This document discusses integrated circuit packaging and encapsulation. It describes three options for encapsulation: fully closed, partially closed, and open. Fully closed encapsulation involves filling the package with epoxy to fully protect the chip. Partially closed encapsulation fills select areas for some protection while allowing inspection. Open encapsulation has no filling and exposes the chip for full accessibility but no protection. The seminar presentation aims to provide a case study on these encapsulation methods.

1. HANOI UNIVERSITY OF SCIENCE AND
TECHNOLOGY
Center for Training of Excellent Students
Advanced Training Program
SEMINAR:
IC-PACKAGING
CASE STUDY: ENCAPSULATION
group: Hoàng Văn Tiến
Nguyễn Đình Trung
Phạm Đức Thịnh
Class : MSE-K54

2.  The IC- packaging :
In electronics manufacturing, integrated
circuit packaging is the final stage
of semiconductor device fabrication, in which
the tiny block of semiconducting material is
encased in a supporting case that prevents
physical damage and corrosion.
-Last step : Encapsulation

3.  Several options for encapsulation, providing
the level of protection or accessibility
,include:
 Fully closed
 Partially closed
 Open

4. Fully closed (fully encapsulated)
 Flattened/remolded : fully encapsulated with filled organic
substrate : epoxy, liquid epoxy resin, thin-film…
 Packages are returned to their original mechanical state and
providing test socket compatibility.
 Top glob : fully encapsulated with filled epoxy domed top
surface. Suitable for chip-on-board applications
 Clear encapsulant: Packages are fully encapsulated with non-
filled epoxy and have a domed surface, for bonding
verification, visual samples and optical applications.

5. Partial open cavity
(partially encapsulated)
- Encapsulated with filled epoxy in selected areas
- ideal for circuit repair , visual inspection , emission
studies
- wires partially protected from mechanical damage

6. Open cavity
 Open cavity with frames or lids : no
encapsulation, custom frame around
perimeter of package with removable lid to
protect die and bond wires
 Open Cavity: No encapsulation, die is
exposed for total accessibility . easy of
brobing die and chip.

8. Thank for your
listening