Introduction to Semiconductor Devices.
In modern world no other technology permeates every nook and cranny of our existence as does electronics.
Application of electronics are : Televisions, radios, stereo equipment, computers, scanners, electronic control systems (in cars for example) etc.
Breaking the Kubernetes Kill Chain: Host Path Mount
Semiconductor devices
1. Semiconductor Devices
Dr G.S. Virdi
Director R & D Former Director Grade Scientist
GGS College of Modern Technology CSIR- Central Electronic Engineering
Kharar Mohali Research Institute- Pilani
2. In the modern world no other technology
permeates every nook and cranny of our
existence as does electronics.
Application of electronics are : Televisions,
radios, stereo equipment, computers,
scanners, electronic control systems (in cars
for example) etc.
Introduction to Electronic Devices
4. Introduction
This course adopts a top-down approach to the
subject and so far we have taken a ‘black-box’ view
of active components
It is now time to look ‘inside the box’
we will start by looking at diodes and
semiconductors
then progress to transistors
later we will look at more detailed aspects of
circuit design
6. The p-n junction is at the heart of electronics
technology. Most electronics is silicon based,
that is, the devices are made of silicon. Silicon
wafers are subjected to special procedures
which result in what is called p-type silicon
material and n-type silicon material. Where
these two types of materials meet we have a
p-n junction.
p-n junction
8. Diodes
One application of diodes is in rectification
the example below shows a half-wave rectifier
Inpractice, no real diode has ideal characteristics but
semiconductor p-n junctions make good diodes
To understand such devices we need to look at some
properties of materials
10. Semiconductors are materials whose electrical
conductivities are higher than those of insulators
but lower that those of conductors.
Silicon, Germanium, Gallium, Arsenide, Indium,
Antimonide and cadmium sulphide are some
commonly used semiconductors.
Semiconductors have negative temperature
coefficients of resistance, i.e. as temperature
increases resistivity deceases
Electrical Properties of Solids
11. Energy Band Diagram
Conduction band Ec
Ev
Eg
Band gap
Valence band
• Energy band diagram shows the bottom edge of conduction
band, Ec , and top edge of valence band, Ev .
•
Ec and Ev are separated by the band gap energy, Eg .
13. Energy Bands in Semiconductors
Forbidden band small for
semiconductors.
● Less energy required
for electron to move from
valence to conduction
band.
● A vacancy (hole)
remains when an electron
leaves the valence band.
● Hole acts as a positive
charge carrier to
conduction band
14. Energy gap in a conductor, semi conductor, and insulator?.
Conductor - no energy gap
Semi Conductor - 1. 1 ev.
Insulator 6 -9 ev.
Energy Bands in Insulators & Semiconductors
and Metals
15. Electrical Properties of Solids
Conductors
e.g. copper or aluminium
have a cloud of free electrons (at all
temperatures above absolute zero). If an electric
field is applied electrons will flow causing an
electric current
Insulators
e.g. polythene
electrons are tightly bound to atoms so few can
break free to conduct electricity
16. Electrical Properties of Solids
Semiconductors
e.g. silicon or germanium
at very low temperatures these have the properties
of insulators
as the material warms up some electrons break free
and can move about, and it takes on the properties
of a conductor - albeit a poor one
however, semiconductors have several properties
that make them distinct from conductors and
insulators
17. Silicon Crystal Structure
Unit cell of silicon crystal
is cubic.
Each Si atom has 4
nearest neighbors.
Electrical Properties of Solids
18. Electrical Properties of Solids
Pure semiconductors
thermal vibration results in some bonds being
broken generating free electrons which move
about
these leave behind holes which accept electrons
from adjacent atoms and therefore also move about
electrons are negative charge carriers
holes are positive charge carriers
At room temperatures there are few charge carriers
pure semiconductors are poor conductors
this is intrinsic conduction
19. Electrical Properties of Solids
Doping
the addition of small amounts of impurities
drastically affects its properties
some materials form an excess of electrons
and produce an n-type semiconductor
some materials form an excess of holes and
produce a p-type semiconductor
both n-type and p-type materials have much
greater conductivity than pure semiconductors
this is extrinsic conduction
20. Extrinsic Semiconductors / Doping
The electron or hole concentration can be
greatly increased by adding controlled
amounts of certain impurities
For silicon, it is desirable to use impurities
from the group III and V.
N-type Semiconductor can be created by
adding phosphorus or arsenic.
P -type Semiconductor can be created by
adding Boron or Gallium
21. Donors: P, As, Sb Acceptors: B, Al, Ga, In
By substituting a Si atom with a special impurity atom (Column V
or Column III element), a conduction electron or hole is created.
