Intel Roadmap for CPUs

1. Public Roadmap
Desktop, Mobile & Server
2H’ 2009
1 2H’09 Public Roadmap

2. Public Roadmap
Desktop Platform
2H’ 2009
2 2H’09 Public Roadmap

3. Desktop Processor: Roadmap
Consumer Platforms 2H’09
Q3’09 Q4’09
Intel® Core™ i7 Processor Extreme Edition
Codename: Tylersburg DT platform
Intel® X58 Express Chipset
- 2x16 or 4x8 graphics
Extreme
Intel® Core™ i7 Processor
Codename: Tylersburg DT platform
Intel® X58 Express Chipset
- 2x16 or 4x8 graphics
Intel® Core™2 Quad Proc.
Q9xxx &Q8xxx series
Codename: Boulder Creek platform
Intel® G45 & P45 Express Chipsets
Best
Intel® Core™2 Duo Processor
E8xxx & E7xxx series
Codename: Boulder Creek platform
Intel® G45, G43, & P43 Express Chipsets
Better
Intel® Pentium® & Celeron® Proc.
Intel® G41 Express Chipset
Intel® G31/P31 Express Chipsets
Good
2H’09 Public Roadmap

4. Desktop Platform: Roadmap
Business Platforms 2H’09
Q3’09 Q4’09
Intel® SIPP Deploy 2008/2009 Platform**
Intel® vPro Tech. for 2009
Intel® Core™2 Quad & Duo proc. Q9000,E8000 series2
Intel® Q45 Express Chipset w/ICH10DO, Intel® TPM
Business Security:
Microsoft NAP, Access Monitor
Proactive IT Care:
Best Intel® Standard Manageability plus: Fast Call for Help,
Remote Schedule Maintenance, Remote Alerts, DASH
Intel® Core™2 Duo Proc. E8000 series
Intel® Q43 Express Chipset w/ICH10D, Intel® TPM
Intel® Standard Manageability
Intel® SIPP
Better
Upgradeable Intel® Pentium® processor1
Intel® B43 Express Chipset w/ICH10D
- Manageability Upgrade Available
Intel® G41 Express Chipset
Intel® G31 Express Chipset
Good
* Qualification window begins at platform launch and continues for 3 months.
** Deployment begins at the end of the Qualification window and continues for 12 months.
1 Intel® Pentium® dual-core proc not SIPP eligible.
2. Check the feature set reference table for vPro and SIPP CPU details.
3. Intel Std. Manageability and Intel AMT support WS-MAN and DASH
4 2H’09 Public Roadmap

5. Public Roadmap
Intel® Mobile Platform
2H’09
5

6. Consumer Mobile Platforms: Roadmap
2H’09
1H’09 2H’09
‘Montevina’ / ‘Montevina Plus’
Intel® Core™2 Extreme
QX9300, X9100
Extreme
‘Montevina’ / ‘Montevina Plus’
Intel® Centrino® 2 processor technology Intel® Centrino® 2 processor technology
Featuring Intel® Core™2 Quad Q9100, Q9000 Featuring Intel® Core™2 Duo T9900, P9700, P8800
Featuring Intel® Core™2 Duo T9800, T9600, T9550,
T9400, P9600, P9500, P8700, P8600, P8400
Intel® Core™2 Duo Small Form Factor processors:
Power-Optimized, Low Voltage, and Ultra Low-Voltage
SP9400, SP9300 SP9600
SL9400, SL9300 SL9600
SU9400, SU9300, SU3300* SU9600, SU3500*
Performance
Mobile Intel GM45, PM45 Express chipsets with ICH9M or ICH9M-Enhanced
®
Mobile Intel® GS45 Express Chipset with ICH9M-SFF-Enhanced
Intel® WiMAX/WiFi Link 5050 Series
Intel® WiFi Link 5000 Series
Intel® 82567LF Gigabit Network Connection
‘Montevina’ / ‘Montevina Plus’
Intel® Celeron® processors
T1700, T1600, 585, 575, 723 900
Mobile Intel® GM45, GL40 Express chipsets with ICH9M
Entry Mobile Intel® GS45 Express Chipset with ICH9M-SFF-Enhanced
Mobile Intel® GS40 Express Chipset with ICH9M-SFF-Enhanced
*Intel® CoreTM 2 Solo processors are eligible for Centrino® branding only
6

