Status of the Power Electronics Industry 2018 report by Yole Développement

From Technologies to Market
Status of the Power
Electronics Industry
2018
Sample
August 2018

2
Biography & contact
Dr. AnaVillamor,Technology & Market Analyst, Power Electronics & Compound Semiconductors
Dr. Milan Rosina, SeniorTechnology & Market Analyst, Power Electronics & Batteries
Dr. Milan Rosina is Senior Analyst, Power Electronics & Batteries, at Yole Développement (Yole), within the Power & Wireless division. Milan has 20 years of
scientific, industrial and managerial experience involving equipment and process development, due diligence, technology, and market surveys in the fields of
renewable energies, EV/HEV, energy storage, batteries, power electronics, thermal management, and innovative materials and devices. He received his Ph.D. degree
from National Polytechnical Institute (Grenoble, France). He previously worked for the Institute of Electrical Engineering in Slovakia, Centrotherm in Germany,
Fraunhofer IWS in Germany, CEA LETI in France, and utility company ENGIE in France.
Contact: rosina@yole.fr
Dr. Ana Villamor serves as a Technology & Market Analyst, Power Electronics & Compound Semiconductors within the Power & Wireless division at Yole
Développement (Yole). She is involved in many custom studies and reports focused on emerging power electronics technologies at Yole Développement, including
device technology and reliability analysis (MOSFET, IGBT, HEMT, etc). In addition, Ana is leading the quarterly power management market updates released in
2017. Previously Ana was involved in a high-added value collaboration related to SJ Power MOSFETs, within the CNM research center for the leading power
electronic company ON Semiconductor. During this partnership and after two years as Silicon Development Engineer, she acquired a relevant technical expertise
and a deep knowledge of the power electronic industry. Ana is author and co-author of several papers as well as a patent. She holds an Electronics Engineering
degree completed by a Master in micro and nano electronics, both from Universitat Autonoma de Barcelona (SP).
Contact: villamor@yole.fr
Alejandra Fuentes Suarez,Technology & Market Analyst, Power Electronics
Alejandra Fuentes Suarez is a Technology & Market Analyst, Power Electronics, within the Power and Wireless Team at Yole Développement (Yole). She is
involved in the development of custom studies and reports covering the power electronics industry: Alejandra daily researches the latest developments in power
converter topologies, passive components, power modules packaging and EV/HEV. Previously Alejandra acquired extensive expertise in the design of power
converters for solar, wind, hydro and motor drive applications at Semikron (France). Alejandra graduated from UJF (Grenoble, FR) and INP (Grenoble, FR) as an
electrical engineer, specializing in design of power electronics system. She also holds an advanced master’s in the field of Marketing and Management of Energy from
the Grenoble Business School (Grenoble, FR).
Contact: fuentes@yole.fr
Status of the Power Electronics Industry 2018 | Sample | www.yole.fr | ©2018

3
ABB,Alpha and Omega Semiconductor (AOS),Amkor,Analog Devices,ASE Group,AT&S,AVX,
BMW Group, Bosch, BYD, Continental, Cree, CRRC, Danfoss, Delphi, Denso, Dialog Semiconductor,
Diodes Incorporated, DuPont Teijin Films, Dynex, EXAGAN, Fuji Electric, GaN Systems,
General Electric, GeneSiC, Global Wafers, Goldwind, Hitachi, Huawei, Infineon, Intel, Intersil,
Littelfuse, Macmic, Microchip, Microsemi, Mitsubishi Electric, Navitas, Nissan, NXP, Okmetic, ON
Semiconductor, Panasonic, Qualcomm, Renault, Renesas, Rohm, Sanken, Semikron, Shindengen,
Siemens, Silego Technology, ST Microelectronics, StarPower, STATSChipPAC, Sungrow,TDK,Tesla
Motors,Topsil,Toray,Toshiba,Toyota,Transphorm,TSMC, USCi,Vincotech,Vishay,Volkswagen,
Wolfspeed, and more.
COMPANIES CITED IN THE REPORT

4
REPORT OBJECTIVES
• Assess the market for wafers, devices, modules and inverters
• Understand the market dynamics for the whole power electronics industry
• Identify the key drivers that will shape the market in the future
• To have an overview on the different components used in power electronics and its integration
• Understand the main technological challenges to overcome and the solutions developed so far
• Provide a clear overview of the different applications driving the power electronics business
• Present data ranking the power electronics industry leaders, describing supply chain consolidation,
the latest M&A activity and future trends in the power player landscape

5
TABLE OF CONTENTS
• What is new vs what is updated? 9
• Executive summary 11
• Introduction
• Main applications of power electronics
• Power vs frequency on electronics
• Packaging type by power inverter
• From silicon to application
• Substrate
• Semiconductor
• Discrete vs Power Module
• What is an inverter?
• Why innovation is so important
46
• Power electronics market
• Overall power electronics market
• Power wafer market
• Wafer size trends
• 200 or 300 mm for power electronics?
• Enlarging wafer capacity?
• Wafer units evolution
• Wafer market by technology
61
• Power device market
• Global Power Electronics market
• 2017-2023 By type of device
• Market shares per device
• Market share by voltage in 2017
• Main discrete Devices for Power Electronics
• Power MOSFET market metrics & forecasts
• Key Power MOSFET markets
• Different market segment size and evolution
comparison
• Estimate of global power MOSFET market size 2017-
2023
• Comparison between 2017 and 2023 by application
• Estimation of total power MOSFET market including
module
• Estimation of total power MOSFET market without
module, voltage split
• IGBT market metrics & forecasts
• Key Power IGBT markets
• IGBT market forecast by application from 2017
through 2023 in revenues
• IGBT technology status
• Split of IGBT packaged as discrete vs. modules
• Focus on IGBT module market and forecasts till 2023
• Why IGBT for rail applications decreases?