Doping
22. Electrical Properties of Solids
The dominant charge carriers in a doped semiconductor
(e.g. electrons in n-type material) are called majority
charge carriers. Other type are minority charge carriers
The overall doped material is electrically neutral
23. p-type material
Semiconductor material doped with
acceptors.
Material has high hole concentration
Concentration of free electrons in p-
type material is very low.
n-type material
Semiconductor material doped with
donors.
Material has high concentration of
free electrons.
Concentration of holes in n-type
material is very low.
Extrinsic Semiconductors
24. p-type material
Contains NEGATIVELY charged
acceptors (immovable) and
POSITIVELY charged holes (free).
Total charge = 0
n-type material
Contains POSITIVELY charged
donors (immovable) and
NEGATIVELY charged free
electrons.
Total charge = 0
Extrinsic Semiconductors
25. donor: impurity atom that increases n
acceptor: impurity atom that increases p
n-type material: contains more electrons than
holes
p-type material: contains more holes than
electrons
majority carrier: the most abundant carrier
minority carrier: the least abundant carrier
intrinsic semiconductor: n = p = ni
extrinsic semiconductor: doped semiconductor
Semiconductor Terminology
26. The p-n junction is at the heart of electronics
technology. Most electronics is silicon based, that is,
the devices are made of silicon. Silicon wafers are
subjected to special procedures which result in what
is called p-type silicon material and n-type silicon
material. Where these two types of materials meet
we have a p-n junction.
On its own a p-type or n-type semiconductor is
not very useful. However when combined very
useful devices can be made.
The formation of p-n junction
27. The p-n junction is the basic element of all bipolar
devices. Its main electrical property is that it rectifies
(allow current to flow easily in one direction only).The
p-n junction is often just called a DIODE. Applications;
>photodiode, light sensitive diode,
>LED- ligth emitting diode,
>varactor diode-variable capacitance
diode
transistors and integrated circuits
The formation of p-n junction
28. The p-n junction can be formed by pushing a piece of p-
type silicon into close contact with a piecce of n-type
silicon. But forming a p-n junction is not so simply.
Because;
There will only be very few points of contact and any
current flow would be restricted to these few points
instead of the whole surface area of the junction.
Silicon that has been exposed to the air always has a
thin oxide coating on its surface called the “native
oxide”. This oxide is a very good insulator and will
prevent current flow.
Bonding arrangement is interrupted at the surface;
dangling bonds.
The formation of p-n junction
29. A P-N Junction cannot be produced by simply
pushing two pieces together or by welding
etc…..Because it gives rise to discontinuities
across the crystal structure.
Special fabrication techniques are adopted to
form P-N Junction, e.g. Crystal Preparation ,
Masking, Photolithographic Process ,
Deposition ,Implantation , Diffusion
,Oxidation ,Epitaxy ,Contacts, Interconnects
,Metallization and Planarization.
The formation of p-n junction
30. To overcome these surface states
problems
p-n junction can be formed in the bulk of
the semiconductor, away from the
surface as much as possible.
Surface states
The formation of p-n junction
31. The formation of p-n junction
PN junction is present in perhaps every semiconductor devi
diode
symbol
N P
V
I
– +
Building Blocks of the PN Junction Theory
V
I
Reverse bias Forward bias
Donor ions
N-type
P-type
32. The formation of p-n junction
When p-type and n-type materials are
joined this forms a pn junction
majority charge carriers on each side diffuse
across the junction where they combine with
(and remove) charge carriers of the opposite
polarity
hence around the junction there are few free
charge carriers and we have a depletion layer
(also called a space-charge layer)
33. DEPLETION REGION
Free electrons on the n-side and free holes on the p-side can initially
diffuse across the junction. Uncovered charges are left in the
neighborhood of the junction.
This region is depleted of mobile carriers and is called the
DEPLETION REGION (thickness 0.5 – 1.0 µm).
The formation of p-n junction
34. The formation of p-n junction
The diffusion of positive
charge in one direction and
negative charge in the
other produces a charge
imbalance
this results in a
potential barrier
across the junction
36. The formation of p-n junction
Potential barrier
the barrier opposes the flow of majority charge
carriers and only a small number have enough
energy to surmount it
this generates a small diffusion current
the barrier encourages the flow of minority carriers
and any that come close to it will be swept over
this generates a small drift current
for an isolated junction these two currents must
balance each other and the net current is zero
37. Forward bias to p-n junction
When an external voltage is applied
to the P-N junction making the P side
positive with respect to the N side the
diode is said to be forward biased
(F.B).
The barrier p.d. is decreased by the
external applied voltage. The depletion
band narrows which urges majority
carriers to flow across the junction.
A F.B. diode has a very low resistance.
