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Micro-Electro-Mechanical Systems -The Future Technology, but Today’s choice Presented by… Vinayak Hegde Guide: Mrs. Priti M
AIM OF MY PRESENTATION ,[object Object],[object Object],[object Object]
Outline of My Presentation ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Introduction ,[object Object],[object Object],[object Object]
Introduction   Conti… ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
MEMS Scaling
Building Blocks In MEMS ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
MEMS Deposition Technology ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
MEMS Lithography Technology ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
MEMS Etching Technology ,[object Object],[object Object],[object Object]
Microfabrication Process
Photolithography ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Photolithography
Additive Processes Oxidation Thermal Oxidation of Silicon is done in a furnace in wet or dry conditions
Additive Processes Doping Dopants  : N type (Phosphorous, Arsenic), P type (Boron) ,[object Object],[object Object],Dopants are diffused thermally into the substrate in furnace at 950 – 1280  0 C.  It is governed by Fick’s Laws of Diffusion. Dopant ions bombarded into targeting substrate by high energy. Ion implantation are able to place any ion at any depth in sample. 2.  Ion Implantation
Additive Processes Physical Vapor Deposition (PVD) 1. Evaporation Deposition is achieved by evaporation or sublimation of heated metal onto substrate. 2. Sputtering Sputtering is achieved by accelerated inert ion by DC drive in plasma through potential gradient to bombard metallic target. Then the targeting material is sputtered away and deposited onto substrate placed on anode.
Additive Processes Physical Vapor Deposition (PVD)
Additive Processes Chemical Vapor Deposition (CVD) ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Subtractive Processes Dry Etching ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Subtractive Processes Reaction Mechanism Produce reactive species in gas-phase  Reactive species diffuse to the solid Adsorption, and diffuse over the surface  Reaction  Desorption  Diffusion Dry Etching Plasma Etching
Subtractive Processes Dry Etching Deep Reactive Ion Etching (DRIE)   A very high-aspect-ratio silicon etch method DRIE Etched Pillars
Subtractive Processes Wet Etching Isotropic Wet Etching Isotropic etchants etch in all directions at nearly the same rate. Commonly use chemical for Silicon is  HNA (HF/HNO 3 /Acetic Acid) This results in a finite amount of undercutting
Subtractive Processes Wet Etching Anisotropic Wet Etching Anisotropic etchants etch much faster in one direction than in another. Etchants are generally Alkali Hydroxides (KOH, NaOH, CeOH Reaction  : Silicon (s) + Water + Hydroxide Ions -> Silicates + Hydrogen
Metal Patterning
Surface Micromachining
MEMS Packaging
Example:  An insulin pump fabricated by classic MEMS technology   1. Pumping membrane 2. Pumping chamber 3. Inlet 4. Outlet 5. Large mesa 6. Upper glass plate 7. Bottom glass plate 8. patterned thin layer (for improved fluidics)
MEMS Applications ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
iPod Touch: Techno  Sensitiveness ,[object Object],[object Object],[object Object],[object Object]
An implantable blood pressure sensor developed by CardioMEMS Bio MEMS Application
MEMS Memory [Nanochip]
MEMS driven Storage Devices ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Future of Magnetic Storage ,[object Object],[object Object],[object Object],[object Object]
Advantages and Disadvantages ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Conclusion ,[object Object],[object Object],[object Object]
References for MEMS ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Thank You

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Mems (Detail Presentation)

  • 1. Micro-Electro-Mechanical Systems -The Future Technology, but Today’s choice Presented by… Vinayak Hegde Guide: Mrs. Priti M
  • 2.
  • 3.
  • 4.
  • 5.
  • 7.
  • 8.
  • 9.
  • 10.
  • 12.
  • 14. Additive Processes Oxidation Thermal Oxidation of Silicon is done in a furnace in wet or dry conditions
  • 15.
  • 16. Additive Processes Physical Vapor Deposition (PVD) 1. Evaporation Deposition is achieved by evaporation or sublimation of heated metal onto substrate. 2. Sputtering Sputtering is achieved by accelerated inert ion by DC drive in plasma through potential gradient to bombard metallic target. Then the targeting material is sputtered away and deposited onto substrate placed on anode.
  • 17. Additive Processes Physical Vapor Deposition (PVD)
  • 18.
  • 19.
  • 20. Subtractive Processes Reaction Mechanism Produce reactive species in gas-phase Reactive species diffuse to the solid Adsorption, and diffuse over the surface Reaction Desorption Diffusion Dry Etching Plasma Etching
  • 21. Subtractive Processes Dry Etching Deep Reactive Ion Etching (DRIE) A very high-aspect-ratio silicon etch method DRIE Etched Pillars
  • 22. Subtractive Processes Wet Etching Isotropic Wet Etching Isotropic etchants etch in all directions at nearly the same rate. Commonly use chemical for Silicon is HNA (HF/HNO 3 /Acetic Acid) This results in a finite amount of undercutting
  • 23. Subtractive Processes Wet Etching Anisotropic Wet Etching Anisotropic etchants etch much faster in one direction than in another. Etchants are generally Alkali Hydroxides (KOH, NaOH, CeOH Reaction : Silicon (s) + Water + Hydroxide Ions -> Silicates + Hydrogen
  • 27. Example: An insulin pump fabricated by classic MEMS technology 1. Pumping membrane 2. Pumping chamber 3. Inlet 4. Outlet 5. Large mesa 6. Upper glass plate 7. Bottom glass plate 8. patterned thin layer (for improved fluidics)
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  • 30. An implantable blood pressure sensor developed by CardioMEMS Bio MEMS Application
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