6
TABLE OF CONTENTS
• Power ICs market
• Power ICs annual revenue forecast by end market
• Power IC Market by component
• Power module market
• Power module market forecast 2017-2023
• Comparison of module market shares by device type
• Inverter market
• Inverter market evolution between 2017 and 2023
• How will different power ranges evolve?
• Inverter market evolution by application
• Power electronics drivers and evolution
• Market growth context for the main power applications
• What device performance and what aspects need to be
improved?
• Material, semiconductor and power converter engineers
are working to find solutions
114
• Driving applications
• MOSFET/IGBT required voltage per application
• Voltage summary by device and application
• Main applications driving power active components
122
• General trends
• EV/HEV
• Wind
• Rail
• UPS
• Motor drive
• PV
• Consumer
• Audio/Image
• White goods
• Medical
• Computing & Storage
• Energy storage systems
• DC charging
126
• Focus on EV/HEV
• Different types of electrified vehicles
• EV/HEV market evolution
• Which is the cost of the power components in a car?
• TOP 5 ranking Companies
• Sales in units split by electric car type
• EV/HEV converter market
• Geographical split of PHEV & BEV
• Geographical split of 48V systems
• EV/HEV Technology TRENDS
• How power converters are evolving
• Where can SiC & GaN be implemented?
• What is the advantage of SiC in each converter?
138

7
TABLE OF CONTENTS
• Technology analysis
• Thermal management challenges
• How to deal with heat in power electronic devices
• Evolution of junction temperature inside power
modules
• Thermal management challenges
• Sought-after power electronics cooling system
features
153
• Toward more integration in power
converters
• Synergies and optimization of the power converter
components
• What technology developments will lead to high
power density?
• Higher integration new challenges
162
• Power stack
• What is a power stack?
• Power stack characteristics
• How to assemble?
• Technology trends
• Power Stack market
• Market split by application in 2017 and 2023
• Business models
• Market shares
168
• Passive components
• Power capacitors
• Power capacitor types
• Power Capacitor – focus on cooling
• Power capacitors – specific capacitors needed for
EV/HEV applications
• Key technology evolutions and roadmap
• Supply chain
• Power capacitor supply chain integration trends
181
• Inductors
• Main functionalities of magnetic components in
power electronics environments
• Classification of the main magnetic materials used in
power electronics
• What is the industry looking for?
• Roadmap inductors
• Main magnetics manufacturers, by region
196
• Busbars
• Connections classification
• Connection types
• Case studies
• Future technology trends
• Busbar roadmap
• Manufacturers by region
205

8
TABLE OF CONTENTS
• Wide band gap devices
• Wide band gap material
• Forecast through to 2023
• Market share by voltage in 2017
239
• SiC
• SiC Power Device market revenue
• Market Share Evolution for different applications
• Different SiC Devices
• Which are the main areas of Development for SiC?
• SiC Reliability analysis
245
• GaN-on-Si
• GaN Power Device market revenue
• Market Share Evolution for different applications
• Which are the main areas of Development for GaN?
• GaN power Discrete devices
• Technical challenges
• Commercial GaN Power Devices
254
• Other WBG materials for power
• Figure-of-merit
• GaN-on-GaN
• Gallium Oxide
• AlN
• Diamond
264
• Battery and power electronics
• Many battery application, one key driver
• Where are the opportunities for power electronics players?
• Trends
271
• Power electronics for harsh environment
• Solutions at different levels
• Why is interest in solutions for harsh environment
growing?
• How to choose the best solution for harsh environment?
• Harsh environment challenges in different applications
• The origin of failures in power modules
• Main technology trends for harsh environment
279
• Power electronics landscape
• Key players and power electronics landscape
• Revenues in 2017
• Geographical positions of main power semiconductor
companies
• Who is involved in each device?
• Power MOSFET market shares
• Module IGBT market shares
• Discrete IGBT market shares
297

9
TABLE OF CONTENTS
• Power electronics companies financial
analysis
• Littelfuse
• Infineon
• Texas Instruments
• ON Semiconductors
• ABB
• Vishay
• Renesas
• NXP
• ST Microelectronics
305
• Mergers & Acquisitions
• Power electronics landscape evolution and consolidation
• Power electronics partnerships
• Different M&A
• Focus on China
334
• Conclusions 360

10
POWERVS FREQUENCY ON ELECTRONICS
Power device technology positioning (2018)
Operating frequency (Hz)

11
GLOBAL POWER ELECTRONICS MARKETS
2017-2023
Power device markets &
forecast 2016-2022
IGBT
MOSFET
Power IC
Silicon wafers
GaN & SiC devices
Inverter
Etc.

