substrates will gain market shares in the coming years, driven by higher power density needs, and thereby enhanced
thermal conductivity paths.The arrival of WBG devices will inevitably accelerate this trend.
• Xxxxx ceramic, more expensive than xxxx today, will see the greatest growth due to their use in power modules for the expanding xxxxxx
market.
• Its mechanical robustness and longer life-time will make xxxxx the second choice substrate in the coming years.
xxxx ceramic
will be the
technology
having the
greatest
expansion in
the coming
years.
Al2O3 DBC
Today
xxxxxx
Japan uses
widely xxxx
AMB for
xxxxxxxx
Industrial
applications
starts using
AlN for high
thermal
conductivity
AlN DBA/DBC
Europe
starts using
xxxx AMB
for
xxxxxxxxx
With higher power densities,
xxxx substrate market shares
will grow considerably, driven
by the EV/HEV growth
Xxxxxxxxxxxxx
Xxxxxxxxxxxxxx
Xxxxxxxxxxxxxx
characteristics, offered by AlN.
Meanwhile,Al2O3 DBC will
remain the mainstream, as a
mature and cheap technology.
Today,Al2O3 is the
mainstream with around
xx% of the market

15
THERMAL INTERFACE MATERIALS
Power modules with pre-appliedTIM
Some power
module
manufacturers
offers power
modules with
pre-applied
TIM layer
• The benefits of that approach are the following:
• Low thermal resistance
• Reduced process time in manufacturing
• xxxxxxxxxxxxxxx
• xxxxxxxxxxxxxxx
• xxxxxxxxxxxxx
• The thermally conductive paste is applied to the
modules using a stencil-printing or screen-
printing processes.
• A honeycomb-like structure prevents
xxxxxxxxxxxxx.
• The power modules with pre-applied TIM
should be stored in the blister boxes with a
protective lid.
+ TIM +
+
Power module with pre-applied TIM
The TIM layer and its thickness is already adjusted to a
given power module type  enabling lower TIM
thickness and thus better thermal management
Power module with pre-applied TIM layer
Infineon
Printed TIM layer
in form of a
“honeycomb”
structure, that
allows
xxxxxxxxxxxxx
Thermal paste application using screen printing
Vincotech
TIM layer is to be adjusted to both power module and heat sink
1.
2.
Conventional
approach
Pre-appliedTIM
Conventional approach and pre-applied TIM approach
Yole Développement
?
Image: Semikron

16
RAW MATERIAL MARKET FOR POWER PACKAGING
Raw materials market size in 2016
Power
module
packaging
represented a
$1.1B market
in 2016
• In a power module, the materials cost for the packaging represented about 37% of the power module cost in 2016. This share is
decreasing due to reduced material cost and numbers of interfaces.
• This share does not include chassis materials, such as plastic moldings, lead frames, busbars and various chassis sealants.

17
DIE ATTACH FOR POWER MODULES
Die attach market size evolution in Mcm³ between 2016 and 2021, split by application
The die
attach
material
demand will
be driven by
motor drives,
and
electrified
vehicles.

18
BUSINESS MODEL AND SUPPLY CHAIN ANALYSIS
Evolution of business models in the future
In the future
business
models will
be centered
on power
modules
Power module (PM) maker Inverter makerDevice maker
B
C
D
• In coming years we expect companies to center their activities on power module manufacturing,but including vertical integration,
whether integrating device manufacturing or inverter manufacturing
• xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx

19
DISCRETE DEVICE PACKAGING
How will discrete device packages evolve?
The key
objectives are
the same for
discrete devices
and for power
modules:
increase
efficiency and
power density
• Discrete component packaging evolution shares the same motivations as power modules:
• Miniaturization
• Power density increase
• Efficiency increase
• Yield increase
Time
Package
Size
2000 2010Before 2000 2020
~ mm
~ 10mm
~ 100mm
~ cm
xxxxxxxxxxxxxxxxxxxxxxxxxxx
Growing challenges
related to heat
dissipation  focus
on development of
excellent heat
dissipation products

