NewplayermCube,mainlyactiveontheChinesemarket,isgettingtractionwithnewtechnologiesallowingverylowmanufacturingcostwithoutdecreasingperformance.mCubemanagedtodesignasmartintegrationandistheonlyproviderofsingle-chipaccelerometersforconsumerelectronics. mCube3DMEMSprocessconsistsinMEMSelementsfabricatedontopofthedriveICandconnectedusingthroughsiliconvias(TSV).ToprotecttheMEMSelements,acapissealedwithaneutecticalloybondingprocess. ThemCubeaccelerometerisassembledinastandardLGA2x2mmpackage. Withthiscleverintegration,mCubeispositionedonestepaheadofSTMicroelectronicsandBoschSensortecrelatedtosizeandmanufacturingcost

1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not
bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The
quoted trademarks are property of their owners.
© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr
21 rue la Nouë Bras de Fer
44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr
November 2013 – Version 1 – Written by Romain Fraux

2. mCube 3-Axis MEMS Accelerometer
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Glossary
1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. Company Profile 7
– mCube
3. Physical Analysis 9
– Synthesis of the Physical Analysis
– Physical Analysis Methodology
– Package
– Package Views & Dimensions
– Package Opening
– Wire Bonding Process
– Package Cross-Section
– Die
– Die View & Dimensions
– Die Marking
– Bond Pad Opening
– MEMS Cap Removed
– MEMS Cap Details
– MEMS Sensing Area
– MEMS Sensing Area Removed
– Delayering (Metal Layers Removed)
– IC Process
– Die Cross-Section
– Die Cross-Section – IC
– Die Cross-Section – MEMS Sensor
– Die Cross-Section – Sealing Sensor/Cap
– Die Cross-Section – MEMS Cap
4. Comparison with Accelerometers from Bosch and ST 59
5. Manufacturing Process Flow 68
– Global Overview
– IC Front-End Process
– MEMS Process Flow
– Wafer Fabrication Unit
– Packaging Process Flow
– Package Assembly Unit
6. Cost Analysis 82
– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Hypotheses
– CMOS Front-End Cost
– MEMS Front-End Cost
– MEMS Front-End Cost per process steps
– MEMS Front-End: Equipment Cost per Family
– MEMS Front-End: Material Cost per Family
– Total Front-end Cost
– Back-End 0 : Probe Test & Dicing
– Wafer & Die Cost
– Back-End : Packaging Cost
– Back-End : Packaging Cost per Process Steps
– Back-End : Final Test & Calibration Cost
– Accelero Component Cost
– Accelero Component Price
– Cost & Price Comparison with Bosch and ST
Contact 106

3. mCube 3-Axis MEMS Accelerometer
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The reverse costing analysis is conducted in 3 phases:
Teardown
analysis
• Package is analyzed and measured
• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin
out, die marking
• Setup of the manufacturing process.
Costing
analysis
• Setup of the manufacturing environment
• Cost simulation of the process steps
Selling price
analysis
• Supply chain analysis
• Analysis of the selling price

4. mCube 3-Axis MEMS Accelerometer
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• Package: LGA 12-pin
• Dimensions: 2.0 x 2.0 x 0.9mm
• Pin Pitch: 0.5mm
• Marking:
BI3L
IVC
Package top view
Package back viewPackage Side View

5. mCube 3-Axis MEMS Accelerometer
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• The die marking includes:
MCUBE
2012
Die Marking

6. mCube 3-Axis MEMS Accelerometer
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7. mCube 3-Axis MEMS Accelerometer
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© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 7

8. mCube 3-Axis MEMS Accelerometer
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9. mCube 3-Axis MEMS Accelerometer
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10. mCube 3-Axis MEMS Accelerometer
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11. mCube 3-Axis MEMS Accelerometer
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© 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 11
Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates
completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on
the manufacturing cost (if all parameters are cumulated)
These results are open for discussion. We can reevaluate this circuit with your information.
Please contact us:
USA Office
• Michael McLaughlin, Business Development Manager, Phone: (650) 931 2552 - Cell: (408) 839 7178
Email: mclaughlin@yole.fr
• Jeff Edwards, Sales Associate, Yole Inc., Cell: (972) 333 0986-Email: edwards@yole.fr
Japan Office
• Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: onozawa@yole,fr
European Office
• Yves Devigne, Europe Business Development Manager, Cell: +33 6 75 80 08 25 -Email : devigne@yole.fr
• Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service,
Tel: +33 472 83 01 90, Email: jourdan@yole.fr
Korea Office
• Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 -Cell: (82) 10 4097 5810
Fax: (82) 2 2010 8899 Email: yang@yole.fr