12
COMPARISON OF MODULE MARKET SHARES
By device type, 2017 vs 2023
XX Modules
will gain a
XX% of the
total module
market by
2023

13
DRIVING POWER ELECTRONICS
Power electronics is driven by application penetration and it
is boosted by megatrends and subventions. Some applications
also need from new segments:
• EV/HEV needs the development of Charging stations or
LiDAR solutions for the autonomous car
• PV or Wind need the Stationary Energy Storage for
efficient systems

14
PACKAGING TYPE BY POWER INVERTER
Power
modules,
discretes or
embedded ?
Inverter
power
Functionality
integration
More
Less
IPM
Small device, small power.
All-in-one: IGBT, diodes, drivers
and control.
Discrete packaging
Small device, medium power.
All in one: MOSFET, IGBT, or co-pack
IGBT and diode.
6-in-1 power module
Large device, medium power.
Six IGBTs and diodes.
IGBT driver is external.
Single power
module
Large device, large power.
One IGBT and diode.
Several chips to handle the
current.
IGBT driver is external.
MW range100s kW range10s kW rangeWatt to kW range
IPM: Intelligent Power Module
Embedded Package
Small device.
Small heat dissipation
Semiconductor embedded in
PCB.
Power IC
2-in-1 & 1-in-1
power modules
Medium power.
2 or 1 IGBT packaged
together with the diode.
Trend in EV/HEV
New packaging trends

15
GLOBAL POWER ELECTRONICS MARKETS
2017-2023
Power device markets & forecast 2016-2022
Discrete and
module
market

16
SIC & GAN MARKETS

17
OTHER SEMICONDUCTOR MATERIALS FOR POWER
Today and tomorrow
applications for SiC and
GaN devices, among
other compound
materials

18
INCREASING BATTERY PACK ENERGY CAPACITY PER ELECTRICVEHICLE
Driving range as a function of battery energy capacity
• Driving range
(mileage)
increases as
battery size
grows and
efficiency
improves.
• There is a clear
trend towards
larger battery
energy capacity,
driven by
decreasing
battery price and
increasing
customer
demands for
longer driving
range.
Driving range (NEDC) as a function of battery energy capacity
Nissan LEAF
Renault Twizy
Toyota RAV4EV
Tesla Model S
BYD E6
Car-sharing
and small
city cars
Big and
luxury BEV
NEDC: New European Driving Cycle
More power needed to charge
larger capacity batteries
 more Amps

19
HIGHER INTEGRATION NEW CHALLENGES
Integration also means closer to the semiconductors hotspots
• When we talk about higher integration at converter level, it also means higher power density at power semiconductor
and converter level. In consequence, higher power values flow through a smaller area/volume, increasing the temperature.
• This means that the components that are closer to the heat-source of the power module needs to support higher
temperatures as well.
• Laminated busbars, cooling systems, gate driver boards and DC-link capacitors are the components that are close to the power module.
• Among all those parts, the film capacitors are still today the main barrier to get to high temperatures.
Higher integration
Higher power
density
Higher
temperature

20
TECHNOLOGY

21
HOW TO ASSEMBLE: DIRECT INVERTER OR WITH POWER STACK?
For power
higher than
100kW, two
approaches
exist: direct
inverter
assemblies and
assemblies using
power stacks.
1kW
100kW
0
Power
10kW
1MW
2kW
20kW
200kW
Power
Stack
Assembly
Inverter
Normally, a power stack is not used for power lower than 100 kW
Direct Inverter Assembly
InverterDirect Inverter Assembly

22
HARSH ENVIRONMENT – CAN BE ALSO FOUND ELSEWHERE
Harsh
environment
conditions can
be found also
in more
conventional
applications
Thermal cycling Vibrations Radiation
Aggressive chemical
environment
Humid
environment
Dust G factor
Car gas exhaust
in HEV
EV/HEV in the
winter storm
Car brake disc High mountain electric train
PV inverters in a pig farm with PV
panels on the roof
Applications in regions with
high humidity
Electric motors covered by flour
dust
Rapidly accelerating (braking)
electric car
Ammonia
Extremely low/high
temperature
Car gas exhaust
in HEV
Car brake disc Power electronics for in-wheel motor
Image:
Protean
Electric
Harsh environment in conventional applications