20
RELATED REPORTS
Discover more related reports within our bundles here.

In 2016, the power module market was worth
almost $3.2B and from there it will grow steadily
for the next five years. As of 2016, almost
40% of the power module cost concerns raw
materials used for packaging. Materials for die-
attach, substrate-attach, substrate, baseplate,
encapsulation, interconnections and casings
constitute a $1.1B market in 2016. This market
will grow and reach $1.8B by 2021. Yet the growth
will not be even across all raw material markets.
Die-attach materials have the highest forecast
compound annual growth rate (CAGR) for 2016-
2021, at over 13%. Casings and encapsulation have
the lowest CAGR, at 5-7% for 2016-2021. The
main differences arise from technology choices
for those materials and their impact on the
each market segment. For instance, the greater
presence of epoxy resin will reduce the cost of
encapsulation in power modules.
Substrates and baseplates account for half of the
packaging raw material market, and together are
worth over $550M. Therefore, the choice of
technology in ceramic substrates or baseplates
can have a great impact on final power module
cost. Around 25% of the cost is related to die-
attach or substrate attach material. The rest
of the cost is divided between encapsulation,
interconnections and the casing.
Industrial applications remain the biggest part of
the power module market. However, the electric
and hybrid car market, with its double digit growth
forecast for the period 2016-2021, will represent
around 40% of this market by 2021. Moreover, the
automotive industry is leading in technological
innovations in packaging, helping and accelerating
the implementation of these new technologies
thanks to high manufacturing volumes.
POWER MODULE PACKAGING: MATERIAL MARKET
AND TECHNOLOGY TRENDS
Market & Technology report - May 2017
THE POWER MODULE PACKAGING MARKET WILL GROW AT 9.5% PER YEAR
FROM 2016-2021, REACHING ALMOST $1.8B
How new applications drive the choice of power module materials and designs.
KEY FEATURES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
• 2016-2021 market value for
the power electronics field and
especially for power modules
• Complete analysis of power
module packaging design
• Deep insight into each part of a
standard power module package:
substrate, baseplate, die attach,
substrate attach, encapsulation and
interconnections
• Detailed analysis of thermal
interface materials (TIMs)
• Presentation of case studies and
technological innovations
• 2016-2021 market metrics
and forecasts for each type of
packaging component covering
substrate, baseplate, die attach,
substrate attach, encapsulation and
interconnections
• Presentation of thermomechanical
issues in power modules
• Complete presentation of discrete
devices packaging
• Trends for discrete device
packaging
• Supply chain analysis and evolution
trends
WHAT’S NEW
• Focus on thermo-mechanical issues
in power modules
• Analysis of the newest power
module designs
• Insight into emerging business
models within the supply chain
• Focus on parylene encapsulation
solution
(Yole Développement, May 2017)
Material market size evolution for power module packaging
between 2016-2021 (M$)
Split by component: substrate, baseplate, die attach, substrate attach, encapsulation, interconnections and casing
STRONG RESHAPING OF THE SUPPLY CHAIN EXPECTED
According to Yole Développement’s analysis, the
power module market is becoming extremely
competitive with several new players arriving from
different directions. In recent years, we have also
seen consolidation among power semiconductor
market leaders with several acquisitions, such
as Infineon Technologies buying International
Rectifier and ON Semiconductor buying Fairchild
Semiconductor. These moves were intended
to strengthen positions in the overall power
semiconductor business. Nevertheless, in
coming years the market leaders will face
strong competition from Tier-1 automotive
manufacturers such as Denso or Bosch and new
entrants from China such as Starpower and CRRC.
Outsourced Semiconductor Assembly and Test
companies (OSATs) could also propose services
to provide advanced packaging technologies to
-
200
400
600
800
1 000
1 200
1 400
1 600
1 800
2016 2017 2018 2019 2020 2021
Marketvalue(M$)

