Status of the Power Module Packaging Industry 2020

© 2020
From Technologies to Markets
Status of the Power
Module Packaging
Industry 2020
Market and Technology
Report 2020
Sample
Courtesy of System Plus Consulting

22
• Glossary 2
• Table of contents 3
• Definitions 6
• Report objectives 7
• Scope of the report 8
• Report methodology 9
• About the author 10
• Companies cited in this report 11
• What we got right and what we got wrong 12
• Who should be interested by this report? 13
• Yole Group of companies related reports 14
• Executive summary 15
o Why this report?
o Market figures
o Market trends
o Supply chain
o Technology trends
• Market forecasts 56
o Power modules: what and why?
o Power module market size, in $M
o Global power module packaging market
o Power module packaging material market in 2019
o 2019-2025 power module packaging market evolution – split by
packaging solution
o Power module packaging market – interconnections
o Power module packaging market – encapsulation
TABLE OF CONTENTS
Part 1/3
o Power module packaging market – die attach
o Power module packaging market – substrate attach
o Power module packaging market – substrates
o Power module packaging market – baseplates
o Power module packaging market - thermal interface materials
o Takeaways
• Market trends 100
o What is described in this report?
o Megatrend implications
o Power electronics and 21st century challenges
o What are the main drivers for the different market segments?
o Which power converters are using power modules?
o Power electronics - history, use, and trends
o EVs/HEVs - main trends
o Renewable energy
o Photovoltaics
o Wind
o UPS, motor drives, energy transfer and storage
o Takeaways
• Business model and supply chains Analysis 112
o Business model and supply chain analysis
o Power module supply chain
o Interconnection manufacturers
o Encapsulation manufacturers
o Baseplate manufacturers
Status of the Power Module Packaging Industry 2020 | Sample | www.yole.fr | ©2020

33
TABLE OF CONTENTS
Part 2/3
o Die and substrate attach manufacturers
o Thermal interface material manufacturers
o Ceramic substrate manufacturers
o Insulated metal substrate (IMS) manufacturers
o Intelligent power module manufacturers
o Trends towards power module standardization and its impact on the supply
chain
o Strengthened competitive position due to an early adoption of innovative
solutions
o Supply chain movement
o Diversification of reduction by manufacturing in countries with a low
cost of production
o Geographical expansion
o Supply chain reshaping
o Takeaways – supply chain
• Impact of the COVID-19 Crisis on the Power Electronics Industry 146
• Focus on China 152
o What does the future hold for China?
o Different market segments, varying governmental influence
o Chinese players are expanding their capabilities
o Chinese competition is growing
o Power module package players in China
o China power module package – example
o Takeaways – focus on China
• Technology trends 160
o Packaging as a crucial system element
o Packaging type by inverter power range
o Power module packaging trends
o Global trends in power module packaging
o Impact of double-side cooling designs on choice of packaging materials
o Impact of SiC dies on choice of packaging materials
o Technology trends - electrical interconnections
o Technology trends - encapsulation
o Technology trends – die and substrate attach
o Technology trends – substrates
o Technology trends – baseplates
o Technology trends – thermal interface materials
o Global trends for power module packaging - overview
o Takeaways – technology trends
• Power module packaging 189
o Structure of a conventional power module
o Main factors that determine packaging solution choice
o Power module material and process choice
o Power packaging and integration
o Power module material and process choice
o Thermomechanical issues in power modules
• Packaging module packaging solutions 199
o Composition of a conventional power module
o Interconnection

44
o Encapsulation
o Die and substrate attach
o Substrates
o Baseplates
o Thermal interface materials
o Wide-band gap power module packaging
o Intelligent power module
• Power module packaging requirements for various applications 303
o The same module for all applications or dedicated modules?
o Package type and requirements, depending on voltage/current range
o Voltage summary - split by application
o Power packaging
o EV/HEV
o UPS, motor drives
o Photovoltaic
o Wind
o Rail
o Power module packaging for various applications – summary
o Power module packaging - focus on EV/HEV
o EV/HEV – power modules
o How to reach a longer driving range?
o Different approaches to increase car driving range
o EV/HEV - main trends
o SiC in Main inverter
o Cost
o
TABLE OF CONTENTS
Part 3/3
• Takeaways and outlook 328
o Conclusions
o Takeaways: applications and technology trends
o Takeaways: market figures
o Takeaways: power packaging technologies
o Takeaways: supply chain
o Outlook – things to watch closely in the future
• Appendix: Power module case studies 338
• Yole Développement - Corporate Presentation 348