23
MARKET SHARES
Power semiconductor
ranking

24
M&A AND FINANCIAL ANALYSIS
Company profiles
M&A

25
RELATED REPORTS

Last year we saw an impressive 8.4% year-to-
year growth rate for power electronics in the
main power inverter segments, including electric
and hybrid electric vehicles (EV/HEV), motor
drives and uninterruptible power supplies (UPS).
To understand this market it is important to
recognize that power electronics is application
driven, not technology driven, unlike other ‘More
than Moore’ electronics areas. In recent years
this market has grown thanks to megatrends such
as the arrival of the digital era or environmental
issues. We can directly link the latter to
governmental funds given by different countries
for energy efficiency improvement, increasing
sales of new power electronics systems.
As an example, the EV/HEV segment is driven
technologically by CO2 emission reduction
targets, higher efficiency requirements or less
dependency on the oil industry. Today, full electric
cars represent slightly over 5% of EV/HEV sales
volumes, while they will represent 21% by 2023.
Overall, Yole Développement's (Yole) analysts
expect the EV/HEV power electronics segment to
grow with an impressive 20.7% compound annual
growth rate for 2017-2023 (CAGR2017-2023
).
Subsidies have an enormous impact on the
renewable energy market. This can be seen in
the PV market shrinkage predicted in 2018 due to
the strong reduction of subsidies in China, which
had about the 50% of the solar global installations
in 2017. Nevertheless, Yole expects that the
market will recover in the mid-term thanks to the
decrease in cost and the increase of installations
in other regions of the world.
On the other hand, there are some new power
electronics segments that need to be developed
for the proper expansion of other existing power
markets. This is the case of the DC charging or
the stationary energy storage markets. In fact, DC
charging solutions need to be rapidly developed
to follow the growth of the EV/HEV market with
fast and efficient charging. Likewise, for further
development of the PV and wind market, stationary
energy storage systems need to be expanded.
In this report, Yole summarizes the different trends
on power electronics driving applications, with the
main technology developments associated with each
application.
STATUS OF THE POWER ELECTRONICS INDUSTRY 2018
Market & Technology report - August 2018
POWER ELECTRONICS: AN APPLICATION DRIVEN MARKET
EV/HEV, motor drives, computing and storage propel power electronics market growth, from devices
to passives, packaging and integration.
KEY FEATURES
•The power electronics
semiconductor market reached
$32.7B in 2017 and we expect the
growth to continue in 2018
• The IGBT market grew 11.7% from
2016 to 2017. In 2018, IGBTs are
expecting similarly spectacular
growth, higher than 10%
• EV/HEV growth is confirmed,
making this the dominant segment
for technology innovation
• Solutions for thermal management
and harsh environments are
attracting increasing interest
• The entrance of SiC and GaN
devices will grab market share
from silicon
• The PV market will drop from 2018
due to cut of subsidies in China but
is expected to progressively recover
• Yole Développement's analysts
expect the power module market
to take share from discrete devices
WHAT’S NEW
• Update on power electronics wafer
level market from 2017 to 2023
• Update on power electronics
major discrete and module
segments including IGBT, MOSFET
and Power IC from 2017 to 2023
• Update of power electronics
inverter market from 2017 to 2023
• Market and technology trends for
each power electronics application
• Focus on EV/HEV market and on
technology and packaging trends
• Passive components, batteries,
power stack technological trends
• Harsh environments and thermal
management in power electronics
• Wide band gap section update,
with GaN and SiC market
• Other compound semiconductors
for power electronics
• Company profile updates with
2017 revenues and key features
• Power electronics player ranking
and landscape analysis for 2017
• Analysis of the latest MA activity
(Yole Développement,August 2018)
Climate change
Governmental subventions
Artificial Intelligence
Adjacent application needs
Digital era
2017
2010
From niche to new applications
PV
Motor drive
Rail
EV/HEV
UPS
Wind
Power Supply
Server and
Data Center
LiDAR
Charging
Station
Wirless
Power
PV
Wind
Motor drive
UPS
Rail
EV/HEV
Power Supply Server and
Data Center
What is driving the power electronics industry?
POWER ELECTRONIC SEMICONDUCTOR DEVICES GREW 11.7% FROM 2016TO 2017
The total power electronics market was worth
$32.7B in 2017, with power ICs representing
about the half of that. Last year saw a boom in the
power electronics semiconductor market with an
impressive 11.7% year-to-year growth rate, mainly
due to the increase in sales in IGBT devices for EV/
HEVs and motor drives. Demand for computing
and storage and for automotive segments also
boosted the MOSFET device market by 8.3% in
2017.

STATUS OF THE POWER ELECTRONICS INDUSTRY 2018
Yole expects a very positive perspective over the
next five years, with a CAGR2017-2023
of over 4% for
the power device market. This will be driven mainly
by EV/HEVs, which will account for almost $1.8B
worth of MOSFETs and more than $1.9B in the
IGBT market, including both discretes and modules.
MOSFET demand will also be driven by networking
and telecommunications, which is booming with
an 8.3% CAGR2017-2023
due to the installation of 5G
network infrastructure.
Many manufacturers are therefore enlarging their
production capacities to fulfil these needs with short
shipment times. For instance, Infineon is expanding
its production capacity with 300mm fabs for power
electronics devices, including IGBTs. As many
applications in China are driven by its big domestic
demand, it is also putting a lot of effort and funding
into developing internal power electronics device
technology and manufacturing know-how to expand
downstream within the supply chain.
2017-2023 power electronics driving application evolution
for discrete and module IGBTs MOSFETs markets
$10.4 B
$13.2 B
2023
2017
$1.35 B
$2.3 B
Computing
Storage
$1.51 B
$2.5 B
$3.7 B
Industrial
$0.7 B
$1.4 B
Consumer [1]
$1.52 B
Home
appliance
$0.8 B
[1] Consumer segment includes Portable Wireless and Audio Image applications
$2.68 B
$3.16 B
OthersEV/HEV
$2 B
CAGR2017-2013
:
+4%
TECHNOLOGY STILL MATTERS
The power electronics market needs to evolve with
regards to efficiency and thermal management due to
the large power loads systems are handling. The main
players need to invest in technology development to
reduce device and system costs, to reduce weight
and size without impairing thermal management or
reliability. Optimized solutions are being implemented
at device, packaging, module, power stack or inverter
levels. Passive components have to be also adapted
to fully use the potential of new semiconductor
materials, devices and system designs.
Yole sees a strong improvement axis that relies on
device development, either in silicon or in wide band
gap materials like SiC or GaN. Therefore, end-users
could achieve higher system efficiencies, going to
higher frequencies and higher power densities by
using more compact systems or even integrating
them in a single chip. However, even as SiC penetrates
different applications, silicon solutions are still being
developed and optimized for high efficiency systems.
As an illustration, we saw the new generation of
Infineon’s IGBT coming to the market last year.
In this report, Yole’s analysts summarize different
technology improvements and trends for the full inverter
components. That includes the challenger materials SiC
and GaN, which must still battle to ramp up production.
Yole's analysts show how technology advances are linked
to application needs like the power module innovations
required for EV/HEV.
Improvement trends* for different system components
Power
modules/IPM
DC link
capacitors
Laminated
busbars
Cooling
systems
Current
sensors
Switching
drivers
Fuses, over voltage
protections, etc.
• Wide Band Gap
• High temperature packaging
• Advanced packaging in power
(WLP, embedded)
• High operating
temperature and high
voltages
• Signal and power connections in one device
• Integration of water pipes
• Direct liquid systems
• Coreless transformer
isolation
• Capacitive coupling
isolation
*Non-exhaustive list
• Higher operating temperature
• Improved accuracy
• Small and compact designs
• Faster response time
• Higher operating
temperature
• New substrate materials
• Bond-free interconnections
• New encapsulation materials
• High temperature packaging
Discrete
devices

MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
ABB, Alpha and Omega Semiconductor (AOS), Amkor, Analog Devices, ASE Group, ATS, AVX,
BMW Group, Bosch, BYD, Continental, Cree, CRRC, Danfoss, Delphi, Denso, Dialog Semiconductor,
Diodes Incorporated, DuPont Teijin Films, Dynex, EXAGAN, Fuji Electric, GaN Systems,
General Electric, GeneSiC, Global Wafers, Goldwind, Hitachi, Huawei, Infineon, Intel, Intersil,
Littelfuse, Macmic, Microchip, Microsemi, Mitsubishi Electric, Navitas, Nissan, NXP, Okmetic, ON
Semiconductor, Panasonic, Qualcomm, Renault, Renesas, Rohm, Sanken, Semikron, Shindengen,
Siemens, Silego Technology, ST Microelectronics, StarPower, STATSChipPAC, Sungrow, TDK, Tesla
Motors, Topsil, Toray, Toshiba, Toyota, Transphorm, TSMC, USCi, Vincotech, Vishay, Volkswagen,
Wolfspeed, and more.

What is new vs what is updated? 4
Executive summary 11
Introduction 46
Power electronics market 61
Power electronics drivers and evolution 114
Driving applications 122
Focus on EV/HEV 138
Technology analysis 153
Toward more integration in power electronics
Power stack
Passive components
- Power capacitors
- Inductors
- Bus bar
Wide Band Gap devices
- SiC
- GaN-on-Si
- Other WBG
- Battery and Power electronics
- Power electronics for harsh environment
Power electronics landscape 297
Mergers Acquisitions 334
Focus on China
Conclusions 360
TABLE OF CONTENTS (complete content on i-Micronews.com)
Find more
details about
this report here:
RELATED REPORTS
Benefit from our Bundle Annual
Subscription offers and access our analyses
at the best available price and with great
advantages
• Power Module Packaging 2018: Material
Market and Technology Trends
• Power SiC 2018: Materials, Devices and
Applications
• Power Electronics for EV/HEV 2018
• Tesla Model 3 Inverter with SiC Power
Module from STMicroelectronics
Find all our reports on
www.i-micronews.com
OBJECTIVES OF THE REPORT
• Assess the market for wafers, devices, modules and inverters
• Understand the market dynamics for the whole power electronics industry
• Identify the key drivers that will shape the market in the future
• To have an overview on the different components used in power electronics and its integration
• Understand the main technological challenges to overcome and the solutions developed so far
• Provide a clear overview of the different applications driving the power electronics business
• Present data ranking the power electronics industry leaders, describing supply chain consolidation,
the latest MA activity and future trends in the power player landscape
Dr. Ana Villamor is involved
in many custom studies and
reports focused on emerging
power electronics technologies at Yole
Développement, including device technology
and reliability analysis (MOSFET, IGBT, HEMT,
etc). In addition, Ana is leading the quarterly
power management market updates released in
2017. Previously Ana worked within the CNM
research center and for the leading power
electronic company ON Semiconductor. During
this partnership and after two years as Silicon
Development Engineer, she acquired a relevant
technical expertise and a deep knowledge of
the power electronic industry. Ana is author and
co-author of several papers as well as a patent.
She holds an Electronics Engineering degree
completed by a Master in micro and nano
electronics, both from Universitat Autonoma
de Barcelona (SP).
Dr. Milan Rosina has
20 years of scientific, industrial
and managerial experience
involving equipment and process development,
due diligence, technology, and market surveys
in the fields of renewable energies, EV/HEV,
energy storage, batteries, power electronics,
thermal management, and innovative materials
and devices. He received his Ph.D. degree from
National Polytechnical Institute (Grenoble,
France). He previously worked for the Institute
of Electrical Engineering in Slovakia, Centrotherm
in Germany, Fraunhofer IWS in Germany, CEA
LETI in France, and utility company ENGIE in
France.
Alejandra Fuentes
Suarez researches the
latest developments in
power converter topologies, passive
components, power modules packaging
and EV/HEV every day. Previously she
acquired extensive expertise in the design
of power converters for solar, wind,
hydro and motor drive applications at
Semikron (FR). Alejandra graduated from
UJF (Grenoble, FR) and INP (Grenoble,
FR) as an electrical engineer, specializing
in design of power electronics systems.
She also holds an advanced master’s in
the field of marketing and management of
energy from the Grenoble Business School
(Grenoble, FR).
As analysts within the Power Wireless division at Yole Développement Dr. Ana Villamor, Dr. Milan Rosina
and Alejandra Fuentes Suarez co-authored the Status of the Power Electronics Industry 2018 report:
AUTHORS