POWER MODULE PACKAGING: MATERIAL MARKET AND TECHNOLOGY TRENDS
Power packaging supply chain reshaping
HOW NEW POWER MODULE DESIGN TECHNOLOGY CHOICES IMPACT
THE BUSINESS ECOSYSTEM’S EVOLUTION
Impact of power module design on the choice of packaging materials:
example of a double-side cooling design
In recent years, several new power module designs have
emerged, principally driven by the severely challenging
requirements for high power density and integration
fromtheautomotiveindustry.Indeed,electricandhybrid
cars are the best example of technology innovation in
the design of power modules. The Toyota Prius’ fourth
generation double-sided cooling power modules might
be the most well-known example. Yet today many other
module manufacturers are also proposing new designs
that move away from conventional power module layers
and technologies. In this report, Yole Développement
shows the latest power module designs with their cross
sections, explanations about materials used, etc.
The innovations in power module design will not be
made without impacting the materials and processes
used in power module packaging. The role of the
ceramic substrate and baseplate is being rethought, as
in order to achieve smaller and better integrated power
modules. A trend towards layer suppression has clearly
been adopted in those industries where size, weight and
integration is a must. Again, principally in the automotive
industry, direct cooled baseplates using pin-fins have
become common. They avoid the use of Thermal
Interface Materials (TIMs) that are responsible for a
considerable part of the thermal resistance and form
voids over time, deteriorating the thermal conductivity
and reliability even more. IGBT dies directly soldered
to leadframes have also appeared, enabling a highly
conductive substrate, but still requiring some sort of
electrically insulating layer. Power modules designed for
double-sided cooling will use epoxy resin encapsulation
and wire-bond-free interconnections. On the substrate
side, both ceramic and leadframe options could be used.
Yole Développement has also analyzed the other
industries where the classical power module design
will persist. However, even in those cases very
interesting advanced material technologies will come
to enhance their reliability, robustness and thermal/
electrical efficiency. Silver sintering is obviously one
of the big stars, as a growing number of players are
being seduced by this technology as a replacement
for soldering in die attach. The report highlights
the advantages of sintering, but also the remaining
manufacturing barriers that it must overcome to
be widely adopted by the industry. The differences
between Al2O3, AlN and Si3N4 ceramics and the
expansion of the highly thermally conductive AlN and
Si3N4 over coming years will be explained. AlN will
continue its growth in industrial and renewable energy
markets, while a strong push for Si3N4 could come
from the automotive industry.
The arrival of wide-band gap devices using SiC and GaN
semiconductor materials calls for specially-adapted
packaging solutions. Encapsulation technologies must
power module manufacturers. This will define a new
business model that diverges from the traditional
power module supplier business. Thereby, all
companies involved in the power module market will
need to adapt or rethink their offerings and especially
secure their technological advances via continuous
innovations.
$5.2B in 2021
OSATs
…
*OSAT: Outsourced Semiconductor Assembly andTest
$3.2B in 2016
Power module market
New players are coming...
Interconnections
Wire-bonds
Wire-bond-free
Encapsulation
Epoxy
Silicone gel
Substrate
Ceramics
Lead frame
Other
Baseplate
+ Top-die attach
+ Spacers
Double-side power
module cooling design
Impact of power module design on the choice of packaging
materials: example of a double-side cooling design

