TonyC Chen
2 SlideShares 2 Followings
Personal Information
Organization / Workplace
New Taipei City, Taiwan Taiwan
Occupation
Sr. Package Engineer at VIA Labs, Inc.
Industry
Electronics / Computer Hardware
About
Well in communication in heterogenization working conditions. Proactive with different teams and backgrounds to figure scientific paths to set the design into production. Experienced in IC substrate surface finish process development, package assembly, and now as packaging engineer specified in high speed IC packaging design in USB 3.0/3.1 and Type-C application. Based on leadframe design into MP in OSATS. Easy going and proactive in learning new ideas and knowledge. Currently looking for new technology packaging engineering field. QUALIFICATION HIGHLIGHTS or TECHNICAL EXPERTISE • Experienced in develop FC+WB CSP hybrid substrate for Nokia mobile platform use. • Experienc
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Tags
親子;手機;
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Presentations

(2)

手機搶走了孩子多少的愛！

8 years ago • 309 Views

家庭教育

8 years ago • 560 Views
Personal Information
Organization / Workplace
New Taipei City, Taiwan Taiwan
Occupation
Sr. Package Engineer at VIA Labs, Inc.
Industry
Electronics / Computer Hardware
About
Well in communication in heterogenization working conditions. Proactive with different teams and backgrounds to figure scientific paths to set the design into production. Experienced in IC substrate surface finish process development, package assembly, and now as packaging engineer specified in high speed IC packaging design in USB 3.0/3.1 and Type-C application. Based on leadframe design into MP in OSATS. Easy going and proactive in learning new ideas and knowledge. Currently looking for new technology packaging engineering field. QUALIFICATION HIGHLIGHTS or TECHNICAL EXPERTISE • Experienced in develop FC+WB CSP hybrid substrate for Nokia mobile platform use. • Experienc
Tags
親子;手機;
See more