55
Dr. Shalu AGARWAL
Shalu Agarwal, Ph.D., is an analyst specializing in power electronics and materials at Yole Développement (Yole). Shalu is engaged in the development of
technology and market reports as well as the production of custom consulting studies within the Power and Wireless division. She has more than ten
years’ experience in electronic material chemistry. Before joining Yole, Shalu worked as a project manager and research professor in the fields of
electronic materials, batteries, and inorganic chemistry. Shalu received her master’s and Ph.D. in Chemistry from the Indian Institute of Technology (IIT)
Roorkee, India.
E-mail: shalu.agarwal@yole.fr
ABOUT THE AUTHOR
Biography and contact

66
COMPANIES CITED IN THE REPORT
Ametek,Avantor, Aismalibar,A.L.M.T. Corp.,Alpha & Omega Semiconductor,Amkor,AOSThermal
Compounds,Almatis,Aurel,Arlon,Amulaire, BYD, Boschman, Bosch, CRRC, CeramTec, CoorsTek, CPS
Technology, Comelec Sa, Curtiss-Wright, CML Europe, CHT Group, Dupont, Denka, Dow, Dowa,
Danfoss, Elkem, Electrolube, Ferrotec, Fuji Electric, Heraeus, HALA Contec, Hitachi Metals, Hitachi
Chemicals, Henkel, Indium corporation, Infineon, Interplex, Japan Fine Ceramics Co. Ltd., KCC, Kyocera,
KinWong Electronic, KISCO, Laird, La Chi Enterprise Co. Ltd, MacDermid Alpha Electronics Solutions,
Momentive, Merck, Maruwa, Muller Ahlhorn, Mitsubishi Electric, MacMic, NGK Insulators, Namics, ON
Semiconductor, Plansee, Powerex, Parker, Parylene Coating Services, Renesas, ROHM Semiconductor,
Rogers Corporation, Shin-Etsu, Suzhou Kary Nanotech, Sumitomo Bakelite Co. Ltd,
STMicroelectronics, Semikron, Specialty Coating System, Silga, ShengyiTechnology, StarPower, Serigroup,
Sensitron Semiconductor, Showa Denka, Silvermicro, Semiland,Texas Instruments,Tesla,Tanaka,Tatsuta,
Toshiba,Wacker,Wieland, Wurth Elektronik,Vincotech,Ventec, and more.

77
GLOBAL TRENDS FOR POWER MODULE PACKAGING
Both materials
and designs in
power
modules are
evolving
toward
greater device
reliability and
higher power
density.
Copper flat-
plate
baseplate
BaseplateStructured baseplate
for direct cooling.
No baseplate (for
low power
devices)
TIM
Thermal
grease
Direct cooling
with no TIM
Substrate
DBC Leadframe
AlN AMB
Si3N4 AMB Double-side cooling with two
ceramics/leadframes
Die attach
Soldering Silver sintering
Encapsulation
Silicone gel or epoxy Epoxy resin
Silicone gel or epoxy resin - high temperatures or
combination of epoxy and silicone gel
Interconnections
Aluminum wire
bonding
Ribbon
bonding
Copper wire
bonding
Substrate attach
Tin
soldering
Silver paste or
film sintering
Solder with
metal mesh
No baseplate
Pre-applied
TIM
Direct-cooled
baseplate
Phase change
materials
TIM
pads
Other direct-cooled baseplates
Integrated
substrates
Embedded die
Copper
sintering
Copper alloys → AlSiC for
some applications only.
2020 2025 and beyond2023
Copper clip
Direct bonding to
the cooler