Find more
details about
this report here:
MARKET TECHNOLOGY REPORT

Who should be interested in this report 5
Objectives of the report 6
What we missed… What we saw… 7
What is in this report? 8
Companies cited in the report 9
List of abbreviations 10
Executive summary 11
Thermo-mechanical issues in power modules 32
Overall power electronics market 39
Power module market 46
Global trends for power module packaging 53
Power module packaging 69
Composition of a conventional power module
Power module materials and process choice
Interconnections
Die and substrate attach
Encapsulation
Substrate
Baseplate
Thermal interface materials (TIMs)
Latest power modules - Case studies 162
Raw material market for power packaging 175
Yole’s methodology for market metrics
Specific market analysis of each part
of the module 180
Interconnections in power modules
Die attach for power modules
Substrate attach for power modules
Encapsulation for power modules
Substrates for power modules
Baseplates for power modules
Business model and supply chain analysis 215
Discrete device packaging 233
Trends in discrete device packaging 248
General conclusion 260
Yole Développement presentation 265
TABLE OF CONTENTS (complete content on i-Micronews.com)
COMPANIES CITED IN THE REPORT (non exhaustive list)
ABB, ACC, Alpha, AM2T, Amkor, AOS, APE, aPSI3D, Avator, ATS, BlueStar, Silicones Bosch, BYD,
CeramTec, Comelec, Continental, CPS Technologis, Danfoss, Delphi, Denso, Dow Corning, Dowa,
Dupont, Dynex, Electrolube, Fuji Electric, GaN Systems, GE, General Electric, Hala, Henkel, Heraeus,
Hitachi, Hitachi Chemical, Honda, Indium Corporation, Infineon, Intel, International Rectifier, KCC,
Kisco Conformal Coating, Kyocera, LS, Mersen, Mitsubishi Electric, Mitsubishi Materials, Momentive,
Müller-Ahlhorn, Nusil Technology, Plansee, Powerex, Powerstax, Ravelin Materials, RHP Technology,
RUISIL, Schneider Electric, Semikron, ShinEtsu, Specialty Coating Systems (SCS), Shanghai Hua Hong
NEC, Shin Etsu, Siemens, Starpower, STATS ChipPAC, STMicroelectronics, Texas Instruments,
Toshiba, Toyota, TSMC, Valeo, Vincotech, Wacker
• Power Electronics for EV/HEV 2016: Market,
Innovations and Trends
• Inverter Technology Trends and Market
Expectations
• Gate Driver Market and Technology
Trends 2017
• Toyota Prius 4 PCU Power Modules
• Infineon CooliR²Die™ Power Module
Find all our reports on www.i-micronews.com
RELATED REPORTS
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AUTHORS
Mattin Grao Txapartegi is a Power
Electronics Analyst at Yole Développement.
He is engaged in many custom studies and
reports dedicated to the evolution of
inverters architecture, passive components,
and recently he has been in charge for
the power packaging topics. Mattin is daily
driving technology and market scouting,
roadmap definition, disruptive technologies
and market opportunities identification and
competitive landscape analysis. Previously
he acquired a comprehensive expertise in
the design of power converters for electric
vehicles at the car manufacturer Renault.
He graduated from Grenoble INP with an
Engineering degree in Electrical Systems. He
then earned an advanced master’s degree
in Aeronautics Engineering from Arts et
Métiers ParisTech. During this time, he
oversaw managerial, financial and marketing
fields within the aeronautics industry.
Dr. Milan Rosina is a Senior Analyst
for Energy Conversion and Emerging
Materials at Yole Développement. Before
joining Yole, he worked as a Research
Scientist and a Project Manager in the
fields of photovoltaics, microelectronics,
and LED. Dr. Rosina has more than 15
years of scientific and industrial experience
with prominent research institutions, an
equipment maker, and a utility company.
His expertise includes new equipment
and process development, due diligence,
technology, and market surveys in in the
fields of power electronics, renewable
energies, energy storage, batteries, and
innovative materials and devices.
evolve to handle high operating temperatures.
Standard silicone gel and epoxy are limited in
terms of temperature, and new materials such
as parylene are being developed, although still
struggling with high costs. Low-inductance
interconnections, and die attach compatible with
high operating temperatures are also needed.
All these technology trends are creating opportunities
for some material suppliers, but at the same time,
they are threatening some of today’s businesses
for power packaging. The most obvious case
is the risk for TIM suppliers that direct cooled
baseplates could result in no need for TIMs. Also,
the largely used aluminum wire bonding solution
can be supplanted by top leadframe connections,
flexible interconnection foils or copper and gold
wire bonding. Meanwhile, double sided cooling
technology will open a second market for top die-
attach connection for solder and sintering solution
suppliers. Thereby, it is crucial to understand the
synergies and impacts of the technology choices
on the other materials or technology solutions.
Yole Développement’s report summarizes these
synergies with illustrative visual figures.
REPORT OBJECTIVES
• Provide power module packaging market analysis and forecasts
• Provide a deep insight into state-of-the-art package designs and materials
• Describe actual discrete devices packaging and innovations
• Identify the key technology trends that will shape the market in the future
• Understand the main challenges and proposed innovations
• Provide supply chain analysis and trends

