Water cooled minichannel heat sinks for microprocessor cooling: Effect of fin spacing
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Heat sink with different fin spacing mounted on a microprocessor were tested for their heat removing capabilities by varying coolant flow rates over them
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Water cooled minichannel heat sinks for microprocessor cooling: Effect of fin spacing
- 1. Water cooled minichannel heat sinks for microprocessor cooling: Effect of fin spacing Saad Ayub, Wajahat Ali, Hafiz Muhammad, Aysha Maryam β’ Department of Mechanical and Aeronautical Engineering University of Engineering and Technology, Taxila, Pakistan β’ Department of Electrical Engineering, Comsats Institute of Information Technology, Wah, Pakistan Presenters β’ Danial Sohail ME-089 β’ Osaid Haq ME-102 β’ Daniyal Iqbal ME-103 β’ Owais Ali ME-105
- 2. Abstract β’ Heat Sinks With Five Different Fin Spacing β’ Lowest Base Temperature achieved from finest fin spacing β’ Modifying Geometry results in 9% less base temperature than commercial heat sink β’ 60% Higher Heat Transfer Coefficient in case of 0.2 mm fin spacing
- 3. Introduction β’ Microprocessor Operating Temperature 60β to 80β β’ Air Cooling Limitations β’ Optimize Liquid Cooling β’ Modify Thermophysical Properties of Coolant β’ Modify Heat Sink Geometry Using Ordinary Coolant
- 4. Optimize Liquid Cooling Modify Thermophysical Properties of Coolant β’ Use of Nanofluids β’ Heat Transfer Enhancement from 20% to 160% β’ Use is still Ambiguous due to: β’ Higher Cost β’ More Maintenance Modify Heat Sink Geometry β’ Heat Transfer increases by decreasing Channel Width β’ Miniature Jet Stream β’ This paper deals with effect of Sink Geometry
- 5. Authors Area of Study Conclusion X.L. Xie W.Q. Tao Y.L. He Heat transfer characteristics of water cooled mini channel heat sinks β’ Heat removal increased with decrease in channel width. β’ Thermal resistance increase with increase in channel width B.P. Whelan R. Kempers CPU cooling by liquid jet array impingement water block β’ Increased heat transfer than commercial cooling block P. Naphon S. Wongwises Experimental analysis of liquid jet impingement cooling system on real processor β’ Lowered CPU temperature than commercial cooling blocks M.R.O. PanΓ£o J.P.P.V. Guerreiro Analysis of intermittent multi-jet spray system β’ Higher efficiency and intelligent thermal management C. Bower A. Ortega C. Green Water cooled Silicon carbide mini channel heat sink for high power electronic appliances β’ Resulted higher performance than air cooled Silicon carbide. Literature Review
- 6. Authors Area of Study Conclusion J.A. Eastman S.U.S. Choi S. Li Anomalously increased effective thermal conductivities of ethylene glycol based nano fluids containing copper nanoparticles β’ 40% increase in thermal conductivity observed A. Ijam B. R. Saidur Comparison of water cooled and nano fluid cooled multichannel heat sinks β’ Nano fluid performed better than water. N.A. Roberts D.G. Walker Performance of Al2O3 β water nano fluid in commercial cooling system β’ 20% enhancement in heat transfer and comparatively higher nano fluid temperature at outlet under same heat flux conditions. M.R.O. PanΓ£o J.P.P.V. Guerreiro A.L.N. Moreieira Analysis of intermittent multi-jet spray system β’ Higher efficiency and intelligent thermal management C.T. Nguyen G. Roy C. Gauthier N. Galanis Heat transfer enhancement using Al2O3 - water nano fluid for an electronic liquid cooling system β’ Resulted 38%increase in convective heat transfer coefficient
- 7. Parameters for comparison of 5 heat sinks with different fin spacing Base Temperature (T base) Experiment Overall heat transfer coefficient (U) π = π πΆ π(πππ’π‘ β πππ) π΄ (πΏπππ·) Thermal Resistance (R th) π π‘β = πΏπππ· π Active Area Enhancement (A en) π΄ ππ = π΄ππ‘ππ£π ππππ ππ ππππππ ππππ‘ π πππ π΄ππ‘ππ£π ππππ ππ ππππ‘ ππππ‘π Enhanced overall heat transfer coefficient (U en) πππ = π πππ ππππππ ππππππ‘ππ¦ π πππ ππππ‘ ππππ‘π ππππ‘ π πππ
- 8. Schematic of experimental setup
- 9. Heat sink Fin Material Copper Fin thickness 1.0 mm Fin height 3.0 mm Fin base area 28.7 Γ 28.7 mm Fin base protrusion 0.5 mm Heating block Block Material Copper Heating Power 325 watts DC power 197 watts 1.65 amp Insulation Fiberglass wool Liquid cooling system Vendor β product Gigabyte - galaxy Coolant Water Experimental Apparatus
- 10. Experiment β’ 0.2 mm β’ 0.5 mm β’ 1.0 mm β’ 1.5 mm β’ Flat surface Fin Spacings β’ 0.5 LPM β’ 0.75 LPM β’ 1.0 LPM Flow rates
- 11. Results
- 12. β’ Comparison with commercially available Nano fluid. β’ Temperature of base is directly proportional to flow rate Conclusion β’ Lowest Base Temperature of 40.50C β’ Usage of water β’ Focus on Altering Geometries