ORDER FORM
Status of the Power Electronics Industry 2018
SHIPPING CONTACT
First Name:
Email:
Last Name:
Phone:
PAYMENT
BY CREDIT CARD
Visa Mastercard Amex
Name of the Card Holder:
Credit Card Number:
Card Verification
Value (3 digits except AMEX: 4 digits):
Expiration date:
BY BANK TRANSFER
BANK INFO: HSBC, 1 place de la Bourse,
F-69002 Lyon, France,
Bank code: 30056, Branch code: 00170
Account No: 0170 200 1565 87,
SWIFT or BIC code: CCFRFRPP,
IBAN: FR76 3005 6001 7001 7020 0156 587
RETURN ORDER BY
• FAX: +33 (0)472 83 01 83
• MAIL: YOLE DÉVELOPPEMENT, Le Quartz,
75 Cours Emile Zola, 69100 Villeurbanne/Lyon - France
SALES CONTACTS
• Western US Canada - Steve Laferriere:
+ 1 310 600-8267 – laferriere@yole.fr
• Eastern US Canada - Troy Blanchette:
+1 704 859 0453 – troy.blanchette@yole.fr
• Europe RoW - Lizzie Levenez:
+ 49 15 123 544 182 – levenez@yole.fr
• Japan Rest of Asia - Takashi Onozawa:
+81 34405-9204– onozawa@yole.fr
• Greater China - Mavis Wang:
+886 979 336 809 – wang@yole.fr
• Specific inquiries: +33 472 830 180 – info@yole.fr
(1)
Our Terms and Conditions of Sale are available at
www.yole.fr/Terms_and_Conditions_of_Sale.aspx
The present document is valid 24 months after its publishing date:
August 22, 2018
/
ABOUT YOLE DEVELOPPEMENT
BILL TO
Name (Mr/Ms/Dr/Pr):
Job Title:
Company:
Address:
City:
State:
Postcode/Zip:
Country*:
*VAT ID Number for EU members:
Tel:
Email:
Date:
PRODUCT ORDER - Ref YD18033
Please enter my order for above named report:
One user license*: Euro 5,990
Multi user license: Euro 6,490
- The report will be ready for delivery from September 6, 2018
- For price in dollars, please use the day’s exchange rate. All reports are
delivered electronically at payment reception. For French customers,
add 20% for VAT
I hereby accept Yole Développement’s Terms and Conditions of Sale(1)
Signature:
*One user license means only one person at the company can use the report.
Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and
corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications
using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and image
sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, Software, Optoelectronics, Microfluidics Medical, Advanced Packaging,
Manufacturing, Nanomaterials, Power Electronics and Batteries Energy Management.
The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting,
PISEO and KnowMade, support industrial companies, investors and RD organizations worldwide to help them understand markets and follow technology
trends to grow their business.
CONSULTING AND ANALYSIS
• Market data research, marketing analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
• Design and characterization of innovative optical systems
• Financial services (due diligence, MA with our partner)
More information on www.yole.fr
MEDIA EVENTS
• i-Micronews.com website related @Micronews e-newsletter
• Communication webcast services
• Events: TechDays, forums…
More information on www.i-Micronews.com
REPORTS
• Market technology reports
• Patent investigation and patent infringement risk analysis
• Teardowns reverse costing analysis
• Cost simulation tool
More information on www.i-micronews.com/reports
CONTACTS
For more information about :
• Consulting Financial Services: Jean-Christophe Eloy (eloy@yole.fr)
• Reports: David Jourdan (jourdan@yole.fr) Yole Group of Companies
• Press Relations Corporate Communication: Sandrine Leroy (leroy@yole.fr)

© 2018
Yole Développement
FromTechnologies to Market
Source: Wikimedia Commons

2©2018 | www.yole.fr | About Yole Développement
YOLE DEVELOPPEMENT – 4 DIVISIONS
Life Sciences
Healthcare
o Microfluidic
o BioMEMS
o Inkjet Printing
o Solid-State Medical Imaging BioPhotonics
o Bio Technologies
Power
Wireless
o RF Devices Technology
o Compound Semiconductors Emerging Materials
o Power Electronics
o Batteries Energy Management
Semiconductor
Software
o Package Assembly Substrates
o Semiconductor Manufacturing
o Memory
o Software Computing
Photonics,
Sensing Display
o Solid-State Lighting Display
o MEMS, Sensors Actuators
o Imaging
o Photonics Optoelectronics
Semiconductor
Software
Power Wireless
Photonics,
Sensing
Display
Life
Sciences
Healthcare

3 BUSINESS MODELS
o Consulting and Analysis
• Market data research,
marketing analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
• Design and characterization of
innovative optical systems
• Financial services (due diligence,
MA with our partner)
www.yole.fr
o Syndicated reports
• Market technology reports
• Patent investigation and patent
infringement risk analysis
• Teardowns reverse costing
analysis
• Cost simulation tool
www.i-Micronews.com/reports
o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication webcast
services
• Events:TechDays, forums,…
www.i-Micronews.com

6 COMPANIES TO SERVEYOUR BUSINESS
Due diligence
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
Market, technology and strategy
consulting
www.yole.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
Yole Group of Companies

OUR GLOBAL ACTIVITY
30%of our business
40%of our business
30%of our business
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Yole Inc.
Phoenix
Yole Korea
Seoul
Palo Alto

ANALYSIS SERVICES - CONTENT COMPARISON
Technology
and Market
Report
Leadership
Meeting
QA
Service
Depth of the analysis
Breadthoftheanalysis
Meet the
Analyst
Custom
Analysis
High
High
Low

SERVING THE ENTIRE SUPPLY CHAIN
Our analysts
provide
market
analysis,
technology
evaluation,
and business
plans along
the entire
supply chain
Integrators, end-
users and software
developpers
Device manufacturers
Suppliers: material, equipment,
OSAT, foundries…
Financial investors, RD centers