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*One user license means only one person at the company can use the report.
Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate
finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include
more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Displays, Image Sensors, Optoelectronics, Microfluidics Medical,
Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries Energy Management.
The “More than Moore” company Yole and its partners System Plus Consulting, Blumorpho, KnowMade and PISEO support industrial companies, investors and
RD organizations worldwide to help them understand markets and follow technology trends to develop their business.
MEDIA EVENTS
• i-Micronews.com, online disruptive technologies website
• @Micronews, weekly e-newsletter
• Communication webcasts services
• Events: Yole Seminars, Market Briefings…
More information on www.i-micronews.com
CONTACTS
For more information about :
• Consulting Services: Jean-Christophe Eloy (eloy@yole.fr)
• Financial Services: Jean-Christophe Eloy (eloy@yole.fr)
• Report Business: Fayçal Khamassi (khamassi@yole.fr)
• Press relations: Sandrine Leroy (leroy@yole.fr)
CONSULTING
• Market data research, marketing analysis
• Technology analysis
• Reverse engineering costing services
• Strategy consulting
• Patent analysis
More information on www.yole.fr
REPORTS
• Collection of technology market reports
• Manufacturing cost simulation tools
• Component reverse engineering costing
analysis
• Patent investigation
More information on www.i-micronews.com/reports
FINANCIAL SERVICES
• Mergers Acquisitions
• Due diligence
• Fundraising
More information on Jean-Christophe Eloy
(eloy@yole.fr)

© 2017
From Technologies to Market
Yole Développement
FromTechnologies to Market

22
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
MEMS Sensors
Compound
Semi.
Imaging
Photonics
MedTech
Manufacturing
Advanced
Packaging
Batteries / Energy Management
Power Electronics
Displays
RF
Devices
Techno.
Advanced
Substrates
Solid State
Lighting
(LED, OLED, …)

23
4 BUSINESS MODELS
o Consulting and Analysis
• Market data research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
www.yole.fr
o Reports
• Market technology reports
• Patent Investigation and patent infringement risk analysis
• Teardowns reverse costing analysis
• Cost simulation tool
www.i-Micronews.com/reports
o Financial services
• MA (buying and selling)
• Due diligence
• Fundraising
• Maturation of companies
• IP portfolio management optimization
www.yolefinance.com
www.bmorpho.com
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication webcast services
• Events
www.i-Micronews.com

24
A GROUP OF COMPANIES
Market, technology
and strategy
consulting
www.yole.fr
MA operations
Due diligences
www.yolefinance.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Test Measurement
Expertise
Research Innovation
www.piseo.fr

25
OUR GLOBAL ACTIVITY
30%of our business
40%of our business
30%of our business
Yole Inc.
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Phoenix
Yole Korea
Seoul

26
RESEARCH PRODUCTS - CONTENT COMPARISON
Custom analysis scope is defined with
you to meet your information and
budget needs
Breadth of the analysis
Depthoftheanalysis
Custom
Analysis
Workshops
Standard Reports

27
SERVING THE ENTIRE SUPPLY CHAIN
Our analysts
provide market
analysis,
technology
evaluation, and
business plan
along the
entire supply
chain
Integrators and
end-users
Device
makers
Suppliers: material,
equipment, OSAT,
foundries…
Financial investors,
RD centers

28
SERVING MULTIPLE INDUSTRIAL FIELDS
We are
working
accross
multiples
industries to
understand the
impact of
More-than-
Moore
technologies
from device to
system
From A to Z…
Transportation
makers
Mobile phone
and consumer
electronics
Automotive
Medical
systems
Industrial and
defense
Energy

29
REPORTS COLLECTION
o Yole Développement publishes a comprehensive collection of market technology reports and patent analysis in:
• MEMS Sensors
• RF devices technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Power electronics
• Batteries and Energy management
• Compound semiconductors
• LED
• Displays
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain
The combined team of 50+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identify
the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape.
In the past 18 years, we worked on more than 1 500 projects, interacting with technology professional and high level opinion makers from the main players of the
industry.
o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers.
www.i-Micronews.com