88
POWER MODULE PACKAGING FORVARIOUS APPLICATIONS
Summary
Application EV/HEV Motor drive UPS PV Wind Rail
Key
requirements
• Low cost
• Small size
• High efficiency
• Higher power density
converters
• High reliability to
operate in harsh
environments
(extreme cold to
extreme heat)
• Robustness to
withstand a harsh
environment (heat
and vibration)
• Safe power systems
• Standard modules
and multiple
sourcing
• Long lifetime
• Robust
components
• Consistent
performance
• High energy
efficiency
• High reliability
within harsh
industrial
environments
• High
reliability
• Constant
power
• No dynamic
load
• High
efficiency
• Longer life-
time
• Low cost
• Downsizing
• Standard modules
• Consistent
performance and
high reliability in
spite of fluctuating
wind speeds
• Robust and
durable
• Longer-lifetime
components
• High reliability and
performance
consistency to
operate in harsh
temperature (heat,
frost…) for entire
service life.
• Robust to manage
shock, vibration and
dirt
• Long term availability

9
EXCELLENTVS. GOOD ENOUGH APPROACH IN POWER MODULE PACKAGING
Keeping product strategy adapted to technology and market evolutions
With maturing
EV/HEV power
module design
and packaging
solutions, and
growing EV/HEV
market, a change
of focus from
EXCELLENT to
GOOD
ENOUGH could
bring competitive
advantages.
Performance,
reliability
Cost
• To attract the attention of potential customers and to
differentiate from a growing number of competitors, EV/HEV
power module makers have been focused mainly on high
performance and high reliability power module design and
packaging solutions.
SiC die
Silver sintering
die attach
Si3N4 AMB
ceramic substrate
• However, as the manufacturing volumes are increasing, every
cent one can save in device production is very valuable.
• Moreover, if many players already offer comparable high-
performance products, it would be very complicated and
costly to differentiate by offering significantly better product.
• Therefore, some module makers opt for another approach:
instead of competing on high-performance and high-reliability
levels, they focus on cost reduction by maintaining “good-
enough” performance and reliability for their customers.
Performance,
reliability
Cost
Cost advantage
appreciated by customers
on maturing market with
increasing cost pressure
Excellent
Good
Enough
• An example is a “golden
triangle” in power module
packaging:

10
SUPPLY CHAIN MOVEMENT
Cost, cost, cost !
Although, the
best
technology is
very important,
with the
maturing EV
technology and
increasing EV
car sales, the
focus on cost
becomes
crucial.
While launching early EV/HEV products (low sales volume), car
makers are/were losing money for every EV/HEV sold.
This situation is not sustainable, once
the market becomes mature and sales
volume more important.
Time
EV/HEV market maturity
Early-stage differentiation
was made by technology
(performance)
To maintain the differentiating
added value face to a growing
number of competitors offering
high performance products, cost
becomes an important factor.

1111
POWER MODULE PACKAGING MATERIAL SUPPLIERS
Many players supply more than one packaging solution.
Baseplates TIMDie/Substrate attachSubstrates EncapsulationWires/Ribbons

12
POWER MODULE MARKETS RESHAPING
New entrants into power module markets
Despite having
many packaging
challenges,
many new
players are
trying to get
the revenue
from power
modules
business.

13
FOCUS ON CHINA
Chinese players are expanding their capabilities
• China has an increasing number of
world-leading companies at the
system level: for example CRRC,
Huawei, and Sungrow.
• When moving down to the power
packaging level the technology gap
widens between Chinese players and
established foreign players.
• At the power module packaging level,
the global IGBT module market is
ruled by giants like Infineon,
Mitsubishi Electric, Fuji Electric, ON
Semi, Semikron, etc. In addition, in
China foreign suppliers still provide a
large proportion of power modules
especially for high-end modules.
However, Chinese players, including
BYD, CRRC, StarPower, are also
expanding their capacities and
technological knowledge.
There is the
will, there is
the money, but
there are still
many
technological
challenges to
be overcome
by Chinese
power module
packaging
players.
Global power
packaging giants
Chinese players are also
expanding their capabilities,
production capacities and
technological knowledge.
Non-exhaustive list

1414
MARKET FIGURES

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for more
information
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for more
information
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Industrial Power Module
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System Plus Consulting

17
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