Presentation of mobile computer module concept at first MIPI Developers Conference

1. MIPI
Beyond Mobile
Industrial
Computer-on-Module Case
Study
Nikola Nenadić,
pygmyTITAN

2. “Industrial Mobile” Market
•! Non-consumer applications of mobile technology
•! Potential to disrupt a number of industries
•! Medical, robotics, instrumentation, retail, logistics &
transportation, emerging markets (VR/AR, IoT, drones)
•! People are already doing it…
2
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3. Market Forecasts by 2020
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4. Benefits of Mobile Technology
• Driven by smartphone form factor
• Low power, small form factor
• Latest ARM processor architectures
• Superior video processing with hardware acceleration
• Integrated signal processing capability
• Integrated radio (cellular, Wi-Fi, BT)
• Advanced power management
• Pervasive technology (over 2 billion devices)
• Rich mobile software application ecosystem
4

5. The Most Popular Invention in History
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6. Mobile Application Space is Huge
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7. ARM Landscape is Changing
• Mobile ARM market consolidation is in progress
• A number of suppliers left the mobile market recently
(TI, Nvidia, Broadcom, Marvell, Intel)
• Only pure play mobile suppliers stay in the game
(Qualcomm, Samsung, MediaTek, HiSilicon)
• Disproportion: $400B1 mobile vs. $25B2 embedded
• Budgets for innovation in mobile are much bigger
• Reduced supply of high-end ARM platforms for
embedded
! Growing pressure to employ consumer mobile
SoCs in embedded applications
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1) Global revenue from smartphone sales in 2016, GfK; 2) Embedded Boards and Integrated computer systems market size in 2018, VDC Research, 2016

8. Key Obstacle for Industrial Mobile
• Pure play mobile suppliers are focused on
a small number of high volume customers
• Embedded systems market is highly fragmented,
with thousands of different clients and applications
• Mobile components are short-lived,
driven by consumer market dynamics
! Mobile technology stays inaccessible
for embedded developers
8

9. Lesson from the Past – Industrial PC
• In the early 90’s technology landscape was similar
• There were 18 manufacturers of x86 processors
• IBM PC’s commercial success accelerated
development and consolidated the market
• Latest innovations were becoming cheap
• Pressure to use commercial PC technology
in industrial applications was rising
• 1992 – PC/104 Consortium
• 2005 – COM Express (PICMG)
• $3.5B1 market today
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1) IMS Research, 2011

10. Consumer vs. Industrial Applications
Consumer Products:
• Fast time to market
• Large volumes
• No customization
• Price pressure
• Short product lifetime
Industrial Devices:
• Slower adoption rate,
regulatory approvals
• Low and medium volumes
• Tailored solutions
• Relaxed price margins
• Expected longevity
(> 5 years)
• Multi-vendor sourcing
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11. Mobile Computer-on-Module
• Smartphone electronics packed in a component
• Open architecture
• Standardized form factor and pinout
! Solves longevity issue, enables multi-vendor sourcing
• Modular approach – reduced complexity & risk
• Building products on mainstream mobile technology
! Compatibility & continuous access to the latest innovations
• Standardization of interfaces inside smartphones
makes mobile COM possible
! Key role of MIPI Alliance
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12. Mobile Form Factor
• Smartphone main boards takes approx. the same area
• High level of integration, small thickness
• Power consumption: up to 3 W
• Mobile COMs can be made small and thin,
enabling smartphone-like industrial mobile devices
• Heat dissipation, EMC/EMI, RF shielding
12

13. How We Did It
• PCB area: 21.6 cm2
• Total thickness: 5 mm
• Integrated heat spreader, EMC/EMI and RF shielding
13

14. Mobile COM Module Pinout
•! Mobile by its nature: based on MIPI interfaces
•! No power hungry/legacy industrial PC interfaces
(Ethernet, PCIe, SATA)
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Widely used mobile interfaces:
•! MIPI Display Serial Interface
(DSI + LCD control)
•! MIPI Camera Serial Interface (CSI + CCI)
•! Universal File Storage (UFS + card signals)
•! HSIC
Smartphone external interfaces:
•! USB 2.0 / USB 3.0
•! HDMI
Integrated radio:
•! Cellular
•! Wi-Fi
•! Bluetooth, NFC
Legacy mobile interfaces:
•! SD Card, SDIO
Audio, sensors and control:
•! Audio (MIPI SLIMbus/MIPI SoundWire/I2S)
•! MIPI I3C, VGI
High-Performance:
•! MIPI UniPort-M or M-PCIe?
Embedded Interfaces:
•! UART, SPI, I2C, GPIO
Auxiliary Interfaces:
•! SIM card, JTAG, boot selection,
power management, system management
?

15. Mobile COM System Block Diagram
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16. Mobile vs. PC COMs
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Feature Industrial Mobile Industrial PC
CPU architecture: dominantly ARM dominantly x86
Board size: 12.5–25 cm2 45–90 cm2
Power consump?on: < 3 W 6-55 W
Integrated radio: " #
Ba]ery power manag.: " #
So^ware: Android/Linux Windows/Linux
Total system price: low high

17. Mechanical and Thermal Considerations
• Connector solution
! Low mating height
! High density
! 250-400 signal pins
• Mobile use cases
! Constrained space inside device
! Power dissipation
! Mechanical robustness
! Low weight
• Maintenance and servicing
! Easy module replacement
! Easy device upgrade
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An example – pygmyTITAN solu?on

18. Mobile COM Ecosystem Challenges
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• Industrial Mobile ecosystem do not exist today
• The idea is to take components and know-how
directly from consumer mobile
• Ease technology transfer by implementing mobile
standards without any changes
• SoCs, ICs, displays, cameras, sensors,
mechanical components suppliers
– should have no extra effort
• Unified Industrial Mobile software architecture is
needed to ensure compatibility and enable re-usage
of commercial mobile applications

19. The Winner is Clear
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20. Software and Security
• Android is the winner of platform wars
• Embedded Android variant is needed
for Industrial Mobile to succeed
• Part of AOSP or middleware extension?
• Plug and play functionality, dynamic driver loading
• Mobile and IoT applications – security is key concern!
• Security Architecture should be
integral part of COM platform specification
• Hardware root of trust, secure boot, Trusted Zone
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21. Conclusions & Recommendations
• Open architecture COM module standards facilitate
usage of mobile technology in industrial sector
• Mobile is enabling technology for a number of
non-consumer applications with high-growth potential
• Mobile industry is positioned well to capture significant
part of the industrial market in the future
• PICMG led the effort for the Industrial PC
• MIPI Alliance should lead it for the Industrial Mobile
• Mobile computing module standard,
security architecture, and embedded Android
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22. To learn more, visit our exhibit
in Grand Hall during the conference

23. Thank you for
your time!
Any questions?
Nikola Nenadic
Founder & CEO, pygmyTITAN
nikola.nenadic@pygmyTITAN.com