30
OUR 2017 REPORTS PLANNING (1/2)
MARKET ANDTECHNOLOGY REPORTS byYole Développement
o MEMS SENSORS
− Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017
− MEMS Microphones, Speakers and Audio Solutions 2017
− Status of the MEMS Industry 2017
− MEMS Sensors for Automotive 2017
− High End Inertial Sensors for Defense and Industrial Applications 2017
− Sensor Modules for Smart Building 2017
− Sensing and Display for AR/VR/MR 2017 (Vol 1)
− MEMS Packaging 2017
− Magnetic Sensors Market and Technologies 2017**
− Microspectrometers Markets and Applications 2017**
o RF DEVICES AND TECHNOLOGIES
− RF Components and Modules for Cellphones 2017
− Advanced RF SiP for Cellphones 2017
− 5G and Beyond (Vol 1): Impact on RF Industry, from Infrastructure to Terminals
2017
− 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals
2017
− RF Technologies for Automotive Applications 2017
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
o IMAGING OPTOELECTRONICS
− 3D Imaging Sensing 2017
− Status of the CMOS Image Sensor Industry 2017
− Camera Module for Consumer and Automotive Applications 2017
− Uncooled Infrared Imaging Technology Market Trends 2017
− Active Imaging and Lidars 2017 (vol 1)
o MEDTECH
− Status of the Microfluidics Industry 2017
− Solid State Medical Imaging 2017
− Sensors for HomeCare 2017
− Sensors for Medical Robotics 2017
− Organs-on-a Chip 2017
o ADVANCED PACKAGING
− Advanced Substrates Overview 2017
− Status of the Advanced Packaging Industry 2017
− Fan Out Packaging: Market Technology Trends 2017
− 3D Business Update: Market Technology Trends 2017
− Advanced QFN: Market Technology Trends 2017**
− Inspection and Metrology for Advanced Packaging Platform 2017**
− Advanced Packaging for Memories 2017
− Embedded Die Packaging: Technologies and Markets Trends 2017
o MANUFACTURING
− Glass Substrate Manufacturing 2017
− Equipment Materials for Fan Out Technology 2017
− Equipment Materials for 3D T(X)V Technology 2017
− Emerging Non Volatile Memories 2017
** To be confirmed

31
OUR 2017 REPORTS PLANNING (2/2)
o POWER ELECTRONICS
− Status of Power Electronics Industry 2017
− Power Mosfets Market and Technology Trends 2017
− IGBT Market and Technology Trends 2017
− Power Packaging Market and Technology Trends 2017
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications
− Materials Market Opportunities for Cellphone Thermal Management (Battery
Cooling, Fast Charging, Data Processing, Battery Cooling, etc.) 2017
− Gate Driver Market and Technology Trends in Power Electronics 2017
− Power Management ICs Market Quarterly Update 2017
− Power Electronics for Electrical Aircraft, Rail and Buses 2017
− Thermal Management for LED and Power 2017
o BATTERY AND ENERGY MANAGEMENT
− Status of Battery Industry for Stationary, Automotive and Consumer Applications
2017
o COMPOUND SEMICONDUCTORS
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
− Bulk GaN Technology Status and Market Expectations (Power, LED, Lasers) 2017
o DISPLAYS
− Microdisplays and MicroLEDs 2017
− Display for Augmented Reality, Virtual Reality and Mixed Reality 2017
− QD for Display Applications 2017
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
− Emerging Display Technologies 2017**
o LED
− UV LEDs 2017 - Technology, Manufacturing and Application Trends
− Agricultural Lighting 2017 - Technology, Industry and Market Trends
− Automotive Lighting 2017 - Technology, Industry and Market Trends
− Active Imaging and Lidar 2017 (Vol 2) - IR Lighting**
− LED Lighting Module 2017 - Technology, Industry and Market Trends
− IR LEDs 2017 - Technology, Manufacturing and Application Trends
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
− CSP LED Module 2017
− LED Packaging 2017
PATENT ANALYSIS by Knowmade
− 3D Monolithic Memory: Patent Landscape Analysis
− Microfluidic Diagnostic: Patent Landscape Analysis
− GaN Technology: Top-100 IP profiles**
− Uncooled Infrared Imaging: Patent Landscape Analysis**
− MEMS Microphone: Patent Landscape Analysis**
− MEMS Microphone: Knowles' Patent Portfolio Analysis**
− MicroLEDs: Patent Landscape Analysis**
− Microbolometer: Patents used in products**
− Micropumps: Patent Landscape Analysis**
− Flexible batteries: Patent Landscape Analysis**
TEARDOWN REVERSE COSTING by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools to be
published in 2017.
** To be confirmed