38. Forward bias to p-n junction
Forward bias
if the p-type side is made positive with respect to
the
n-type side the height of the barrier is reduced
more majority charge carriers have sufficient
energy to surmount it
the diffusion current therefore increases while the
drift current remains the same
there is thus a net current flow across the junction
which increases with the applied voltage
39. When an external voltage is applied to the
PN junction making the P side negative
with respect to the N side the diode is said
to be Reverse Biased (R.B.).
The barrier p.d. increases. The depletion
band widens preventing the movement of
majority carriers across the junction.
A R.B. diode has a very high resistance.
Reversed bias to p-n junction
40. Reversed bias to p-n junction
Reverse bias
if the p-type side is made negative with respect to
the
n-type side the height of the barrier is increased
the number of majority charge carriers that have
sufficient energy to surmount it rapidly decreases
the diffusion current therefore vanishes while the
drift current remains the same
thus the only current is a small leakage current
caused by the (approximately constant) drift current
the leakage current is usually negligible (a few nA)
42. Forward and reverse currents
Forward and reverse currents
pn junction current is given approximately by
where I is the current, e is the electronic charge, V
is the applied voltage, k is Boltzmann’s constant, T
is the absolute temperature and η (Greek letter
eta) is a constant in the range 1 to 2 determined
by the junction material
for most purposes we can assume η = 1
−= 1exp
ηkT
eV
II s
43. Semiconductor Diodes
Thus
at room temperature e/kT ~ 40 V-1
If V > +0.1 V
If V < -0.1 V
IS is the reverse saturation current
−≈ 1exp
kT
eV
II s
( )VI
kT
eV
II ss 40expexp =
≈
( ) ss III −=−≈ 10
45. Silicon diodes
Silicon diodes
generally have a turn-on voltage of about 0.5 V
generally have a conduction voltage of about 0.7 V
have a breakdown voltage that depends on their
construction
perhaps 75 V for a small-signal diode
perhaps 400 V for a power device
have a maximum current that depends on their
construction
perhaps 100 mA for a small-signal diode
perhaps many amps for a power device
46. I-V characteristics of electronic components.
Resistor
The I-V plot represents is the dependence of the current I
through the component on the voltage V across it.
V
R
IRIV ×
==>×=
1
;I = V /
R;R = V/I
V
I
R
∆V
∆I
α
tg(α) = 1/R
The I-V characteristic of the resistor
48. There is no turn-on voltage because current flows in any case.
However , the turn-on voltage can be defined as the forward
bias required to produce a given amount of forward current.
If 1 m A is required for the circuit to work, 0.7 volt can be
called as turn-on voltage.
VVbb
II00
VVbb ; Breakdown voltage
II0 ;0 ; Reverse saturation current
Forward BiasForward BiasReverse BiasReverse Bias
I(current)
V(voltage)
Ge ~ 0.2 – 0.4 V
Si ~ 0.6 – 0.8 V
Applying bias to p-n junction
51. Diode Circuits
Half-wave rectifier
peak output voltage
is equal to the peak
input voltage minus
the conduction
voltage of the diode
reservoir capacitor
used to produce a
steadier output
52. Diode Circuits
Full-wave rectifier
use of a diode
bridge reduces
the time for which
the capacitor has
to maintain the
output voltage
and thus reduced
the ripple voltage
53. Diode Circuits
Signal rectifier
used to demodulate
full amplitude
modulated signals
(full-AM)
also known as an
envelope detector
found in a wide range
of radio receivers from
crystal sets to
super heterodynes
54. Diode Circuits
Signal clamping
a simple form of
signal conditioning
circuits limit the
excursion of the
voltage waveform
can use a
combination of
signal and Zener
diodes
55. Key Points of Diode
Diodes allow current to flow in only one direction
At low temperatures semiconductors act like insulators
At higher temperatures they begin to conduct
Doping of semiconductors leads to the production of p-
type and n-type materials
A junction between p-type and n-type semiconductors
has the properties of a diode
Silicon semiconductor diodes approximate the behavior
of ideal diodes but have a conduction voltage of about
0.7 V
There are also a wide range of special purpose diodes
Diodes are used in a range of applications
56. Parameter Germanium Silicon Comments
Depletion layer p.d. 0.15V 0.6V
Germanium can be useful for low
voltage applications.
Forward current
A few milli-
Amperes
Tens of
Amperes
Silicon much better for high
current applications.
Reverse leakage current
A few micro-
amperes
A few nano-
amperes
Germanium 1000 times more
leaky than silicon.
Max. reverse voltage Volts
Hundreds of
volts
Silicon the only real choice for
high voltage applications.
Temperature stability Poor Good
Germanium more sensitive to
temperature. Can be a problem or
can be useful.
Junction capacitance
Very low (point
contact)
Comparativel
y high
This is a useful feature for high
frequency use. Note: low
capacitance silicon diodes are also
available but their capacitance is
still higher than point contact type.
Silicon & Germanium diode Comparison