SERVING MULTIPLE INDUSTRIAL FIELDS
We work
across
multiples
industries to
understand
the impact of
More-than-
Moore
technologies
from device
to system
From A to Z…
Transportation
makers
Mobile phone
and
consumer
electronics
Automotive
Medical
systems
Industrial
and defense
Energy
management

o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market technology analysis, patent
investigation and patent infringement risk analysis, teardowns reverse costing analysis.They cover:
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain…
Our reports are for you!
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,
identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry
landscape.
In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of the
industry.
o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Bundled Offer and receive at least a 36% discount.
REPORTS COLLECTION
www.i-Micronews.com
• MEMS Sensors
• RF devices technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software
• Memory

OUR 2018 REPORTS COLLECTION (1/4)
MEMS SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 – Update
− Silicon Photonics 2018 – Update
− Consumer Biometrics: Hardware Software 2018 – Update
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Acoustic MEMS and Audio Solutions 2017
− MEMS Sensors for Automotive Market Technology Trends 2017
− High End Inertial Sensors 2017
− Magnetic Sensor 2017
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT
– by System Plus Consulting
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product
Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− MEMS Pressure Sensor 2018 – Market Technology Report
− MEMS Pressure Sensor Comparison 2018 – Structure, Process Cost Report
− Gas Particles 2018 – Market Technology Report
− Gas Particles Comparison 2018 – Structure, Process Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market
Technology Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
− MEMS Packaging 2017 – Market Technology Report
− MEMS Packaging Comparison 2017 – Structure, Process Cost Report
RF DEVICES ANDTECHNOLOGIES
− Wireless technologies (Radar, V2X) for Automotive 2018
− RF Standards and Technologies for Connected Objects 2018
− RF Photonic Components Technologies for 5G Infrastructure 2018
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT– by System
Plus Consulting
− Automotive Radar Comparison 2018
− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis
− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market
Technology Report – Update
− RF Front-End Module Comparison 2018 – Structure, Process Cost Report
− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis
− Advanced RF System-in-Package for Cellphones 2018 – Market Technology
Report – Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
Market Technology Report – Update
− RF GaN Comparison 2018* – Structure, Process Cost Report
− RF GaN 2018 – Patent Landscape Analysis
SOFTWARE
− Consumer Biometrics: Sensors Software 2018 – Update
− Processing Hardware and Software for AI 2018 - Vol. 1 2
− From Image Processing to Deep Learning, Introduction to Hardware and Software
Update : 2017 version still available / *To be confirmed

IMAGING OPTOELECTRONICS
− Status of the Compact Camera Module and Wafer Level Optics
− Industry 2018 – Update
− 3D Imaging and Sensing 2018 – Update
− Sensors for Robotic Vehicles 2018
− Machine Vision for Industry and Automation 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− Uncooled Infrared Imagers 2017
− iPhone X Dot Projector – Patent-to-Product Mapping
− Status of the CMOS Image Sensor Industry 2018 – Market Technology Report -
Update
− CMOS Image Sensor Comparison 2018 – Structure, Process Cost Report
− CMOS Image Sensors Monitor 2018* – Quaterly Update**
− Camera Module 2017 – Market Technology Report
− Compact Camera Module Comparison 2018 – Structure, Process Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market Technology
Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
ADVANCED PACKAGING
− Status of Advanced Packaging Industry 2018 – Update
− Status of Advanced Substrates 2018: Embedded Die and Interconnects,
Substrate Like PCB Trends
− 3D TSV and Monolithic Business Update 2018 – Update
− Power Modules Packaging 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Status of Panel Level Packaging 2018
− Trends in Automotive Packaging 2018
− Hardware and Software for AI 2018 - Vol. 1 2
− Thin-Film Integrated Passive Devices 2018
− Memory Packaging Market and Technology Report 2018 – Update*
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
o LINKED REPORTS– by Yole Développement and System Plus Consulting
− Advanced RF System-in-Package for Cellphones 2018 – Market Technology Report -
Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− Fan-Out Packaging 2018 – Market Technology Report – Update*
− Fan-Out Packaging Comparison 2018* – Structure, Process Cost Report
MANUFACTURING
− Wafer Starts for More Than Moore Applications 2018
− Equipment for More than Moore: Technology Market Trends
for Lithography Bonding/Debonding 2018
− Polymeric Materials for wafer-level Advanced Packaging 2018
− Laser Technologies for Semiconductor Manufacturing 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Equipment and Materials for 3D TSV Applications 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− Equipment for More than Moore: Technology Market Trends for
Lithography Bonding/Debonding 2018 – Market Technology Report
− Wafer Bonding Comparison 2018 – Structure, Process Cost Report