7. Business Mobile Platforms: Roadmap
2H’09
1H’09 2H’09
‘Montevina’ / ‘Montevina Plus’
Intel® Core™2 Extreme
QX9300, X9100
Extreme
Intel® SIPP Deploy 2008 Platforms
Intel® Centrino® 2 with vProTM technology Intel® Centrino® 2 with vProTM processor
Featuring Intel® Core™2 Duo T9800, T9600, T9550, technology
T9400, P9600, P9500, P8700, P8600, P8400 Addition of Intel® Core™2 Duo T9900, P9700, P8800
Intel® Core™2 Duo Small Form Factor processors:
Power-Optimized, Low Voltage, and Ultra Low-Voltage
SP9400, SP9300 SP9600
SL9400, SL9300 SL9600
SU9400, SU9300 SU9600
Mobile Intel® GM45 and PM45 Express Chipsets with ICH9M Enhanced
Best Mobile Intel® GS45 Express Chipsets with ICH9M-SFF-Enhanced
Intel® WiMAX/WiFi Link 5050 Series, Intel® WiFi Link 5000 Series
Intel® 82567LM Gigabit Network Connection
Intel® AMT 4.X, Intel® Anti-Theft Technology (AT), Intel® Virtualization,
Technology (VT-x, VT-d), Intel® Trusted Execution Technology (TXT)
Intel® Centrino®2 processor technology Intel® Centrino®2 processor technology
Featuring Intel® Core™2 Duo processors Addition of Intel® Core™2 Duo processors
Mobile Intel® GM45 and PM45 Express Chipsets with ICH9M or
ICH9M-Enhanced
Mobile Intel® GS45 Express Chipsets with ICH9M-SFF-Enhanced
Better Intel® WiMAX/WiFi Link 5050 Series, Intel® WiFi Link 5000 Series
7

8. Intel® Server Platform Group (SPG)
Public Roadmap
2H 2009
8

9. Legal Disclaimer
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ARISING FROM PRODUCT INFRINGEMENT OR PRODUCT WARRANTY.
• Intel may make changes to specifications and product descriptions at any time, without notice.
• “Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel® Turbo Boost Technology
performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system
delivers Intel Turbo Boost Technology. For more information, see http://www.intel.com/technology/turboboost.”
• Intel® Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS
and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which
processors support HT Technology, see here
• Intel Virtualization Technology requires a computer system with a processor, chipset, BIOS, virtual machine monitor (VMM) and applications enabled for
virtualization technology. Functionality, performance or other virtualization technology benefits will vary depending on hardware and software
configurations. Virtualization technology-enabled BIOS and VMM applications are currently in development.
• Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different
processor families. See www.intel.com/products/processor_number for details.
• Intel, processors, chipsets, and desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
• 64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications
enabled for Intel® 64 architecture. Performance will vary depending on your hardware and software configurations. Consult with your system vendor for
more information.
• Intel, Intel Xeon, Intel Core microarchitecture, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the
United States and other countries.
• Lead-free: 45nm product is manufactured on a lead-free process. Lead is below 1000 PPM per EU RoHS directive (2002/95/EC, Annex A). Some EU
RoHS exemptions for lead may apply to other components used in the product package.
• Halogen-free: Applies only to halogenated flame retardants and PVC in components. Halogens are below 900 PPM bromine and 900 PPM chlorine.

10. Risk Factors
Intel’s Roadmap Update presentations may contain
forward-looking statements and projections.
All statements and projections made that are not
historical facts are subject to a number of risks and
uncertainties, and actual results may differ
substantially.
Please refer to our recent Earnings Release and Form
10-Q for more information on the Risk Factors that
could cause actual results to differ.
10

11. Mission Critical (MC) Platform Roadmap
2009
Q1 ’09 Q2 ’09 Q3 ’09 2010
Q4 ’09
Next Generation Intel® Itanium®
Intel® Itanium® Platform Server Platform
(codename Boxboro-MC)
Intel® Itanium® processor 9100 series Next-generation Intel® Itanium® processor
Intel® E8870 Chipset — 400FSB, Intel® 82801DB (ICH4) (Tukwila*)
Boxboro-MC Chipset
Technologies
Technologies
FSB 667, DDR2-667, Quad-Core
Dual-Core, Intel® QuickPath Interconnect ,
Hyper-Threading Technology, Dual Integrated Memory Controllers
Mission
Critical Intel® Virtualization Technology,
Intel® Cache Safe Technology. IA-64,
Demand Based switching,
Core Level Lockstep
* Tukwila production targeted to Q1 ’10
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and
are subject to change without notice.
2