32
OUR 2016 PUBLISHED REPORTS LIST (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS SENSORS
− Gas Sensors Technology and Market 2016
− Status of the MEMs Industry 2016
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads 2016
− Sensors for Biometry and Recognition 2016
− Silicon Photonics 2016
o IMAGING OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016
− Uncooled Infrared Imaging Technology Market Trends 2016
− Imaging Technologies for Automotive 2016
− Sensors for Drones Robots: Market Opportunities and Technology Evolution 2016
o MEDTECH
− BioMEMS 2016
− Point of Care Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− Embedded Die Packaging: Technology and Market Trends 2017
− 2.5D 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016
− Fan-Out: Technologies and Market Trends 2016
− Fan-In Packaging: Business update 2016
− Status and Prospects for the Advanced Packaging Industry in China 2016
o MANUFACTURING
− Thin Wafer Processing and Dicing Equipment Market 2016
− Emerging Non Volatile Memories 2016
o COMPOUND SEMICONDUCTORS
− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
− Sapphire Applications Market 2016: from LED to Consumer Electronics
− Power SiC 2016: Materials, Devices, Modules, and Applications
o LED
− UV LED Technology, Manufacturing and Applications Trends 2016
− OLED for Lighting 2016 – Technology, Industry and Market Trends
− Automotive Lighting: Technology, Industry and Market Trends 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Sapphire Applications Market 2016: from LED to Consumer Electronics
− LED Packaging 2017: Market, Technology and Industry Landscape
o POWER ELECTRONICS
− Power Electronics for EV/HEV 2016: Market, Innovations and Trends
− Status of Power Electronics Industry 2016
− Passive Components Technologies and Market Trends for Power Electronics 2016
− Power SiC 2016: Materials, Devices, Modules, and Applications
− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends
− Inverter Technologies Trends Market Expectations 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
o BATTERY AND ENERGY MANAGEMENT
− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016
− Stationary Storage and Automotive Li-ion Battery Packs 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016

33
OUR 2016 PUBLISHED REPORTS LIST (2/2)
PATENT ANALYSIS by Knowmade
− Microbattery Patent Landscape Analysis
− Miniaturized Gas Sensors Patent Landscape Analysis
− 3D Cell Culture Technologies Patent Landscape
− Phosphors and QDs for LED Applications Patent Landscape 2016 report
− TSV Stacked Memory Patent Landscape
− Fan-Out Wafer Level Packaging Patent Landscape Analysis
TEARDOWN REVERSE COSTING by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools to be
published in 2017.
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website
www.i-Micronews.com.
o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the
number of reports you are interested in and select the related offer.You then have up to 12
months to select the required reports from theYole Développement, System Plus Consulting
and KnowMade offering. Pay once and receive the reports automatically (multi-user format).
Contact your sales team according to your location (see the last slide).

34
MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person. Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience.Webcasts
create very useful, dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
Benefit from the i-Micronews.com
traffic generated by the 8,500+
monthly visitors, the 11,500+
weekly readers of @Micronews
e-newsletter
Seven main events planned for
2017 on different topics to
attract 140 attendees on average
Gain new leads for your business
from an average of 300
registrants per webcast
Contacts: CamilleVeyrier (veyrier@yole.fr) and Clotilde Fabre (fabre@yole.fr), Marketing Communication Project Managers.

35
CONTACT INFORMATION
Follow us on
o CONSULTING AND SPECIFIC ANALYSIS
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr – +1 31 06 008 267
• Japan Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development
Email: onozawa@yole.fr - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business Development
Email: wang@yole.fr - +886 979 336 809
• RoW: Jean-Christophe Eloy, CEO President, Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o REPORT BUSINESS
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr – +1 31 06 008 267
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development
Email: onozawa@yole.fr - +81 3 4405 9204
• Japan Asia: Miho Othake, Account Manager
Email: ohtake@yole.fr - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business Development
Email: wang@yole.fr - +886 979 336 809
o FINANCIAL SERVICES
• Jean-Christophe Eloy, CEO President
Email: eloy@yole.fr - +33 4 72 83 01 80
o GENERAL
• Public Relations: leroy@yole.fr - +33 4 72 83 01 89
• Email: info@yole.fr - +33 4 72 83 01 80

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