MEMORY
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update*
o QUARTERLY UPDATE – by Yole Développement**
− Memory Market Monitor 2018 (NAND DRAM)
o MONTHLY UPDATE – by Yole Développement**
− Memory Pricing Monitor 2018 (NAND DRAM)
o REVERSE ENGINEERING COSTING REVIEW – by System Plus Consulting
− DRAM Technology Cost Review 2018
− NAND Memory Technology Cost Review 2018
− 3D Non-Volatile Memories – Patent Landscape
COMPOUND SEMICONDUCTORS
− Status of Compound Semiconductor Industry 2018*
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Bulk GaN Substrate Market 2017
− Power SiC 2018: Materials, Devices, and Applications – Market Technology
Report – Update
− SiC Transistor Comparison 2018 – Structure, Process Cost Report
− Power SiC 2018 – Patent Landscape Analysis
− Power GaN 2018: Materials, Devices, and Applications – Market Technology Report
– Update
− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process Cost Report
− Status of the GaN IP – Patent Watch 2018 Patent Activity 2017
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
– Market Technology Report – Update
− RF GaN – Patent Landscape Analysis
POWER ELECTRONICS
− Status of Power Electronics Industry 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Power Electronics for Electric Vehicles 2018 – Update
− Integrated Passive Devices (IPD) 2018
− Wireless Charging Market Expectations and Technology Trends 2018
− Thermal Management Technology and Market Perspectives in Power
− Electronics and LEDs 2017
− Gate Driver 2017
− Power MOSFET 2017
− IGBT 2017
− Market Opportunities for Thermal Management Components in
Smartphones 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting
and KnowMade
− Power Modules Packaging 2018 – Market Technology Report – Update
− Automotive Power Module Packaging Comparison 2018 – Structure,
Process Cost Report
− Power ICs Market Monitor 2018 – Quaterly Update**
− Power ICs Market Comparison 2018* – Structure, Process Cost Report
BATTERY AND ENERGY MANAGEMENT
− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –
Update
− Status of the Battery Patents – Patent Watch 2018 Patent Activity 2017
o LINKED REPORTS – by Yole Développement and KnowMade
− Solid State Electrolyte Battery 2018 – Market Technology Report
− Solid-State Batteries 2018 – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer

SOLID STATE LIGHTING
− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update
− Automotive Lighting 2018: Technology, Industry and Market Trends – Update
− UV LEDs 2018: Technology, Industry and Market Trends – Update
− LiFi: Technology, Industry and Market Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− CSP LED Lighting Modules
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
− Horticultural Lighting 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− VCSELs 2018: Technology, Industry and Market Trends – Market Technology
Report
− VCSELs Comparison 2018 – Structure, Process Cost Report
DISPLAYS
− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update
− Displays and Optical Vision Systems for VR/AR/MR 2018
− MicroLED Displays 2018 – Market Technology Report – Update
− MicroLED Display – Patent Landscape Analysis
MEDTECH
− BioMEMS Non Invasive Emerging Biosensors: Microsystems for Medical
− Applications 2018 – Update
− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update
− Neurotechnologies and Brain Computer Interface 2018
− CRISPR-Cas9 Technology: From Lab to Industries 2018
− Ultrasound Technologies for Medical, Industrial and Consumer Applications 2018
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Liquid Biopsy: from Isolation to Downstream Applications 2018
− Chinese Microfluidics Industry 2018
− Scientific Cameras for the Life Sciences Analytical Instrumentation
Laboratory Markets 2018*
− Artificial Organ Technology and Market 2017
− Connected Medical Devices Market and Business Models 2017
− Status of the Microfluidics Industry 2017
− Organs-On-Chips 2017
− Solid-State Medical Imaging 2017
− Medical Robotics Market Technology Analysis 2017
− Microfluidic IC Cooling – Patent Landscape
− Circulating Tumor Cell Isolation – Patent Landscape
− OCT Medical Imaging – Patent Landscape
− Pumps for Microfluidic Devices – Patent Landscape 2017
− Microfluidic Technologies for Diagnostic Applications – Patent Landscape 2017
− FLUIDIGM – Patent Portfolio Analysis 2017
− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017
− Organs-On-Chips 2017 – Market Technology Report
− Organ-on-a-Chip – Patent Landscape Analysis

OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N Patent Watch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− Microfluidic Technologies for Diagnostic Applications Patent Landscape
TEARDOWN REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).

MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person. Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience.Webcasts
create very useful, dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
Benefit from the i-Micronews.com
traffic generated by the 11,200+
monthly unique visitors, the
10,500+ weekly readers of
@Micronew se-newsletter
Several key events planned for
2018 on different topics to
attract 120 attendees on average
Gain new leads for your business
from an average of 340
registrants per webcast
Contact: CamilleVeyrier (veyrier@yole.fr), Marketing Communication Project Manager

CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS, REPORT
BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director forWestern US
Canada
Email: laferriere@yole.fr – + 1 310 600-8267
• Troy Blanchette, Senior Sales Director for Eastern US
Canada
Email: troy.blanchette@yole.fr – +1 704 859-0453
• Japan Rest of Asia:
• Takashi Onozawa, General Manager,Asia Business
Development (Korea, Singapore, India ROA)
Email: onozawa@yole.fr - +81 34405-9204
• Miho Othake, Account Manager (Japan)
Email: ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Japan)
Email: oshiba@yole.fr - +81-80-3577-3042
• Greater China: Mavis Wang, Director of Greater China Business
Development
Email: wang@yole.fr - +886 979 336 809
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• RoW: Jean-Christophe Eloy, CEO President,Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnership withWoodside
Capital Partners)
• Jean-Christophe Eloy, CEO President
Email: eloy@yole.fr - +33 4 72 83 01 80
• Ivan Donaldson,VP of Financial Market Development
Email: ivan.donaldson@yole.fr - +1 208 850 3914
o GENERAL
• Public Relations: leroy@yole.fr - +33 4 72 83 01 89
• Email: info@yole.fr - +33 4 72 83 01 80
Follow us on

Status of the Power Electronics Industry 2018 report by Yole Développement

Recommended

Recommended

More Related Content

What's hot

What's hot (20)

Similar to Status of the Power Electronics Industry 2018 report by Yole Développement

Similar to Status of the Power Electronics Industry 2018 report by Yole Développement (20)

More from Yole Developpement

More from Yole Developpement (20)

Recently uploaded

Recently uploaded (20)

Status of the Power Electronics Industry 2018 report by Yole Développement