12. Expandable Server (EX) Platform Roadmap
2009 2010
Caneland Platform Next Generation Expandable Platform
(codename Boxboro-EX )
Intel® Xeon® processor 7400 series 45 nm 6-core Next-generation Intel® Xeon® processor
(Dunnington) (Nehalem-EX* )
Intel® Xeon® processor 7300 & 7200 series
Intel® 7300 Chipset
Enabled chipsets -4P/8P+ platforms Boxboro-EX Chipset
Technologies
Expandable Quad-Core, Dual-Core, Technologies
Up to 8 cores /16 Threads
Intel® Core™ Microarchitecture, 24MB Shared Cache
Dedicated High-Speed Interconnects (DHSI), Integrated Memory Controllers
FBDIMM Memory Technology, Intel® Turbo Boost
Intel® VT, Intel® Hyper-Threading
Next Generation Intel® I/OAT,
64 MB Snoop Filter
* Nehalem-EX on track for 2H ‘09 production
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are
subject to change without notice.
12

13. Efficient Performance (EP) Platform Roadmap
2009 2010
Intel ® Xeon® 5500 Platform (previously Tylersburg-EP)
Intel ® Xeon® processor 5500 series Next-generation Intel ® Xeon® processor
(Nehalem-EP) (Westmere-EP*)
Intel® 5520 Chipset Intel® 5520 Chipset
Technologies Technologies
Quad-Core / Dual Core Up to 6 cores/12 Threads
Efficient
Performance DDR3 1333/1066/800 memory Improved Energy Efficiency
Two Socket
Intel® Turbo Boost Technology, Cache Enhancements
Intel® VT
Intel® QuickPath Interconnect (QPI)
Intel® Hyper-Threading Technology
Lead and halogen free platform kit1
* Westmere-EP available in 2010
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to
change without notice.
1.Lead and Halogen free kit includes Intel® Xeon® family CPU, Intel® Chipsets, and Intel® LAN components.
13 Note:45nm product is manufactured on a Lead Free process. Lead-free per EU RoHS directive July, 2006. Some E.U. RoHS

14. Entry Server (EN) Platform 2009 Roadmap
1H ‘09 2H ‘09
Intel ® Xeon® 5500 Platform (previously Tylersburg-EN)
Intel ® Xeon® processor 5500 series
(Nehalem–EP)
Intel® 5500 Chipset
Intel® Core™ Microarchitecture
(codename Penryn)
Entry Intel® Xeon® processor 5400 series
Two Socket
Intel® Xeon® processor 5200 series
Intel® 5100 Chipset (previously San Clemente)
Intel® 5000V Chipset (previously Blackford)
Intel® Core™ Microarchitecture Next Generation (Intel® Microarchitecture
(codename Merom & Penryn) codename Nehalem) Platform
Intel® Xeon® processor 3300 series Next-generation Intel ® Xeon® processor
Intel® Xeon® processor 3100 series (Lynnfield*)
Intel® Xeon® processor 3200 series
Intel® Xeon® processor 3000 series Intel® 3400/3420 Chipset
Intel® 3210/3200 Chipset
Entry
One Socket
*Lynnfield processor production targeted for 2H ’09
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to
Change without notice.
14

15. Workstation (WS) Platform Roadmap
2009 2010
Intel ® Xeon® 5500 Platform (previously Tylersburg-WS )
Intel ® Xeon® processor 5500 series Next-generation Intel ® Xeon® processor
(Nehalem-WS) (Westmere-WS*)
Intel® 5520 Chipset
Workstation
Two Socket
Intel ® Xeon® 3500 Platform (previously Tylersburg-WS )
Intel ® Xeon® processor 3500 series Next-generation Intel ® Xeon® processor
(Nehalem-WS) (Westmere-WS*)
Intel® X58 Express Chipset
Intel® Core™ Microarchitecture Next Generation (Intel® Microarchitecture
(codename Merom & Penryn) codename Nehalem ) Platform
Intel® Core™2 processor series Next-generation Intel® Xeon® processor
Intel® X38 Express Chipset (Lynnfield)
Ibex Peak Chipset**
Workstation
One Socket
* Westmere processor available in 2010
** Ibex Peak chipset for Lynnfield-based Workstations targeted for production in 2H’09
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are
15subject to change without notice.